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 🌑 🇹🇼🇨🇳 AsiaPac 
🇰🇷🇦🇺 ---  ☀️ +

↺5½d PlayNitride-158% miss 🔴

↺5½d Powerchip Semic…15% beat 🟢

↺5½d Innolux-65% miss 🔴

 Semi. Fabs and Clean Rooms
5¾h ago: AI and HBM demand continues driving fab and cleanroom expansions globally. TSMC Arizona ramps ahead of schedule while CoWoS packaging remains the key bottleneck. SK Hynix is boosting Dalian output 50% by 2027. Korea is increasing WFE imports for etch tools, and India has three new fabs in production with more coming online soon. Overall capacity build-out remains strong but constrained downstream.

30m: 100,462 Shares in Taiwan Semiconductor Manufacturing Company Ltd. $TSM Purchased by Trust Co. of Vermont

33m: ENF Technology Plans 450 Billion Won Semiconductor Materials Campus

36m: How thermal constraints are changing the semiconductor design process

54m: U.S. Futures Little Changed After Semiconductor-Led Selloff: Dow Jones, S&P, Nasdaq, Wall Street

79m: What's Going On With Intel Stock Wednesday? - Intel (NASDAQ:INTC)

2h: ASMPT Limited: An Obscure Upstream Semiconductor Company With 98% Bookings Growth In Q2

2¼h: 12,315 Shares in Lattice Semiconductor Corporation $LSCC Acquired by Compass Wealth Management LLC

3h: Diversified Trust Co. Lowers Stake in Taiwan Semiconductor Manufacturing Company Ltd. $TSM

3h: Taiwan Semiconductor Manufacturing Company Ltd. $TSM Shares Bought by GRIMES & Co WEALTH MANAGEMENT LLC

3¼h: Artemis Wealth Advisors LLC Makes New $886,000 Investment in Lattice Semiconductor Corporation $LSCC

3¼h: Altrafin AG Has $228,000 Stake in Taiwan Semiconductor Manufacturing Company Ltd. $TSM

3½h: This Stock is Needham’s Top Semiconductor Equipment Pick for 2026 By Investing.com

3½h: Water Resources Beyond Corporate Boundaries: Watershed Collaboration in Kumamoto

3¾h: CesiumAstro acquires Jariet Technologies to advance Vertically Integrated Communications and ISR from Silicon to Missions

3¾h: US Fund Inflows Top $100B For 4th Straight Month As Bonds, Semiconductor ETFs Attract Billions

4h: Semiconductor Stocks Face Renewed Selling Pressure as Credit Stress Returns

4¼h: Taiwan Semiconductor Manufacturing Company Ltd. (NYSE:TSM) Given Consensus Recommendation of \

4½h: Cathie Wood Avoids Big Memory Stocks, Says Prices Are 'Not the Normal State' - Micron Technology (NASDAQ

4¾h: Does New Semiconductor Digital Twin Push Change The Bull Case For Dassault Systèmes (ENXTPA:DSY)?

4¾h: Korean Won Strengthens Above 1400 Against USD Amid Semiconductor Growth

5h: As Micron’s semiconductor project accelerates, community pushback persists

5½h: Amorphous Silica Anti-Caking Market Growth Driven by Electronics Sector Through 2035 - News and Statistics

5½h: Flexible Epoxy Grout Formulations Market to Reach USD 2.2 Billion by 2035 on Semiconductor Fab Expansion

5½h: KDI Raises Growth Forecast to 3.2% on Semiconductor Surge

5¾h: Static Dissipative Membranes Market to Reach Index 203 by 2035 on Semiconductor Fab Build-Out

6¼h: 2 Semiconductor Stocks Worth Your Attention and 1 We Brush Off

6¼h: Alcohol Ether Frother Market Growth to 2035 Driven by Semiconductor Fab Construction - News and Statistics

6¼h: Gas Sample Bottles Market to Reach 2035 on Semiconductor Fab Demand and Tighter Purity Rules

7h: Best Semiconductor Stocks to Buy: Marvell Stock vs. Broadcom Stock

7¼h: NSTC's unmanned vehicle revenue tops 40% as semiconductor AOI and CPO fuel growth

