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 Neurophos Photonic AI Test Chip Hits 300 TOPS/W  - AI chip startup Neurophos has demonstrated its metasurface based optical compute modulators in silicon The post Neurophos Photonic AI Test Chip Hits 300 TOPS/W appeared first on EE Times .

 Brewer Science Expands U.S. Operations with New Chandler, Arizona Office and Lab  - Brewer Science Expands U.S. Operations with New Chandler, Arizona Office and Lab Collaboration with semiconductor customers and research partners, access to talent among key considerations CHANDLER, Arizona. – September 23, 2025 – Brewer Science, Inc., a global leader in developing and manufacturing...

 Apple iPhone Air Unboxing  - The new Apple iPhone Air — Apple’s slimmest iPhone yet at 5.62 mm, featuring the A19 Pro processor, N1 connectivity chip, and updated C1X modem. Explore TechInsights’ ongoing analysis of the iPhone Air.

 Simplified PicoScope control by Python  - Pico Technology has released a Python package designed to simplify the use of its PicoScope 6000E and 3000E Series USB oscilloscopes. Called pyPicoSDK and built on its the existing PicoSDK, the package assists users to create Python scripts that control PicoScope devices. “We created pyPicoSDK to make...

 CEA-Leti and CRHEA present step toward full-color AR/VR micro-displays at MicroLED Connect Conference  - Record-setting red emission from InGaN quantum wells being presented at MicroLED Connect Conference

 Interstitial nanofilament pathway reduces energy consumption in memristors  - Molecular crystals with interstitial filaments enable memristors with zeptojoule-level switching energy and over one billion switching cycles, offering a scalable path to energy-efficient and reliable in-memory computing.

 [News] TSMC Reportedly Raising N3P Prices 20% Ahead of 2nm Era, Pressuring Qualcomm and MediaTek  - Apple has recently unveiled its iPhone 17 series, featuring the A19 chip built on TSMC’s N3P process. The next-generation A20 will move into the 2nm era. According to Wccftech, citing China Times, sources say that since mobile chips are expected to enter 2nm next year, prices for 3nm “N3P” wa......

 Dutch laser chip finds ways to Austrian AR light engine  - Dutch laser chip firm Brilliance and Austrian photonics startup Vitrealab have announced a partnership to create more compact, efficient and high-performance light engines for the next generation of AR smart glasses and related applications.

 Credo AECs  - Why Active Electrical Cables are a Billion Dollar Industry, and why Credo is Dominant.

 AI engineers nanoparticles for improved drug delivery  - Biomedical engineers at Duke University have developed a platform that combines automated wet lab techniques with artificial intelligence (AI) to design nanoparticles for drug delivery. The approach could help researchers ...

 The Next-Generation UCIe IP Subsystem for Advanced Package Designs  - With the rapidly increasing connectivity demands driven by AI/ML and HPC/data center…

 Intel® Xeon 6® Processors: Delivering High Throughput and Low Latency with Data Center LLMs  - When optimizing LLM workloads, hardware is only one piece of the equation. Intel brings decades of experience working with software developers, building a strong ecosystem to optimize software for Int...

 Blog posts  - What a week! From September 15–18, we had the pleasure of joining the micro- and nanofabrication community at the 51st International Micro and Nano Engineering Conference (MNE 2025) in Southampton, UK.

 Thermal gel for long-term vertical joint use  - Parker has introduced a thermal gel for rugged vertically-oriented applications. This single-component material “passed automotive vertical slump testing”, according to the company. “The fully cured product performs reliably in vertical and high-vibration applications, including those that are mission-critical....

 Mitigating Warpage In Multi-Chiplet Systems  - Multi-physics simulation and new reflow options help keep a lid on warpage. The post Mitigating Warpage In Multi-Chiplet Systems appeared first on Semiconductor Engineering .

