Semi. Fabs and Clean Rooms 2¾h ago: TSMC Arizona Fab 21 ramping with strong yields on N4/N5 for Apple/AMD/NVIDIA; Phase 2 equipment install Q4 2026. Samsung Taylor 2nm sold out pre-ramp to Tesla/Broadcom/Arm. Terafab (Tesla/SpaceX/xAI + Intel) announced for 1TW AI chips/year. India reaches 5 operational units with Tata Dholera alliances (Fujifilm, L&T, Nexperia). Cleanroom firm Fabtech expanding order book.
Valens Semiconductor to Collaborate with onsemi - Valens Semiconductor, a provider of high-performance connectivity chipsets, today announced a collaboration with onsemi on a cost-optimized integrated sensor for high-volume 3-megapixel automotive camera applications. The post Valens Semiconductor to Collaborate with onsemi appeared first on Semiconductor...
Steam Frame Teardown: We’re Fans. Except of the Fan - Finally, finally, the Steam Frame is here! Five years ago, rumors of an internal Valve project codenamed Deckard rocked the VR enthusiast world. Since then, gamers have salivated over the…
Lee touts shipbuilding cooperation with Trump at New York investment event - Lee touts shipbuilding cooperation with Trump at New York investment event President Lee Jae Myung told Wall Street investors that cooperation with U.S. President Donald Trump on naval shipbuilding could yield "tangible results." 9/23/2026 - 11:59 AM SARAH KIM
Mental Health - Four in ten 10 adults in countries like Australia, the U.S. and Canada reported that they had experienced mental health problems, such as stress, anxiety or depression in the 12 […] The post Mental Health appeared first on Electronics Weekly .
Analysis: Memory Continues to Hold Center Stage - Conditions in the WFE equipment market remain stable and favorable, with no significant changes from last week. AI-related segments continue to be the hottest in the market, with Memory in particular being the area of greatest ferment and investment activity. This report accompanies the Industry Performance...
A JavaScript OS for the ESP32 - Given the incredible power of modern microcontrollers, we’ve seen quite a few attempts to turn them into more general purpose computers over the years. KryonOS from [Haris] is the latest, …read more
BluGlass Notice of Meeting & Proxy – 2026 - Dear Shareholder Global semiconductor developer, BluGlass Limited (ASX: BLG) (Company) advises that its Annual General Meeting will be held on…
Qorvo Achieves Key X-Band GaN Milestone in DARPA THREADS Program - Qorvo® (Nasdaq: QRVO), a leading global provider of connectivity and power solutions, today announced it has achieved more than a 400%[CL1.1] increase in the RF power density at X-band on Gallium Nitride (GaN) transistor through a research and development work funded by the Defense Advanced Research...
Kitaev spin liquid in superconducting networks - …Kitaev honeycomb Hamiltonian -- an archetypal spin-liquid model -- in a superconducting metamaterial. The architecture consists of Cooper-pair boxes coupled through depleted semiconductor --superconductor heterostructures that do not require spin--orbit coupling. The Cooper-pair boxes encode effective...
Tim Cook to get Robert Noyce Award - Today, the SIA announced that Tim Cook has been selected as the 2026 recipient of the chip industry’s highest honour, the Robert N. Noyce Award. The SIA presents the Noyce […] The post Tim Cook to get Robert Noyce Award appeared first on Electronics Weekly .
Comparison of TSMC CoWoS-S, CoWoS-R, and CoWoS-L - Chip-on-Wafer-on-Substrate, commonly called CoWoS, is an advanced packaging platform developed by TSMC . It allows processors, chiplets, and high-bandwidth memory stacks to be integrated within a single package. CoWoS has become especially important for artificial-intelligence accelerators and high-performance...
Why AI is forcing a rethink of power delivery - Delivering enough power, quickly and consistently enough, to keep increasingly complex AI systems operating at peak performance, is a challenge, writes Takaki Murata. Some of the biggest constraints on future […] The post Why AI is forcing a rethink of power delivery appeared first on Electronics Weekly...
[News] Intel Unveils Micro-LED-Based Glass Substrate Packaging Technology Patent - Intel has recently disclosed a patent originally filed in 2022, revealing an IC packaging architecture that integrates Micro LEDs. The architecture features semiconductor dies embedded directly into a glass substrate, where Through-Glass-Via (TGV) within the substrate deliver power straight to th...