8½h: China Stocks Fall on Semiconductor Selloff

8¾h: Clas-SiC Wafer Fab gets £1.9m grant

8¾h: Enterprise value to revenue forward of Taiwan Semiconductor Co., Ltd. – TPEX:5425

 Lumentum’s quarterly revenue more than doubles year-on-year to over $1bn  - September-quarter revenue guidance raised by $250m, reaching target model a quarter early

 Socionext taps Intel 18A-P process for high-performance compute chiplet development  - Custom System-on-Chip (SoC) designer Socionext has selected Intel Foundry's 18A-P process node to build its next-generation custom silicon, aiming to accelerate workloads across data centers, edge computing, and artificial intelligence (AI).

 ECTC call for papers  - The 2027 IEEE Electronic Components and Technology Conference (ECTC), the technical conference and product exhibition for the semiconductor packaging industry, has announced a Call for Papers. ECTC 2027 will take […] The post ECTC call for papers appeared first on Electronics Weekly .

 NXP Tech Days: sensors, virtual sensors, actuators and partners  - NXP hosted 900 guests to see 30 partners and 24 hours of technical deep dive sessions.

 Narrative: Global Smartphone Vendor Market share for 15 Countries: Q2 2026  - Samsung and Apple became the number one smartphone vendors in six countries each while Xiaomi became the number one vendor in Russia. vivo topped in India while Huawei maintained the number one vendor position in China.

 Intel Corporation to Participate in Upcoming Investor Conference  - Intel executives will participate in a fireside chat at the Deutsche Bank Conference.

 The ultimate glow up: Flexible screens reach record brightness with redesigned electrolyte and electrodes  - From a skin patch that changes color to flag abnormal blood sugar to a diver's sleeve display that stays readable underwater, the need for bright, flexible screens is growing, but no existing technology delivers the combination ...

 Beyond Moore: Co-Optimizing AI from Systems to Materials  - At the OCP APAC Summit in Taiwan , August 11–12, 2026, Applied Materials’ Subi Kengeri framed artificial intelligence as the semiconductor industry’s largest inflection point. AI demand is accelerating the industry toward one trillion dollars in annual revenue, but the keynote’s central message...

 SPIE's Optics + Photonics Showcase Features Research Breakthroughs and Commercial Innovations  - Returning to the San Diego Convention Center, the SPIE Optics + Photonics trade show will run Aug. 23-27, with the exhibition portion of the conference set for Aug. 25-27. Attendees can expect more than 1600 presentations in a multitude of...

 Thailand Revises Factory Gauge After US Transshipment Concerns  - Thailand is overhauling a key measure of factory output after US officials pointed to a widening gap between surging exports and declining domestic production as potential evidence that goods are being routed through the country to circumvent tariffs.

 Taiwanese engineers boost 2D transistor performance  - Researchers at Taiwan’s National Yang Ming Chiao Tung University and TSMC Corporate Research have tackled a key obstacle for the adoption of transistors based on 2D materials.

 New cost-effective metallized polypropylene film capacitors for industrial and automotive applications  - Panasonic Industry’s ECWFJ series combines robustness reliability, high humidity resistance and design flexibility

 Semiconductor Earnings Roundup: Revenue, Growth and Takeaways  - Company-by-company breakdown: Earnings across 80 semiconductor companies show AI-driven demand extending well beyond the usual suspects. The post Semiconductor Earnings Roundup: Revenue, Growth and Takeaways appeared first on Semiconductor Engineering .

 Combined Revenue of Top Five NAND Flash Brands Rises 77% QoQ in 2Q26; Micron Moves Up to Third Place, Says TrendForce  - TrendForce’s latest NAND Flash industry research reveals that AI server demand remained steady in the second quarter of 2026—particularly for enterprise SSDs—resulting in a supply shortage across the NAND Flash market. This allowed suppliers to raise ASPs significantly through contract negotiations....

 Raj Talluri Named CEO At K&S  - Talluri, a semiconductor veteran, has been named president and chief executive of Kulicke and Soffa Industries (K&S)

 Rise Design Automation at DAC 2026  - AI was everywhere at DAC 2026, so I stopped by the booth of Rise Design Automation to chat with Ellie Burns to hear what’s new this year. Ellie shared that Rise DA has added a new AI-powered flow to go from specification to a High Level Synthesis (HLS) model, to a RTL model. The reason for using a HLS...

