TSMC symposium spotlights AI expansion, advanced packaging demand - TSMC held its annual technology symposium in Hsinchu on May 14, 2026, after its North America stop, with executives noting that AI applications are rapidly expanding from cloud data centers to edge devices — driving surging demand for semiconductor compute density, high-bandwidth connectivity, power...
Why Vision LLMs Force A Rethink Of Edge AI Hardware - Peak TOPS is becoming a weaker proxy for delivered edge performance. The post Why Vision LLMs Force A Rethink Of Edge AI Hardware appeared first on Semiconductor Engineering .
Configurable xSPI memory controller IP core is FuSa-ready - SPI, invented some four decades ago, is so successful as a low-pin-count interface for microcontrollers and processor cores that it spurred memory makers to incorporate both the physical signaling interface and advanced memory command protocols into serial flash and serial pseudo-SRAM (PSRAM) devices....
4D vision platform enhances perimeter monitoring - Eyeonic Vista from SiLC is a high-resolution vision system that accurately detects and classifies small targets at distances exceeding 1 km. The post 4D vision platform enhances perimeter monitoring appeared first on EDN .
Successful AIXTRON SE Annual General Meeting 2026: all resolutions approved - EQS-Media / 13.05.2026 / 15:15 CET/CEST Successful AIXTRON SE Annual General Meeting 2026: all resolutions approved Herzogenrath, Germany, May 13, 2026 – AIXTRON SE (FSE: AIXA) The shareholders of AIXTRON SE (FSE: AIXA) today approved all resolutions presented by the Executive Board and Supervisory...
Decarbonizing Hydrogen for Transport and Energy Applications - The multi-faceted world of blue and green hydrogen types includes varying production routes, fuel cell applications, and a wider presence across many decarbonization technologies. This article covers some of the main current developments happening with hydrogen.
Making the case for MRAM in software-defined vehicles - Here is why MRAM stands out in SDVs when it comes to addressing the limitations of embedded non-volatile memory technologies. The post Making the case for MRAM in software-defined vehicles appeared first on EDN .
QuickLogic Announces New Seven-Figure FPGA Hard IP Contract - "We are already seeing interest from some partners on this concept."About QuickLogic QuickLogic Corporation is a fabless semiconductor company specializing in eFPGA Hard IP, Strategic Radiation Hardened and Antifuse FPGAs and ruggedized programmable logic solutions. QuickLogic's
Anthropic in talks to acquire Stainless, SDK startup serving Google and OpenAI - Anthropic is reportedly in advanced talks to acquire Stainless, a startup that builds software development kits for AI companies, including Google and OpenAI. The deal could value Stainless at over US$300 million, according to The Information .
Commentary: AI server ODMs face margin squeeze as memory costs soar - As AI server orders surge, system assembly makers are finding that more business does not always mean better profits. High-priced GPUs and soaring memory costs are pushing up revenue without lifting manufacturing fees at the same pace, leaving original design manufacturers (ODMs) facing lower gross margins...
Ajinomoto raises ABF substrate film prices 30% - Ajinomoto has informed IC substrate makers that it will raise prices for its key ABF build-up film by 30%, with the new pricing expected to take effect in the third quarter of 2026. Taiwanese package substrate makers confirmed they have received the official notice, as cost pressure in the IC substrate...
Intel's preliminary Apple deal puts Samsung's foundry ambitions under pressure - Intel's reported preliminary agreement to manufacture some chips for Apple is putting new pressure on Samsung Electronics, as the US chipmaker gains momentum with major technology customers and leans on Washington's support to revive its foundry business.
DFT In Automotive - What goes into ensuring automotive chip reliability, and why it's about to get even tougher. The post DFT In Automotive appeared first on Semiconductor Engineering .
[News] Samsung Electronics Rumored to Adjust Micro LED TV Manufacturing Strategy - As per Korean media reports on May 5, Samsung Electronics is carrying out a phased adjustment of its Micro LED TV manufacturing business, with a stronger focus on balancing profitability and product popularity. As Micro LED technology still involves complex production processes and high manufacturin......