 Apple’s Thinnest iPhone Still Stands Up to Repairs  - To be honest, we were holding our breath for the iPhone Air. Thinner usually means flimsier, harder to fix, and more glued-down parts. But the iPhone Air proves otherwise. Apple…

 CEO Interview with Barun Kar of Upscale AI  - Barun Kar is CEO of Upscale AI. He is also the co-founder of Auradine and previously served as COO. Barun has over 25 years of experience leading R&D organizations to deliver disruptive products and solutions, resulting in multi-billion-dollar revenue. Barun was on the founding team at Palo Alto Networks...

 PDFS Expands Services with Major Semiconductor Manufacturer Agre  - GuruFocus

 onsemi to Acquire Vcore Power Technology from Aura Semiconductor to Strengthen AI Data Center Leadership

 Will Camtek’s (CAMT) Bold Debt Raise Accelerate Its Push Into AI-Driven Semiconductor Inspection?

 onsemi Acquires Aura Semiconductor’s Vcore Power Technologies

 Picture This: Mainland China Launches Review of US Semiconductor Exports

 Intel vs TSMC: The High-Stakes Chip Stock Showdown of 2025 and Beyond

 Micron's Bullish AI Outlook Ignites Semiconductor Sector Amidst Soaring Expectations

 Here's Why Semiconductor ETFs Are Hitting 52-Week Highs

 4 Ways TSMC Makes Its Money

 ON Semiconductor (ON) Acquires Vcore Technology from Aura Semico

 4 Ways TSMC Makes Its Money

 Lattice semiconductor CAO Stevens sells $257k in shares

 Micron's AI-Fueled Earnings Shatter Expectations, Igniting Semiconductor Super Cycle

 Lattice to Showcase AI Datacenter and Future-Ready Security Solutions at OCP Global Summit

 Huawei Appears to Lurk Behind Chinese Firms’ Chip IPOs, as a Top Customer No One Names

 Here's Why Semiconductor ETFs Are Hitting 52-Week Highs

 Porsche's EV cancellations, Oura's $10.9b valuation, Empower's semiconductor raise

 onsemi acquires Aura Semiconductor's Vcore Power Technologies

 CFRA raises Lattice Semiconductor stock price target to $85 on growth prospects

 Better Artificial Intelligence Stock: ASML vs. Taiwan Semiconductor

 After Positive Q4 Earnings, Micron Momentum Strong

 Lattice Semiconductor to exhibit AI datacenter solutions at OCP summit

 Engineers develop a magnetic transistor for more energy-efficient electronics

 PDF Solutions Soars 14% on Landmark Semiconductor Contract and Robust 2025 Outlook

 Navitas Semiconductor (NVTS) Is Up 17.2% After Winning Nvidia Data Center Chip Deal Has The Bull Case Changed?

 How Will Taiwan's Export Ban on Semiconductors Affect South African Companies?

 China's latest GPU arrives with claims of CUDA compatibility and RT support — Fenghua No.3 also boasts 112GB+ of HBM memory for AI  - Innosilicon has announced its latest flagship GPU on board the Fenghua No.3 graphics card.

 Innovative transistor design offering advantages for controlling and reading quantum chips  - The smaller electronic components become, the more complex their manufacture becomes. This has been a major problem for the chip industry for years. At TU Wien, researchers have now succeeded for the first time in manufacturing ...

 SiTime Has Unleashed its Titan MEMS Resonators (Be Afraid, Be Very Afraid)  - Apropos of nothing at all, I just read a definition of “engineer” that struck a chord. I understand that this was one of five options submitted to EE Times by their readers many moons ago. The definition in question reads as follows: “An engineer is someone who takes the creativity of an artist,...

 Analog computing platform uses synthetic frequency domain to boost scalability  - Analog computers, computing systems that represent data as continuous physical quantities, such as voltage, frequency or vibrations, can be significantly more energy-efficient than digital computers, which represent data ...