 Controlling Voltage Droop In 2.5D PIM Chiplet Architectures (Washington St., UW-Madison)  - Researchers from Washington State University and University of Wisconsin–Madison published a technical paper titled “ReVolt: Power Delivery Network-Aware Voltage Droop Control for 2.5D PIM Chiplet Architectures.” Abstract “Processing-in-memory (PIM)-based 2.5D multi-chiplet platforms are enablers...

 EP 188: The Wild West of Optical, Cisco's AI Hack, and Is Compute an Investable Asset  - In this episode of The Circuit, hosts Ben Bajarin and Jay Goldberg break down the evolving structural dynamics across optical networking, semiconductor manufacturing, and AI infrastructure financing. They begin by analyzing the divergent earnings from Lumentum and Coherent, pointing to margin pressures...

 What caught your eye? PCB supplies, Intel memory, Laser links  - Supply issues around PCBs, that Intel may be re-entering the memory sector, and the first in-flight optical communications link between a re-entry spacecraft and an orbiting satellite... The post What caught your eye? PCB supplies, Intel memory, Laser links appeared first on Electronics Weekly .

 Government must resolve labor disputes over 'Yellow Envelope' act and more  - Government must resolve labor disputes over 'Yellow Envelope' act and more The government must clarify labor rules and balance flexibility with protections to keep strategic investment at home. 8/17/2026 - 11:01 AM Opinion Desk

 XPU to CPU ratio in datacentres transitioning from 10:1 to 1:1  - The rise of inference workloads is driving new demand and introducing network requirements that differ from those associated with training workloads, says Dell’Oro. This shift is leading to significant expansion […] The post XPU to CPU ratio in datacentres transitioning from 10:1 to 1:1 appeared first...

 xEV power chip market to more than double to $14.5bn by 2031  - SiC displacing silicon in powertrain as batteries move from 400V to 800/1000V

 From Chips to Cash: Taiwan Shares the Gains From the AI Boom  - Original Article By SemiVision Research [Reading time: 5 mins]

 Liquid Cooling Becomes Standard for High-End AI Infrastructure, with Penetration Expected to Reach 53% in 2026, Says TrendForce  - Liquid cooling penetration among AI chips is projected to rise to 53% in 2026 and approach 60% in 2027. High-end chips from NVIDIA, AMD, and Google are driving the adoption of liquid cooling. NVIDIA’s rack-scale solution shipments are expected to double in 2026, while more than 80% of Google’s AI...

 ☀️ 🇩🇪🇨🇭🇫🇷 EMEA 
🇮🇱  ---  🌑

 South Korea, U.S. Face Deadlock in First Investment Project Talks  - The U.S. demand for advanced memory semiconductor investments is another variable. While Cheong Wa Dae denied it, reports claimed the U.S. requested semiconductors as the first investment project.