Engineered exosomes reverse sleep deprivation brain damage in mice - Sleep is a vital physiological process that allows humans and other animals to restore both the mind and body, while also consolidating memories, clearing out toxins and regulating their metabolism. Several past studies showed ...
Silicon Photonics: Integrated Grating-Based Antennas for Optical Phased Arrays (MIT) - A new technical paper, “Reduced-crosstalk antennas for grating-lobe-free and wide-field-of-view integrated optical phased arrays,” was published by researchers at MIT. Abstract “Integrated optical phased arrays (OPAs) have emerged as a promising technology for many applications due to their ability...
What’s Really Needed For Advanced Test? - The industry's aspirations for machine learning are running ahead of the data plumbing required to support them. The post What’s Really Needed For Advanced Test? appeared first on Semiconductor Engineering .
Ensuring AI Reliability: Mitigating Silent Data Corruption Risks - In-chip monitoring restores trust through predictive maintenance that can identify and correct errors in real time. The post Ensuring AI Reliability: Mitigating Silent Data Corruption Risks appeared first on Semiconductor Engineering .
Micron Redefines AI Performance With Sampling of 256GB DDR5 Server Module - Delivers industry’s fastest performance capability with 1-gamma DRAM and advanced packaging BOISE, Idaho, May 12, 2026 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU), today announced it has sampled 256GB DDR5 registered dual in-line memory modules (RDIMM) to key server ecosystem enablers....
Intel employees support Giveback Day at St. John of God, Celbridge - As part of Intel’s commitment to supporting local communities, employees from the Fab Facilities Equipment Operations team volunteered their time across two days to repaint and rejuvenate the gymnasiu...
King’s Awards for Enterprise 2026 - The King’s Awards for Enterprise 2026 have been announced, and Electronics Weekly studied the list of winners to discover which electronics-related organisations have been honoured this year. They were officially announced last week, on 6 May 2026, which marks the anniversary of the coronation of King...
The next EDA wave: Lessons from DATE 2026 - The next phase of EDA will be shaped by the interaction between AI, heterogeneous architectures, verification, and security. The post The next EDA wave: Lessons from DATE 2026 appeared first on EDN .
PC chip demand stays murky in 2H26 as pre-buying clocks key - Demand for PC, notebook, and other IT application chips in the first half of 2026 remains relatively strong, driven not only by memory and CPU shortages and price increases, but also by solid pull-in demand for peripheral chips. Many industry players say the current buying momentum is stronger than in...
Humanoid Robots Show ROI, but Success Depends on Effective Output - Humanoid robots are moving from prototype validation toward early commercial deployment, with automotive manufacturing and logistics expected to form the core demand base over the next decade. As capital costs decline, the cost per productive hour falls accordingly, with the most significant reductions...
Mobile DRAM Contract Prices Continue Rising in 2Q26, Pressuring Smartphone Production, Says TrendForce - Surging mobile DRAM contract prices in 2Q26 continue to place even greater cost pressure on smartphone brands, according to TrendForce’s latest memory market research. The two major Korean suppliers may have adopted different pricing strategies: Samsung Electronics is pursuing a more aggressive one-step...
UK Humanoid robot startup looking at IPO - Two year-old UK AI and robotics startup Humanoid is looking to IPO in 2029 or 2030. Founder and sole investor Artem Sokolov told Reuters that it would probably IPO in the US. Sokolov also also said that he’d had 34,000 pre-orders, representing $2.4 billion in annual recurring revenue, and that he has...
Scientists Use AI To Supercharge Ultrafast Laser Simulations by More Than 250x - Researchers have developed a deep-learning-based surrogate model that dramatically speeds up simulations of nonlinear optical processes used in advanced laser systems. Simulating the complex optical behavior behind ultrafast laser systems requires enormous computing power, creating a major challenge for...
MRAM Gets Its Own SIG - SNIA MRAM alliance looks to unite a broader ecosystem to encourage magnetoresistive random access #memory (#MRAM) adoption. The post MRAM Gets Its Own SIG appeared first on EE Times .
As AI energy demand soars, UF scientist seeks solutions in space - UF engineers are sending photonic semiconductor chips to the International Space Station to test performance in harsh space conditions. The experiments are part of research to ease AI’s rapidly growing energy demands and find better places for data centers.