 Michigan University quantum testbed opens remote access for researchers  - The University of Michigan (U-M) has launched a quantum testbed that links two campus labs via optical…

 Research Bits: Sept. 23  - Neuromorphic computing: Opto-electrical excitation of MTJs; nanofluidic memristors; droplets play tic-tac-toe. The post Research Bits: Sept. 23 appeared first on Semiconductor Engineering .

 MAX® 10 FPGA New Packages: Up to 59% Higher I/O Density vs. Competitors  - Altera has begun production shipments of its new MAX® 10 FPGA package options, featuring Variable Pitch Ball Grid Array (VPBGA) technology. These new package options bring big benefits to designers wo...

 Tech war: Huawei’s computing cluster to power AI projects, challenge US platforms  - Huawei’s latest computing systems reflect its increased confidence in designing advanced chips to power AI development projects

 Inclusive, sustainable tech careers day in London  - The third annual #BeMedigitalinclusion Sustainable Tech Careers event will take place in London on 10 October. Organised by Academy Achievers, the event is designed to encourage young women and girls to pursue technology-based careers. This year, there will be the first #BeMe Introductory AI Chip & Semiconductor...

 New method for making graphene turns defects into improvements  - Recent research has found a new way to make graphene that adds structural defects to improve the performance of the material that could have benefits across a range of applications—from sensors and batteries, to electronics.

 Tech war: Huawei’s AI chip road map bolsters China’s tech self-sufficiency efforts  - US-sanctioned Huawei shows it can match Nvidia’s multi-year chip road map, Interconnected Capital’s Kevin Xu says

 Latest issue of Semiconductor Today now available  - For coverage of all the key business and technology developments in compound semiconductors and advanced silicon materials and devices over the last month, see latest magazine

 Deploying two-dimensional memristors on chip  - Two studies demonstrate wafer-scale synthesis of hexagonal boron nitride memristors compatible with CMOS technology and introduce opto-reconfigurable devices for broad-spectrum neuromorphic applications.

 Cadence at the TSMC OIP: Pioneering the Future of Semiconductor Design  - The semiconductor industry stands at a pivotal moment. As we push toward more advanced…

 Inference AI Driving Structural Shifts in High-Capacity Storage, Nearline SSD Demand Surges, Says TrendForce  - TrendForce’s latest findings indicate that over the next two years, AI infrastructure will mainly focus on high-performance inference services. As traditional high-capacity HDDs face significant shortages, CSPs are increasingly sourcing from NAND Flash suppliers, boosting demand for nearline SSDs designed...

 This week’s outside five sigma (#65)  - Random Speckle Spectrometers in Photonics

 High Bandwidth Flash: NAND\u2019s Bid for AI Memory  - Can HBF be a new memory tier for AI workloads? Where its limits will show, and what are use-cases for a high capacity memory thats slower than HBM or GDDR.

 Thalia and X-FAB Forge Strategic Partnership to Safeguard Supply and Accelerate IP Migration  - Thalia Design Automation, a leader in analog, mixed-signal and RF IP migration solutions, today announced a strategic partnership with X-FAB, the world’s leading…

 The Long Strange Trip from Silica to Smartphone  - Three continents, 30,000 kilometers, and 2,000-degree reactors

 A Simple Test Strip That Reveals the Invisible Nanoplastic Threat  - Researchers at the University of Stuttgart have created an “optical sieve” capable of detecting minute nanoplastic particles. Functioning much like a test strip, this innovation is designed to provide a new analytical tool for environmental and health research. Researchers from the University of Stuttgart...

 Viewpoint: Electronics are everywhere. circularity should be too  - Circularity, once viewed as an end-of-life product concern, is emerging as a powerful lever for extending their useful life, writes Dr John W Mitchell. Smart rings that track your sleep and heart rate, advanced robotics enabling precision surgery, solid-state batteries set to transform how we store power...