 Jeonnam Gwangju denies debt shift, boosts finances with 5 trillion won support

 Health Minister Jeong Postpones Pension Rebalancing Citing Market Volatility

 Jung Eun-kyeong defends NPS rebalance delay as market-driven, not political

 AI Investment Paradox Slams Tech Stocks

 KOSPI Plummets 5.8% as U.S. Treasury Yields Hit 19-Year High

 US yield surge drives South Korea stocks to steep sell-off as foreigners exit

 South Korea's Long-Term Bond Yields Hit Record Highs

 Chinese Government Eases Nvidia H200 Imports for Tech Firms

 China eases imports as ByteDance, Tencent secure limited Nvidia H200 chips

 Semiconductor rebound drives South Korea’s KOSPI profits and sales surge

 KDI lifts Korea growth forecast but warns employment gains will lag

 South Korea weighs future response fund to channel surplus into youth and growth

 Jeonnam-Gwangju Education Shift to Written, Essay Evaluations

 Korea Development Institute Raises Growth Forecast to 3.2% on Semiconductor Boom

 KOSPI Firms' Net Profits Quadruple, Led by Samsung, SK Hynix

 Samsung, SK Hynix Drive KOSPI Sales Past 2,000 Trillion Won

 Won-Dollar Rate Drops Below 1,400 for First Time in 10 Months

 Won strengthens to 1,300s as Fed pause bets rise, exporters sell dollars

 KDI Lowers Employment Forecast to 110,000

 KOSPI Defends 200-Day: Short Rebound, EPS Determines Medium-Term Trend

 KOSPI Plummets 6% on U.S. Semiconductor Slump, Triggers Circuit Breaker

 iA’s 10 Billion Won Shareholder Capital Increase Funds NeoCube AI Data Centers

 iA raises 10 billion won to expand Korea modular AI data centers

 Mobilint Supplies Domestic NPUs to Navy's 50 Ships

 Mobilint equips 50 South Korea Navy ships with domestic NPUs

 Ai, chips, and robots drive record Korea venture funding surge

 Won-Dollar Rate Rises 1.7 to 1,413.5

 Won weakens as Korea stocks fall and Middle East tensions lift dollar

 KT rolls out sovereign AI server in South Korea with domestic chips and LLM

 New CEO for SIA  - The SIA has appointed Michael Robbins (pictured)to be its president and CEO as from Oct. 1. Robbins succeeds John Neuffer, who announced his departure in January following nearly 12 years […] The post New CEO for SIA appeared first on Electronics Weekly .

 Baidu says Chinese buyers want local AI chips due to ‘supply chain’ issues  - It seems like Nvidia’s not getting back into the Middle Kingdom anytime soon

 應材聚焦AI先進封裝 SEMICON Taiwan秀PLP、混合鍵合新技術  - AI帶動高效能運算需求快速成長,半導體技術加速朝3D結構及系統級整合發展,材料、製程、設備與封裝協同優化的重要性同步提升。應用材料(Applied Materials)將於SEMICON Taiwan 2026聚焦先進製程、異質整合、面板級封裝(PLP)及智慧製造等四大領域,並揭露混合鍵合、數位微影及代理式AI等最新技術布局,搶攻AI晶片持續升級帶動的新一波設備需求。...

 Polarization-Dependent Raman Selection Rules in Sb _2 _2 S _3 _3 from First Principles and Experiment  - …) is a semiconductor composed of quasi-one-dimensional ribbon-like structural units, which give rise to pronounced structural anisotropy in the bulk crystal. Despite growing interest in Sb _2 _2 S _3 _3 , in particular Sb _2 _2 S _3 _3 thin films, a detailed understanding of its symmetry-based lattice...

 US urged to follow China’s lead in treating data as an economic asset  - Congressional advisory panel urges Washington to develop national strategy as Beijing’s data push gives Chinese firms edge in AI, robotics

 PolyShot Camera Focuses On Nostalgia  - Although we personally have yet to see anyone brandishing an old digital point-and-shoot camera, we hear they’re back in vogue. Why, though? People are nostalgic for that image quality. While …read more

 PDF Solutions’ Exensio Was Built for Semiconductor Analytics. The New Exensio Aurora Architecture Is Built for Semiconductor Intelligence.  - The semiconductor industry doesn’t have a shortage of data. It has a shortage of ways to turn that data into useful manufacturing insights quickly enough to matter.

 Success of three megaprojects hinges on execution  - Success of three megaprojects hinges on execution Semiconductor, AI and robotics investments can reshape Korea only if phased planning, market discipline and regional talent development prevent costly overinvestment. 8/18/2026 - 11:01 AM Opinion Desk

 Light Sheet Microscopy System Documents Seizures in Real Time  - A seizure is a sudden, overwhelming wave of electrical energy passing through the brain in a matter of seconds. It occurs fast enough that it’s been almost impossible to fully capture where these electrical bursts originate, how they move, and...

 US Stocks Fall as Rising Oil Prices, Yields Offset Chip Gains  - US stocks dropped on Monday as long-term Treasury yields extended their recent climb and oil ticked higher. Chipmakers notched gains as details of Anthropic’s surging sales growth stoked bullish sentiment around AI.

 Qorvo’s Dr. Peter Zampardi Named IEEE Fellow  - Qorvo® (Nasdaq: QRVO), a leading global provider of connectivity and power solutions, today announced that Dr. Peter Zampardi, Fellow in Qorvo's GaAs Development organization, has been named an IEEE Fellow, one of the highest distinctions awarded by the Institute of Electrical and Electronics Engineers...