Mesoscale atomic engineering in a crystal lattice - Electron-beam control enables deterministic placement of tens of thousands of atomic defects in three-dimensional crystals, creating stable, programmable artificial matter for scalable quantum and nanoscale technologies.
TSMC’s ecosystem grows as Taiwan promotes investment links to Trump’s America - Taiwan is set to bring its US semiconductor investments to more than $200bn (£147bn), to build out the chip manufacturing ecosystem led by TSMC’s growing operation in Arizona, reports Paul Dempsey. At the same time, the foundry giant continues to husband its foreign investment (FDI) carefully. The...
Tuning interfacial polarity for stable high-potential lithium metal batteries - A molecular engineering strategy using dipolar self-assembled monolayers (SAMs) establishes interfacial polarity as a descriptor for battery electrode stability. By tuning the electronic structure of the SAM and, thus, nanometric surface environment of the positive electrode, stable operation of high-potential...
Emerson Unveils AI-Ready Test Automation Platform at Annual NI Connect Conference - Suite and further evolving the NI platform into an integrated, AI-ready test automation platform. These enhancements will allow aerospace, semiconductor, transportation and other mission-critical customers to develop, test and deliver products to market faster while meeting strict reliability and
Molecular grappling hooks improve cancer drug targeting and effectiveness - Medications are designed to treat diseased tissues while sparing healthy ones, often by attaching the drug to something that helps guide it directly to its target. But drugs also need time to work, which means they need to ...
Europe’s Photonics Push Runs Through Spain - Spain coordinates Europe’s €400 million PIXEurope initiative to turn photonics research into scalable semiconductor manufacturing capacity. The post Europe’s Photonics Push Runs Through Spain appeared first on EE Times .
Valens Semiconductor Reports First Quarter 2026 Results - assumptions. Many actual events and circumstances are beyond the control of Valens Semiconductor. These forward-looking statements are subject to a number of risks and uncertainties, including the cyclicality of the semiconductor industry; the effect of inflation and a rising interest rate environment...
CHARBONE Releases Updated Presentation and Fact Sheet - supply creates chronic shortage risk and pricing power for reliable regional distributors.UHP Semiconductor Gas SegmentThe UHP semiconductor gas market is projected to grow from approximately US$7.4 billion in 2025 to US$14.2 billion by 2034, at a CAGR
TECO expands into AI data centers with Malaysia acquisition deal - Taiwan-based industrial manufacturer TECO Electric & Machinery said on May 12 that its board had approved the acquisition of Malaysian engineering firm Dynaciate Engineering Sdn. Bhd. for about RM200 million (approx. US$50.8 million), in a deal expected to close in August 2026. After completion, TECO...
Imec's IC-Link joins TSMC 3DFabric Alliance, extending 3D integration access worldwide - Imec's IC-Link has joined TSMC's OIP 3DFabric Alliance, opening up broader access to TSMC's 3D stacking and packaging technologies for global ASIC customers. The move could accelerate the development of multi-die systems, smoothing paths to high-volume manufacturing and benefiting designers across AI,...
Taiwan capacitor maker Chinsan locks in Thailand AI server capacity through 2026 - Taiwan Chinsan Electronic Industrial said strong demand from cloud and server customers pushed related revenue contribution to 35% in the first quarter of 2026, with high-margin AI server applications accounting for roughly half of the segment.
Dixon Technologies sees margin pressure as stagnation offsets full-year growth - Dixon Technologies reported fiscal 2026 results showing full-year revenue growth, but underlying profitability momentum weakened toward the end of the year, with a flat fourth quarter and mounting cost pressures across its core electronics manufacturing services (EMS) business.
Melexis: all agenda items approved at the Annual General Meeting of shareholders - Melexis announces the appointment of Ms. Jayanthi Natarajan as a new independent board member following shareholder approval at its 2026 Annual General Meeting. Bringing a unique blend of expertise in AI and digital transformation, she will provide fresh perspectives and a strong global network to drive...
