Semi. Fabs and Clean Rooms 53m ago: As of late September 2026, semiconductor fab activity remains intense, with emergency-speed construction underway across the US, Japan, Korea, and Europe to counter AI-driven demand and supply-chain risks. TSMC’s Arizona Fab 21 has achieved Taiwan-level EUV yields on N4/N5 processes and is advancing toward 2 nm production in 2027, while India’s ecosystem push focuses on scaling OSAT capacity (e.g., CG Semi/Renesas in Gujarat) and supporting infrastructure like ultra-pure water and utilities. Europe’s efforts, led by Germany, aim to build alternatives to Taiwan’s dense cleanroom clusters, though challenges persist around replicating that integrated supply density.
S2C Prodigy Complete Prototyping Solutions—and Why They Matter - Modern system-on-chip (SoC) and application-specific integrated circuit (ASIC) designs are extraordinarily complex. They may combine processors, accelerators, memory controllers, high-speed interfaces, security functions, and millions—or even billions—of logic gates. Verifying these systems entirely...
LEDs for under-cabinet illumination upgrades - Long life? Power efficient? Color temperature flexibility? Drop-in replacement? Yes please, I'll take one of these! The post LEDs for under-cabinet illumination upgrades appeared first on EDN .
Beyond GKS: More scholarships for international students in Korea - Beyond GKS: More scholarships for international students in Korea Universities, private foundations and local governments offer scholarships ranging from tuition reductions to full tuition, living expenses and other financial support 9/24/2026 - 02:47 AM YOON SEUNG-JIN
Audio Spectrum Analyzer on an ESP32 Display Board - A slick spectrum analyzer used to be the kind of thing that would have been tricky to include in a DIY project, but as [Mirko “mircemk” Pavleski] demonstrates, a modern …read more
Reflections on a Remarkable Decade at SIA … and the Opportunities Ahead - As I near my departure as CEO of SIA, I’ve been reflecting on how profoundly semiconductors have transformed the world during my tenure—and how we are still only scratching the surface of what’s possible. When I first joined SIA and visited a fab, I was awed by the sheer scale of the technology,...
Podcast EP368: An Overview of TSMC Open Innovation Platform (OIP) event with Aveek Sarkar - Daniel is joined by Aveek Sarkar, who heads TSMC ’s Ecosystem and Alliance Management Division. Along with his team, he is responsible for driving semiconductor design enablement in collaboration with the partner ecosystem through TSMC’s Open Innovation Platform® (OIP). Prior to TSMC, Aveek worked...
Reference design cuts complexity in USB-C adapters - Eggtronic has announced a 140-W USB-C Power Delivery (PD) 3.1 AC/DC reference design for notebook adapters and other USB-C powered devices. The post Reference design cuts complexity in USB-C adapters appeared first on EDN .
With PEN nearing end-of-life, capacitors built on it must change - Capacitor manufacturers face a choice between dropping in a lookalike or rebuilding capacitor around what modern systems now demand. The post With PEN nearing end-of-life, capacitors built on it must change appeared first on EDN .
ADB lifts Korea growth outlook to 3.2 percent on AI exports - ADB lifts Korea growth outlook to 3.2 percent on AI exports The Asian Development Bank raised Korea's 2026 growth forecast to 3.2 percent, citing surging AI chip exports, strong corporate earnings and fiscal support. 9/22/2026 - 11:19 PM
Qorvo Achieves Key X-Band GaN Milestone in DARPA THREADS Program - Qorvo® (Nasdaq: QRVO), a leading global provider of connectivity and power solutions, today announced it has achieved more than a 400%[CL1.1] increase in the RF power density at X-band on Gallium Nitride (GaN) transistor through a research and development work funded by the Defense Advanced Research...