Can Agents Design Better Chips When Operating At A Higher Level Of Abstraction Using HLS (UCLA) - Researchers at UCLA published a technical paper titled “Can Agents Design Better Chips with a Higher Level Abstraction?” Abstract Excerpt: “Large Language Model (LLM) agents are increasingly being explored for chip design, but most existing approaches operate directly at RTL. We ask whether agents...
AI Power Demands Push GaN into Data Center Design - Rising AI power demands are pushing data center designers toward GaN-based power conversion for higher efficiency and density. The post AI Power Demands Push GaN into Data Center Design appeared first on EE Times .
Brent’s Musings: This One Is for All the Marbles - A childhood box of marbles reveals an unexpected family connection between century-old manufacturing innovation and a lifelong career in semiconductors.
Apple A20 Pro: The iPhone 18 Pro's TSMC 2nm Processor - TechInsights performed an exploratory teardown and analysis of the Apple A20 Pro processor extracted from Apple’s newly released iPhone 18 Pro. The Apple A20 Pro application processor is fabricated using TSMC's N2 process—the first 2 nm process from TSMC featuring gate-all-around transistor technology....
Korea ranks second from bottom of OECD for income redistribution - Korea ranks second from bottom of OECD for income redistribution The country’s Gini coefficient, measuring income inequality, improved by 17.6 percent, about half the average of member states. 9/19/2026 - 11:20 PM
Open Benchmark Evaluates AI Thermal Models for 2.5D and 3D ICs (UTS, TU Munich, ShanghaiTech) - Researchers at the University of Technology Sydney, ShanghaiTech University, and Technical University of Munich published a technical paper titled “IC-ThermBench: An Open, Progressive Benchmark for Generalizable 2.5D/3D-IC Thermal Learning.” Abstract Excerpt: “We introduce IC-ThermBench, an open...
Embedded AI takes centre stage at EWNA 2026 - Elektor is reporting from embedded world North America 2026 in Anaheim, California, where companies are demonstrating technologies spanning FPGA-based edge…
Lawrence Semiconductor Appoints General Manager, COO: People in the News: 9/23/26 - Open Light, a photonic chip designer and manufacturer, appointed Kevin Soukup as COO and Kirk Ouellette as chief strategy officer and interim chief revenue officer. Soukup most recently served as senior vice president and general manager at GlobalFoundries. Before that, Soukup held executive roles across...
Samsung LPDDR6 validated by Qualcomm for next-gen Snapdragon platform - AI workloads are pushing cloud, edge, and mobile devices toward tighter power budgets and heavier data traffic, making memory efficiency a growing global issue. Samsung is positioning its new LPDDR6 as a response, with higher bandwidth, lower power use, and improved reliability for next-generation on-device...
Building A Connected, Contextual Data Backbone For AI-Driven Semiconductor Design - Why design teams must organize before they optimize and how to utilize a purpose-built foundation for AI-ready data management across the chip design lifecycle. The post Building A Connected, Contextual Data Backbone For AI-Driven Semiconductor Design appeared first on Semiconductor Engineering .
[Insights] Memory Spot Price Update: DRAM Spot Prices Hold Cautious Tone; DDR4 2Gx8 Drops 3.6% - According to TrendForce’s latest memory spot price trend report, DRAM spot buying remained cautious this week, with prices diverging by product. DDR4 2Gx8 branded chip prices continued to correct without attracting clear buying interest, while DDR5 price trends varied by specification. In NAND, we......
[News] BOE Joins Glass Substrate Race as Samsung Electro-Mechanics, SKC, LG Eye 2027–2028 Ramp - Glass substrate adoption by major tech players may be closer than expected. KIPOST reports that NVIDIA has asked substrate makers to accelerate development, potentially bringing adoption forward to before 2028. That is raising the stakes in the emerging supply-chain race. As Samsung Electro-Mecha...
Autonomous Quantum Transport Measurements of 2D Semiconductors by an AI Agent - Artificial-intelligence (AI) agents are beginning to enter experimental laboratories, automating experiments and accelerating scientific discovery. Herein, we introduce an AI-driven workflow in which an AI agent performs multi-step, multi-day quantum transport measurements end-to-end. Specifically, given...