[News] MLC NAND Spot Prices Reportedly Triple Since Late 2025 as Samsung, Kioxia Exit Supply - As global memory makers pivot toward high-capacity solutions and steadily phase out legacy 2D NAND, supply of low-capacity, general-purpose NAND chips is tightening sharply, sending spot prices soaring. According to Chosun Ilbo, 64Gb MLC NAND spot prices have surged more than 300% from end-2025 leve......
Dr. Hamid Azimi Wins ISIG Lifetime Hall of Fame Award - At the International Semiconductor Industry Group (ISIG) Executive Summit in Silicon Valley, Marvell Senior Vice President of Foundry and Advanced Packaging Dr. Hamid Azimi received the 2026 Hall of Fame award. This recognition celebrates leaders whose lifetime contributions have had a lasting impact,...
ANN Framework for Thermal-Aware Modeling of GAAFETs (NYCU) - A new technical paper, “A Device-Physics-Informed Artificial Neural Network Approach for Thermal-Aware I-V and C-V Modeling of GAA FETs,” was published by researchers at National Yang Ming Chiao Tung University. Abstract “This work introduces a device-physics-informed neural network framework for...
Complete End-To-End Closed-Loop Product Yield Ramp And Learning - Analytics-driven yield diagnostics and failure analysis integration for advanced-node devices. The post Complete End-To-End Closed-Loop Product Yield Ramp And Learning appeared first on Semiconductor Engineering .
2026 Global Semiconductor Supplier Awards - Since 1988, the Global Semiconductor Supplier Awards have served as the industry’s most trusted independent benchmark for supplier performance, originally established by VLSI Research and now powered by TechInsights.
Infineon expands XHP 2 power module portfolio - Infineon has expanded its XHP 2 power module portfolio with new variants incorporating CoolSiC MOSFETs 2300 V, designed for high-voltage power systems. The 2300 V class devices support DC-link voltages of up to 1500 V, addressing the industry trend toward higher system voltages. The modules are available...
Foxconn US Plant Hit By Data-Theft Hack - Hackers claim theft of component schematics, data centre topology diagrams after hack halts operations at Wisconsin facility
[News] TSMC Sees AI Wafer Demand Rising 11x From 2022–2026, Targets CoWoS With 24 HBM Stacks in 2029 - TSMC held its Taiwan Technology Symposium today. According to Reuters, the company said that demand for AI accelerator wafers is projected to grow 11-fold between 2022 and 2026. TSMC also raised its forecast for the global semiconductor market, now expecting it to exceed US$1.5 trillion by 2030, up ......
Measuring G: The ultimate metrology challenge? - Gravity is ubiquitous but very hard to measure precisely, as a recent attempt confirms. The post Measuring G: The ultimate metrology challenge? appeared first on EDN .
[News] SK hynix CEO Reportedly to Meet Bill Gates, Deepening AI Memory Ties Amid Microsoft ASIC Push - Microsoft is continuing to deepen its custom chip push, with SK hynix expected to play an increasingly important role in the effort. According to The Korea Herald, sources say SK hynix CEO Kwak Noh-Jung is set to meet Microsoft co-founder Bill Gates and CEO Satya Nadella this week at the closed-door......
Lam Research Corporation Announces Participation at Upcoming Conferences - Lam ResearchLam Research Corporation (NASDAQ: LRCX) is a global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Lam's equipment and services allow customers to build smaller and better performing devices. In fact, today, nearly every advanced chip
FuzeHub Blog: Quantum Computing: What Manufacturers Need to Know - Photo courtesy of FuzeHub Quantum computing is an emerging technology that excites computer scientists and confounds manufacturers. It seems abstract, theoretical, and far-removed from the realities of production, logistics, and materials engineering. Yet quantum computing isn’t science fiction. This...
Open Cosmos designs eight satellites - Open Cosmos, the Barcelona satellite builder, has come up with eight new Earth observation satellite designs to monitor climate-related disasters and environmental threats from space. The satellites are to be part of the Atlantic Constellation (ESCA), a project managed by the AEE in collaboration with...
Altasec deepens edge AI imaging push into Europe and US security markets - Altasec Technology, a smart security and control solutions provider founded in 2011, will list on Taiwan's Emerging Stock Board on May 14 as it moves to capture demand from AI applications and expand further into the European and US security markets.