ASM Launches Breakthrough Flowable Carbon Technology for the Next Era of Semiconductor Scaling - ASM, a materials discovery company and global leader in semiconductor wafer processing equipment, building on its leadership in atomic layer deposition and epitaxy, launches its XP8 Vertos Flowable Carbon, the market's first plasma-enhanced chemical vapor deposition (PECVD) flowable carbon film. The post...
Apple A20 Pro: Inside the iPhone 18 Pro’s TSMC 2nm Processor - TechInsights analyzes Apple’s A20 Pro processor, revealing TSMC N2 gate-all-around technology, expanded AI and graphics processing, and a new side-by-side memory packaging architecture.
Designing Multi-kW Power Delivery In 3D Heterogeneously Integrated Systems (U. of Minnesota) - Researchers at the University of Minnesota published a technical paper titled “Toward Multi-kW Power Delivery Methodologies for Advanced 3D Heterogeneous Integration.” Abstract Excerpt: “Computationally powerful systems require significant power for computation: reliable and robust power delivery...
Sydor Completes Tech Center at MCC Campus - Work has been completed on the Sydor Optics Advanced Technology Center at Monroe Community College (MCC)’s main campus in the town of Brighton in Monroe County, N.Y. The $69.6 million project moved critical technology programs from an outdated facility on West Henrietta Road to the state-of-the-art...
Move Over, HAL. New AI Thinks Like a Chip Designer - It just struck me that—although we don’t yet have things like Jetson-style flying cars—some of the technologies we do have go way beyond what was considered to be in the realm of science fiction when I was a young sprout. Actually, as an aside, just thinking about
After IonQ Buyout, SkyWater Reiterates Role as Quantum Foundry - As SkyWater scales its 200-mm and 300-mm manufacturing platforms to support diverse quantum modalities, leadership emphasizes that protecting customer IP remains its top priority. The post After IonQ Buyout, SkyWater Reiterates Role as Quantum Foundry appeared first on EE Times .
Edge AI shifts onto MCUs at EWNA 2026 - Elektor’s second day at embedded world North America 2026 in Anaheim put the emphasis on edge AI moving further into…
Morphotonics Closes $45M Funding Round - Morphotonics, a provider of large-area nanoimprint lithography technology, has secured more than €40 million (~$45 million) to scale its manufacturing technology for AI glasses, augmented reality (AR) waveguides, and advanced photonic...
AI drives Episil GeSi, PMIC growth - Semiconductor epitaxy maker Episil Precision said on September 22 that rising demand from AI data centers has created two main growth engines. Demand for silicon photonics optical communication modules is driving a surge in germanium silicon (GeSi) epitaxy demand, with the sector projected to grow 3.5-...
SEMICON India 2026: Startup Mitra Sheds Light on Early-Stage Silicon Startup Funding - Indian semiconductor startups are seeking capital beyond seed rounds as they advance from prototypes and tape-out toward volume production. The post SEMICON India 2026: Startup Mitra Sheds Light on Early-Stage Silicon Startup Funding appeared first on EE Times .
Insight: How a New DSP Architecture Could Raise ADI’s Reach in Automotive Audio - This TechInsights report assesses the new SHARC-FX architecture for automotive audio processors, developed with Cadence Tensilica technology. It explains why the Analog Devices ADSP-2184x and ADSP-SC84x Digital Signal Processor (DSP) families represent more than an incremental SHARC upgrade, combining...
Cambridge Tech Week draws 1,700 visitors - Cambridge Tech Week 2026 closed last week after five days of debate, dealmaking and networking, with this year’s programme putting a sharper focus on the practical challenge of turning research […] The post Cambridge Tech Week draws 1,700 visitors appeared first on Electronics Weekly .
Designing chips for the AI era: what TSMC’s roadmap means - AI is creating two related problems for semiconductor designers. They must deliver more computing power for training and inference, while keeping energy use and cost manageable. Dr. LC Lu’s presentation at the TSMC Open Innovation Platform Forum describes a response built around more efficient transistors,...