ASM Launches Breakthrough Flowable Carbon Technology for the Next Era of Semiconductor Scaling - ASM, a materials discovery company and global leader in semiconductor wafer processing equipment, building on its leadership in atomic layer deposition and epitaxy, launches its XP8 Vertos Flowable Carbon, the market's first plasma-enhanced chemical vapor deposition (PECVD) flowable carbon film. The post...
Apple A20 Pro: Inside the iPhone 18 Pro’s TSMC 2nm Processor - TechInsights analyzes Apple’s A20 Pro processor, revealing TSMC N2 gate-all-around technology, expanded AI and graphics processing, and a new side-by-side memory packaging architecture.
Chip Industry Technical Paper Roundup: Sept. 22 - AI thermal modeling for 2.5D/3D ICs; chiplet and AI accelerator co-design; BEOL thermal conductivity; agentic DRC repair; RL for dense-layout routing; LLM orchestration for digital EDA; chiplet interconnects for neuromorphic computing. The post Chip Industry Technical Paper Roundup: Sept. 22 appeared...
Canadian Startup Sees Success in Space Qualification - Novigrad is forging a pathway for faster, more accessible radiation testing as a growing wave of space missions drives demand for reliable, resilient electronics. The post Canadian Startup Sees Success in Space Qualification appeared first on EE Times .
Frequency division by any number, with a 50% duty cycle output - Using the concept and leveraging the example circuits in this Design Idea, you can divide any frequency by any number divisible by 2. The post Frequency division by any number, with a 50% duty cycle output appeared first on EDN .
How AI Is Accelerating PCB Design and Prototyping - AI tools compress PCB design timelines from months to hours, enabling faster iteration cycles and letting engineers focus on innovation. The post How AI Is Accelerating PCB Design and Prototyping appeared first on EE Times .
Insight: OMNIVISION's OAX7700 Tackles EV Sentry Mode's Power Drain—and Sets Up an ICE Opportunity - OMNIVISION's OAX7700 promises to cut the power cost of always-on vehicle security features such as Tesla's Sentry Mode by moving detection to a low-power companion chip at the network edge, letting a vehicle's central compute stay asleep until a genuine event triggers it. In this Insight, TechInsights...
China’s DRAM Specialist CXMT Eyes NAND Flash Entry - China’s twin memory stars, CXMT and YMTC, move into each other’s turf to capitalize on AI-driven storage shortages. The post China’s DRAM Specialist CXMT Eyes NAND Flash Entry appeared first on EE Times .
Anthropic’s AI Slowdown, OpenAI’s $1.2T Valuation & Salesforce’s AI Bet - Anthropic's "Pace the Frontier" essay set off a week in which nearly every major AI leader, and two heads of state, weighed in on whether the frontier should slow down. Patrick Moorhead and Daniel Newman read the incident as something larger than a safety debate. Whoever sets the pace of the frontier...
Qualcomm’s Adreno X2 GPU ... - Integrated GPUs have become a crucial component in recent laptop chips, thanks to a push for better graphics performance in ultraportable devices. ...
Magnachip Announces Strategic Investment by Navitas Semiconductor - Magnachip Semiconductor Corporation, a designer and manufacturer of analog and mixed-signal power semiconductor platform solutions, today announced that Navitas Semiconductor Corporation has agreed to make a $5 million strategic equity investment in Magnachip. The post Magnachip Announces Strategic Investment...
Chip rebound deepens Korea’s trade dependence - Chip rebound deepens Korea’s trade dependence Korea’s trade exposure rose in 2024 as a strong semiconductor recovery boosted exports and reshaped industrial transactions, Bank of Korea data showed. 9/21/2026 - 01:29 AM
Reference design cuts complexity in USB-C adapters - Eggtronic has announced a 140-W USB-C Power Delivery (PD) 3.1 AC/DC reference design for notebook adapters and other USB-C powered devices. The post Reference design cuts complexity in USB-C adapters appeared first on EDN .