AI demand lifts Zhen Ding as server and chip substrate sales surge - Taiwanese printed circuit board maker Zhen Ding Technology Holding reported first-quarter 2026 revenue that reached a record for the period, as booming demand for artificial intelligence infrastructure helped offset the seasonal slowdown typically associated with consumer electronics.
Inventec sees strong AI, general-purpose server demand through 2028 - Inventec expects both artificial intelligence (AI) servers and general-purpose servers to see growth in 2026, with company president Jack Tsai noting that orders for the latter are expected to grow through 2028. The company also plans to double capital expenditure in 2026, focusing on expanding production...
PixArt targets 2Q26 growth as gaming mouse and console demand offset weak PC sales - IC design firm PixArt Imaging said on May 12 that its three core business areas will post strong growth in the second quarter of 2026, with revenue expected to rise by the double digits quarter over quarter. The company said better-than-expected game console shipments lifted first-quarter 2026 results...
OpenAI trial exposes deep rift between Sam Altman and Elon Musk - The courtroom battle between Sam Altman and Elon Musk intensified this week as Altman rejected Musk's accusations that OpenAI abandoned its original mission to benefit humanity in favor of profit.
[News] Snapdragon 8 Elite Gen 6 Pro Reportedly Priced Above US$300 on TSMC 2nm, Risking Adoption - Qualcomm’s transition to TSMC’s 2nm process is expected to raise SoC costs, with next-generation chips potentially facing notable price increases. According to Wccftech, citing sources, the Snapdragon 8 Elite Gen 6 Pro could reportedly exceed US$300, potentially limiting adoption mainly to “Ul......
Brewer Science to Showcase Advanced Packaging Materials and Technologies at ECTC 202 - Brewer Science to Showcase Advanced Packaging Materials and Technologies at ECTC 2026 Orlando, Florida – May 18, 2026 — Brewer Science, Inc., a global leader in materials innovation for advanced packaging and semiconductor manufacturing, will be exhibiting and presenting at the 2026 IEEE 76th Electronic...
Smart Test Collides With The Data Chain - Key Takeaways: The promise of smart test is a data-chain problem before it is an algorithm problem. A device can pass every checkpoint and still carry a latent defect the test record never captured. As test grows more adaptive, the validity of the measurement environment matters as much as the measurement...
Imec: High-NA EUV saves 3-4 masks at A14 and A10 node - High-NA EUV scanners can pattern the most challenging layers in A14 and A10 logic chips in a single exposure, when low-NA EUV would require 3-4 masks, Imec reports.
A Comprehensive Study Of Integrating 2D Materials With CFET Architecture (SKKU, et al.) - A new technical paper, “Challenges and prospects of 2D electronics for future monolithic complementary field-effect transistors,” was published by researchers at Sungkyunkwan University, Hangyang University, Istituto Italiano di Tecnologia, Shanghai University, Jeonbuk National University, and Kyonggi...
HW-Based Image Generation Using FTJs (SNU, Sungkyunkwan U., SK hynix et al.) - A new technical paper, “CMOS-compatible ferroelectric tunnel junctions integrate stochastic sampling and deterministic computing for image generation,” was published by researchers at Seoul National University, Sungkyunkwan University, Hanyang University, Sogang University, and SK Hynix. Abstract...
CEA-Leti Platform Offers Chipmakers Nanometre- Scale Strain Mapping - The performance of advanced microelectronic devices depends especially on the efficient transport of electrical charges. These transport properties are strongly related to deformation of the crystal lattice. Strain engineering, which involves deliberately stretching or compressing a crystal lattice,...
Apple-Intel Foundry Deal Could Reshape U.S. Chip Manufacturing - The reported agreement may just represents a symbolic hedge against TSMC concentration. The post Apple-Intel Foundry Deal Could Reshape U.S. Chip Manufacturing appeared first on EE Times .
Taiwan's Research Excellence Shines at Edison Awards with 16 Wins - monitor equipment conditions and predict anomalies before failure, PMS significantly reduces unexpected shutdowns. In a single instance during semiconductor manufacturing, the system prevented an estimated loss of US$5 million. The technology has since expanded into industries including machine tools,...