 Samsung reportedly struggles with HBM4 yields as SK Hynix leads memory race  - Samsung is betting on advanced 1c DRAM-based HBM4 technology but remains constrained by 35% yields, while SK Hynix relies on stable production and Nvidia's trust to defend its lead. As Nvidia readies its Vera Rubin AI platform and tests cheaper GDDR7 alternatives, the rivalry between Korea's memory giants...

 [News] MediaTek Reportedly Eyes U.S. Production with TSMC; Dimensity 9500 Targets Apple A19 Pro  - According to Nikkei, MediaTek may produce some chips at TSMC’s Arizona plants, a plan Corporate Vice President JC Hsu said is still under consideration and could involve automotive products or other “sensitive” applications. This marks the first time MediaTek has signaled plans to join TSMC...

 Infographic: MediaTek Dimensity 9500  - Super powerful yet incredibly cool, the MediaTek Dimensity 9500 is an elite fusion of groundbreaking technologies that deliver unmatched performance, stunning graphics, and advanced intelligence right to your fingertips.

 Coherent Unveils a family Of Integrated Circuits for next-generation optical transceivers  - Coherent announced a new family of quad-channel integrated circuits that enable faster, more efficient optical transceivers for cloud, AI, and telecom networks.

 MediaTek reportedly mulling US chip production — could use TSMC's Arizona fab to avoid tariff fallout  - MediaTek is in talks with TSMC to manufacture certain chips at its Arizona fab to satisfy U.S. customer demands and potentially avoid tariffs.

 Yes Intel Should Go Private  - Lip-Bu Tan started as Intel CEO on March 18 th of this year and some very impressive changes have already taken place. Intel started the year with more than 100,000 employees and will finish the year with around 75,000. Reporting structures have been flattened and the Intel culture is being transformed...

 AIXTRON achieves 100th G10-SiC Shipment Milestone  - EQS-Media / 22.09.2025 / 07:30 CET/CEST AIXTRON achieves 100th G10-SiC Shipment Milestone Herzogenrath, September 22nd, 2025 – AIXTRON SE (FSE: AIXA) ships its 100th G10-SiC system. This milestone underscores the strong market demand in AIXTRON’s G10-SiC epitaxy batch technology over the last 3

 Imec advances single-patterning capabilities of high-NA litho  - Imec again reports progress in high-NA EUV lithography, showing single-patterned damascene structures at 20nm pitch and 13nm tip-to-tip (T2T) dimensions.

 Using digital twins to consolidate future embedded systems  - Last year, the French government tasked the CEA with coordinating an avant-garde research program ("Recherche à Risque” program funded by France 2030 to the tune of €40 million for 2024) in collaboration with all its academic partners. The "Audace!” program aims to stimulate researchers’ creativity...

 Okmetic CTO Atte Haapalinna giving speech at the 2025 International RF-SOI Workshop  - We’re excited to announce our participation in the 2025 International RF-SOI Workshop on September 25-26 at the Pudong Shangri-La hotel in Shanghai. This workshop will focus on the future of RF-SOI technology and its impact on mobile, IoT, and Machine-to-Machine communication. Okmetic CTO Atte Haapalinna...

 Startup To Take On AI Inference With Huge SiP, Custom Memory  - Euclyd, based in The Netherlands, aims to build a large multi-chiplet design for AI inference at scale The post Startup To Take On AI Inference With Huge SiP, Custom Memory appeared first on EE Times .

 Hybrid relay basics: Why engineers are switching smarter  - Hybrid relays combine a mechanical switch with a solid-state switch, and they are set up in parallel to control a single load. The post Hybrid relay basics: Why engineers are switching smarter appeared first on Planet Analog .

 [News] TSMC 2nm Customer Surge: 15 Clients Reportedly Secured, 10 in HPC  - As TSMC’s 2nm mass production countdown begins, speculation mounts over its major clients. KLA, a key chipmaking equipment supplier, reports that around 15 customers are designing at the N2 node, including roughly 10 high-performance computing (HPC) players, according to Investing.com, etnews and ......

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