SOSA-aligned TVPX210 3U OpenVPX carrier board offers modular I/O - Tews Iechnologies has announced its TVPX210, a 3U OpenVPX carrier board aligning with the SOSA technical standard. It’s for system designers to integrate high-performance modular I/O into next-generation defence and […] The post SOSA-aligned TVPX210 3U OpenVPX carrier board offers modular I/O appeared...
With PEN nearing end-of-life, capacitors built on it must change - Capacitor manufacturers face a choice between dropping in a lookalike or rebuilding capacitor around what modern systems now demand. The post With PEN nearing end-of-life, capacitors built on it must change appeared first on EDN .
SEMICON INDIA 2026: India Starts Packaging Chips as Ecosystem Takes Shape - India moves five chip packaging plants into production as $13.5 billion ISM 2.0 expands manufacturing, design, and engineering capabilities. The post SEMICON INDIA 2026: India Starts Packaging Chips as Ecosystem Takes Shape appeared first on EE Times .
Kospi climbs 1.21% as rally continues before Chuseok break - Kospi climbs 1.21% as rally continues before Chuseok break The main bourse gained 63.01 points to close at 7,080.92 on a day of light trading as investors took a breather. 9/23/2026 - 03:42 AM
Chip Turf War in China - A Chinese semiconductor industry Turf War is brewing as DRAM specialist CXMT looks to get into NAND – the province of Yangtze Memory (YMTC) – while YMTC is making moves […] The post Chip Turf War in China appeared first on Electronics Weekly .
Beyond the Accelerator: Why Silicon Challengers Must Transition to Full-System Infrastructure - The recent AI Infra Summit was exceptionally jam-packed, filled to the brim with compelling talks, overlapping tracks, and emerging technologies. Amid the noise of the event, there were many excellent presentations detailing the physical realities of scaling hardware. But one presentation in particular...
Designing Multi-kW Power Delivery In 3D Heterogeneously Integrated Systems (U. of Minnesota) - Researchers at the University of Minnesota published a technical paper titled “Toward Multi-kW Power Delivery Methodologies for Advanced 3D Heterogeneous Integration.” Abstract Excerpt: “Computationally powerful systems require significant power for computation: reliable and robust power delivery...
Wave Plates Substantially Improve Ability to Filter Strong Light - Although tiny manufacturing imperfections in optical components typically go unnoticed during standard use, they can alter light in significant ways. Miniscule optical imperfections not only affect light polarization — they can also alter the spatial shape of a light beam. In a study led by Technische...
Kospi extend gains as AI optimism lifts chip shares - Kospi extend gains as AI optimism lifts chip shares The Kospi rose for a third session as Samsung Electronics advanced on renewed AI enthusiasm, while the won strengthened against the dollar. 9/22/2026 - 05:13 AM
Korea picks Texas gas plant as first project in $200 billion U.S. investment package - Korea picks Texas gas plant as first project in $200 billion U.S. investment package A $22.3 billion Texas gas power plant is the first project in Korea's $200 billion U.S. investment package, while nuclear reactor and Alaska LNG plans remain under review. 9/21/2026 - 11:01 PM SARAH CHEA
UK’s SARAH helping US Mercury space effort - BRITISH electronic equipment is playing a vital part in America’s man – in – space programme, project Mercury. So, 65 years ago, started a story in Electronics Weekly’s edition of […] The post UK’s SARAH helping US Mercury space effort appeared first on Electronics Weekly .
Coherent Launches PhotonLink™ Integrated Optics Platform for AI Infrastructu - Coherent launches PhotonLink™, an integrated optics platform that combines critical photonics technologies with end-to-end assembly, test, and manufacturing capabilities to deliver complete optical solutions for next-generation AI infrastructure.
Exports up 78% in first 20 days of September on robust chip shipments - Exports up 78% in first 20 days of September on robust chip shipments Korea's exports surged 78 percent in the first 20 days of September, led by a 259 percent jump in semiconductor shipments. 9/20/2026 - 09:58 PM
How 60 GHz Radar Improves Low-Power Presence Sensing In IoT Devices - Track occupancy and motion continuously without keeping the full sensing and processing chain active. The post How 60 GHz Radar Improves Low-Power Presence Sensing In IoT Devices appeared first on Semiconductor Engineering .