Valens Semiconductor to Collaborate with onsemi - Valens Semiconductor, a provider of high-performance connectivity chipsets, today announced a collaboration with onsemi on a cost-optimized integrated sensor for high-volume 3-megapixel automotive camera applications. The post Valens Semiconductor to Collaborate with onsemi appeared first on Semiconductor...
Lee touts shipbuilding cooperation with Trump at New York investment event - Lee touts shipbuilding cooperation with Trump at New York investment event President Lee Jae Myung told Wall Street investors that cooperation with U.S. President Donald Trump on naval shipbuilding could yield "tangible results." 9/23/2026 - 11:59 AM SARAH KIM
SOSA-aligned TVPX210 3U OpenVPX carrier board offers modular I/O - Tews Iechnologies has announced its TVPX210, a 3U OpenVPX carrier board aligning with the SOSA technical standard. It’s for system designers to integrate high-performance modular I/O into next-generation defence and […] The post SOSA-aligned TVPX210 3U OpenVPX carrier board offers modular I/O appeared...
SEMICON INDIA 2026: India Starts Packaging Chips as Ecosystem Takes Shape - India moves five chip packaging plants into production as $13.5 billion ISM 2.0 expands manufacturing, design, and engineering capabilities. The post SEMICON INDIA 2026: India Starts Packaging Chips as Ecosystem Takes Shape appeared first on EE Times .
Narrative: Q2 2026 Global Smart Speaker and Smart Displays Results - This Narrative is a companion report to the quarterly update of the Online Data Reports (ODR): Q2 2026 Smart Speaker and Displays Market Share Results. This ODR is refreshed each quarter, and the Q2 2026 narrative report provides qualitative insights alongside quantitative data as part of the ODR update...
[News] German Court Reportedly Finds Micron Infringed Two YMTC NAND Patents, Grants Injunctions - A German court has issued two injunctions against Micron after finding that the company infringed YMTC patents related to 3D NAND technology. According to ijiwei, citing Ip Fray, the Munich I Regional Court handed down the first-instance rulings in two patent infringement cases, marking the latest d......
Narrative: Global Foldable Smartphone Shipments Forecast by Vendor by Region to 2027 - The global foldable smartphone market is on the verge of a major shift. Global shipments are forecast to grow 29% in 2026 and a further 52% in 2027, once the iPhone Duo, Apple's first foldable, reaches its first full year of availability. Samsung is set to remain the largest vendor through 2026, with...
Chip Industry Technical Paper Roundup: Sept. 22 - AI thermal modeling for 2.5D/3D ICs; chiplet and AI accelerator co-design; BEOL thermal conductivity; agentic DRC repair; RL for dense-layout routing; LLM orchestration for digital EDA; chiplet interconnects for neuromorphic computing. The post Chip Industry Technical Paper Roundup: Sept. 22 appeared...
Canadian Startup Sees Success in Space Qualification - Novigrad is forging a pathway for faster, more accessible radiation testing as a growing wave of space missions drives demand for reliable, resilient electronics. The post Canadian Startup Sees Success in Space Qualification appeared first on EE Times .
WFE by Application - Wafer Fab Equipment by Application includes data across various applications, including Foundry, Logic, Memory, and Other. TechInsights uses many different sources of data, such as public annual and quarterly financial reports, individual company reports, direct feedback from suppliers, transcripts, and...
Gadget Watch: Googlebook goes AI with AI - The successor to the humble Chromebook workhorse, the newly-launched Googlebook laptop is a premium product that sees the company go all-in (AI) with AI. The post Gadget Watch: Googlebook goes AI with AI appeared first on Electronics Weekly .
Bel Fuse high-density DC-DC converters track railway applications - Bel Fuse has announced the XRCM200 and XRCM300 series of compact, high-density DC-DC converters for railway and transportation applications. The parts support input voltages from 16.8 VDC to 137.5 VDC, […] The post Bel Fuse high-density DC-DC converters track railway applications appeared first on Electronics...
