Pi Pico Learns Morse Code - When [101 Things] didn’t want to copy Morse code, he decided to build a Pi Pico system to read it for him. On the face of it, this doesn’t seem …read more
Emerging Strategies for Flow Batteries - Grid-scale energy storage (ES) markets are dominated by pumped hydro storage (PHS) and Li-ion battery energy storage systems (BESS). The reducing costs of Li-ion technologies continues to create challenges for other energy and battery storage technologies, such as redox flow batteries (RFBs) to penetrate...
CES 2026 Recap: Highlighting Technological Advancements in Automotive Sensing - The new year has started off with great energy, kicking off at CES 2026 in Las Vegas, an essential opportunity to connect with customers and partners, exchange ideas, and experience the ever-evolving trends in advanced vehicle automation, in-cabin and exterior …
Hamamatsu Si APDs for high-precision optical detection - Hamamatsu Photonics has launched its S17268 Series photodiodes for high-precision optical detection in the UV to VIS regions. With a compact design for space-constrained application, sectors targeted include industrial, research, and environmental. For example, optical range finding industrial LiDAR,...
Cybersight Does Biking Glasses Right With Zenith - Cybersight was showing off their Zenith biking glasses at CES 2026, and it came with the usual buzzwords. Read more ▶ The post Cybersight Does Biking Glasses Right With Zenith appeared first on Semiaccurate .
3D Printing To Create Spatially Freeform, Nanomaterial-based Electronics (Rice, U. of Utah, NUS) - Researchers from Rice University, University of Utah and National University of Singapore (NUS) published “Three-dimensional printing of nanomaterials-based electronics with a metamaterial-inspired near-field electromagnetic structure.” Abstract “Three-dimensional (3D) printing can create freeform...
TP-Link’s Kasa HS103: A smart plug with solid network connectivity - With Amazon’s smart plug teardown “in the books”, we turn our attention to some TP-Link counterparts, with hands-on testing results. The post TP-Link’s Kasa HS103: A smart plug with solid network connectivity appeared first on EDN .
Chip Industry Technical Paper Roundup: Feb. 9 - Scalable quantum photonics; scheduling multicore architectures; HW triggered backdoors; performance model for photonic IMC; 300mm fab-compatible planar 2D FETs; thermal characterization power semiconductor packages; overview of Interface dipole engineering; next-gen DRAM capacitors. The post Chip Industry...
Samsung boosts HBM4 DRAM investment to secure market leadership - Samsung Electronics is set to begin mass production of the world's first sixth-generation high-bandwidth memory (HBM4) chips later in February 2026, marking a major milestone in the race to supply critical components for next-generation AI hardware. Industry sources cited by the Yonhap News Agency say...
Cross-functional teams: from autonomy to accountability - When teams own customer-facing value end-to-end, use quantitative metrics to guide decisions, are organized around a value model, are accountable for outcomes and evolve with value streams, they become powerful engines for continuous value delivery.
CSP orders and space economy fuel strong start to 2026 for Taiwan's supply chain - Rising investments in AI data centers and an intensifying global push to build large-scale satellite networks are rapidly transforming Taiwan's technology supply chain, delivering a powerful start to 2026. From advanced cooling solutions and ASIC thermal modules to satellite communications components...
Thumbwheel switches: Turning numbers into control - Thumbwheel switches offer a straightforward, tactile method for setting numerical values in electronic instruments and control systems. The post Thumbwheel switches: Turning numbers into control appeared first on EDN .
Boosting AI with CXL Part III: Faster Time-to-First-Token - Can AI beat a human at the game of twenty questions? Yes. And can a server enhanced by CXL beat an AI server without it? Yes, and by a wide margin. While CXL technology was originally developed for general-purpose cloud servers, the technology is now finding a home in AI as a vehicle for economically...
Ever Ohms follows price hike on chip resistors, AI applications could account for 10% in 2026 - Because of rising raw material costs, Taiwanese chip resistor manufacturers have begun increasing prices, with the wave spreading from major passive component makers such as Yageo and Walsin to smaller players like Ta-Yi Technology and Ever Ohms. After issuing a price increase notice to customers, Ever...
Texas Instruments touts system level solutions for Korean robotics industry - Texas Instruments will offer system level solutions that integrate semiconductors, parts and software for the South Korean humanoid robotics industry, a senior executive said.Being offering such solutions that integrate various features and offer them at high density and a small size was the company
Are You Using Structural Patterns In An SLT Environment? - Patterns created using advanced fault models provide higher test coverage, improved defect detection, and higher-yielding silicon. The post Are You Using Structural Patterns In An SLT Environment? appeared first on Semiconductor Engineering .
[News] TSMC Reportedly Set to Shift 80% of 8-Inch Output to Affiliate VIS, Doubling Its Capacity - As TSMC accelerates its push into advanced nodes—led by 2nm and 3nm—to meet surging AI demand, the foundry heavyweight is quietly dialing back its 8-inch footprint. Citing IC design house sources, the Economic Daily News reports that TSMC currently runs about 5 million 8-inch wafers annually, wi......
PIC32WM-BZ6 module talks multiprotocol IoT - Mouser is now stocking the PIC32WM-BZ6 multiprotocol module from Microchip Technology. PIC32WM-BZ6 The low-power module aims at multiprotocol applications. For example, IoT devices, heating, ventilation, and air conditioning (HVAC) systems. As well as automotive and telematics applications, and consumer...
[News] Global Memory Interconnect Leader Montage Technology Rides AI Data Center Boom to HK IPO - As 2026 gets underway, China’s capital markets are already heating up with chip IPOs. Montage Technology, a designer of chips that speed data flows across data centers and AI accelerators, soared 57% on its Hong Kong debut February 9, backed by cornerstone investors including JP Morgan and Alibaba......
TSMC & GCU Semiconductor Training Program: Preparing Tomorrow’s Workforce - The expansion of semiconductor manufacturing in the United States, particularly with TSMC’s multi-fab campus in Phoenix, Arizona, has created a significant need for skilled technical workers. To meet this demand, TSMC has partnered with educational institutions, including Grand Canyon University (GCU)...
Optimal Surface Condition For Improved Cu-to-Cu Direct Bonding (NCHU, Osaka Univ.) - A new technical paper titled “Hybrid surface pre-treatments for enhancing copper-to-copper direct bonding” was published by researchers at National Chung Hsing University (NCHU) and Osaka University. Abstract excerpt “Three-dimensional integrated circuits (3D IC) require low-temperature, high-reliability...
Storing the Internet in DNA? Scientists Say It’s Closer Than You Think - Scientists are exploring how DNA’s physical structure can store vast amounts of data and encode secure information. Since computers first began shaping modern society, scientists have faced two ongoing problems: finding ways to store rapidly growing amounts of digital information and ensuring that this...
555 VCO revisited - A new 555 VCO circuit that overcomes some drawbacks of the classic version, like limited CV range and inverted CV/Hz behavior. The post 555 VCO revisited appeared first on EDN .
Europe deploys NanoIC pilot line to accelerate sub-2nm AI chip development - Europe has taken a decisive step toward advanced semiconductor leadership with the launch of the NanoIC pilot line at Imec's Leuven headquarters, positioning the region to accelerate development of sub-2nm systems-on-chip (SoCs) and strengthen its role in next-generation chip manufacturing.
Chiplets Reach an Architectural Turning Point at Chiplet Summit 2026 - The semiconductor industry’s transition toward chiplet-based architectures is entering a decisive new phase. What began as a promising alternative to SoC design is now confronting real-world demands around system integration, validation, and long-term scalability. At Chiplet Summit 2026 , taking place...
Webinar | Battery Storage Trends in Data Centers and C&I Applications - Join IDTechEx Principal Technology Analyst Conrad Nichols on Tuesday 17th February for this expert webinar "Battery Storage Trends in Data Centers and Commercial & Industrial Applications". Choose your preferred time zone - the webinar runs three times during the day.
CEO Seikku: Building for the next phase of the semiconductor cycle - After navigating a challenging few years, the semiconductor industry enters 2026 with emerging opportunities alongside continued uncertainty. While the overall semiconductor market is set to grow, growth is bifurcated: AI-related segments are experiencing phenomenal growth, whereas consumer electronics...
Spending on datacentre switches to exceed $100bn by 2030 - Spending on datacentre switches deployed in AI back-end networks is forecast to surpass $100 billion by 2030, driven by expanding deployments across scale-up, scale-out, and scale-across domains, says Dell’Oro. While multiple technologies are expected to coexist and see strong adoption over the forecast...
Silicon Motion posts strong Q4 results, forecasts continued growth in 2026 - Silicon Motion Technology, a leading global supplier of NAND flash controllers, reported robust financial results for the fourth quarter of 2025, driven by broad-based product growth and expanding market share across key segments.
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