AI-Driven Device Modeling For Next Generation Quantum Applications - Extracting advanced compact models and overcoming their shortcomings using a hybrid ANN approach at cryogenic temperatures. The post AI-Driven Device Modeling For Next Generation Quantum Applications appeared first on Semiconductor Engineering .
[News] Micron Reportedly Ends 2GB GDDR7, Narrowing Supply Options for NVIDIA’s RTX 50 Series - As memory supply tightens and major chipmakers prioritize long-term contracts and higher-end products, Micron is reportedly phasing out its 2 GB GDDR7 chips used in several NVIDIA GeForce RTX 50-series graphics cards. TechPowerUp and Gazlog, citing UNIKO's Hardware, report that the products have rea......
Technical Report: Qorvo QM77058A MHB L-PAMiD Module Architecture Analysis - The following is a Module Architecture Analysis report for the Qorvo QM77058A MHB L-PAMiD, a Mid/High Band (MHB) Radio Frequency Power Amplifier Module with an embedded Low Noise Amplifier (LNA) and integrated duplexers (L-PAMiD), developed for 4G LTE and 5G NR applications. The specific component used...
Steam Frame Teardown: We’re Fans. Except of the Fan - Finally, finally, the Steam Frame is here! Five years ago, rumors of an internal Valve project codenamed Deckard rocked the VR enthusiast world. Since then, gamers have salivated over the…
Mental Health - Four in ten 10 adults in countries like Australia, the U.S. and Canada reported that they had experienced mental health problems, such as stress, anxiety or depression in the 12 […] The post Mental Health appeared first on Electronics Weekly .
Lawrence Semiconductor Appoints General Manager, COO: People in the News: 9/23/26 - Open Light, a photonic chip designer and manufacturer, appointed Kevin Soukup as COO and Kirk Ouellette as chief strategy officer and interim chief revenue officer. Soukup most recently served as senior vice president and general manager at GlobalFoundries. Before that, Soukup held executive roles across...
Five Signals From The 2026 Functional Verification Study - Functional verification is no longer only about closing the design. It is increasingly about understanding the system before silicon becomes the first place where all interactions are fully revealed. The post Five Signals From The 2026 Functional Verification Study appeared first on Semiconductor Engineering...
Chip Turf War in China - A Chinese semiconductor industry Turf War is brewing as DRAM specialist CXMT looks to get into NAND – the province of Yangtze Memory (YMTC) – while YMTC is making moves […] The post Chip Turf War in China appeared first on Electronics Weekly .
Kitaev spin liquid in superconducting networks - …Kitaev honeycomb Hamiltonian -- an archetypal spin-liquid model -- in a superconducting metamaterial. The architecture consists of Cooper-pair boxes coupled through depleted semiconductor --superconductor heterostructures that do not require spin--orbit coupling. The Cooper-pair boxes encode effective...
Beyond the Accelerator: Why Silicon Challengers Must Transition to Full-System Infrastructure - The recent AI Infra Summit was exceptionally jam-packed, filled to the brim with compelling talks, overlapping tracks, and emerging technologies. Amid the noise of the event, there were many excellent presentations detailing the physical realities of scaling hardware. But one presentation in particular...
Satlantis launches NOX Night vision Optical eXplorer project - Satlantis Microsats, a provider of high-res optical payloads for small satellites, has officially launched NOX (Night vision Optical eXplorer) project. This is a new night-vision project with funding coming from […] The post Satlantis launches NOX Night vision Optical eXplorer project appeared first...
Comparison of TSMC CoWoS-S, CoWoS-R, and CoWoS-L - Chip-on-Wafer-on-Substrate, commonly called CoWoS, is an advanced packaging platform developed by TSMC . It allows processors, chiplets, and high-bandwidth memory stacks to be integrated within a single package. CoWoS has become especially important for artificial-intelligence accelerators and high-performance...