 Self-Publishing a Book Is Easier (and Harder) Than You Think (Part 1)  - I have exciting news! Well, it’s exciting for me. As I pen these words, I’ve just self-published my first book: The Life of Clive . Now, this isn’t the first book I’ve had published (search for “Clive Maxfield” on Amazon if you want to see more), but it’s the first one I’ …

 LG Electronics lands first OSAT order for chip packaging LDI  - LG Electronics has secured its first order for laser direct imaging (LDI) equipment used in semiconductor packaging, marking an early commercial milestone as it expands into chip packaging.

 Why Standardized Interfaces Are Critical to Accelerating Humanoid Development  - Humanoids won’t scale on AI hype alone; standardized MIPI interfaces can cut power, wiring, and cost. The post Why Standardized Interfaces Are Critical to Accelerating Humanoid Development appeared first on EE Times .

 Do we still need schematic diagrams for analog circuits?  - The highly integrated ICs have changed the appearance of the analog-circuit schematic diagrams over the years. The post Do we still need schematic diagrams for analog circuits? appeared first on EDN .

 ASML shouldn’t overplay its hand with opportunistic price increases  - By focusing on cost savings, improving the reliability and performance of its systems, it will automatically capture a larger share of the pie.

 Humanoids will take off when they are deemed safe, NXP exec says  - NXP sees advanced robots as an extension of its expertise in parts for automotive.

 Transport-defined photodetection through electrically selectable nonequilibrium carrier transport  - …selects how photoexcited carriers are redistributed, escape and are collected, creating complementary response functions within one shared active region. In a GaAs/AlGaAs semiconductor ratchet, light-driven ratchet transport defines the response at 0 V, whereas the spectral evolution at -2 V is consistent...

 TSMC Follows the Money: More Than 75% of Its Revenue Now Comes From U.S. Customers  - Original Article By SemiVision Research [Reading time: 6 mins]

 Kiev To solve Moscow’s Problems  - THE “Kiev ” has been developed in the Computer Centre of the Academy of Sciences here in Moscow. It is a general purpose digital computer and is designed to solve […] The post Kiev To solve Moscow’s Problems appeared first on Electronics Weekly .

 COHERENT BEGINS CUSTOMER SAMPLING OF 300mm HIGH THERMAL CONDUCTIVITY SILICON CARBIDE SUBSTRATES FOR AI INFRASTRUCTURE  - Coherent announced that it has begun sampling of its 300mm high thermal conductivity silicon carbide (SiC) substrates to leading AI semiconductor partners.

 UMass Amherst Engineers Make Edge AI More Efficient by Redesigning Both Algorithm and Hardware  - System leverages hyperdimensional computing algorithms and analog in-memory computing hardware to achieve quick, accurate processing. The post UMass Amherst Engineers Make Edge AI More Efficient by Redesigning Both Algorithm and Hardware appeared first on Semiconductor Digest .

 Everspin to Participate in the Lytham Partners 2026 Consumer & Technology Investor Summit on August 18, 2026  - CHANDLER, Ariz.--(BUSINESS WIRE)--Aug. 17, 2026-- Everspin Technologies, Inc. (NASDAQ: MRAM), the world’s leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM)…

 Adapter makes Google’s wireless Android Auto a reality  - Bluetooth and Wi-Fi combine to untether smartphone-to-car connections…this time with a Google, versus Apple, angle. The post Adapter makes Google’s wireless Android Auto a reality appeared first on EDN .

 ChipAgents Leads the AI Revolution at DAC 2026  - I believe this year’s DAC will be viewed as the time and place where EDA experienced a major shift. That is, the shift from the value of tools and methodology to the value of agentic design flows powered by highly trained agents. The design community will clearly need the tools and methodologies that...

 Nokia retools NXP’s Chandler fab for InP manufacturing  - Nokia has agreed to acquire NXP Semiconductors’ fab in Chandler, Arizona, intending to convert the RF GaN facility to manufacture InP optical components.

 Eolian announced that Flint Grid, a 200MW, 5+hour duration grid-scale battery energy storage system in Jersey Township, Licking County, Ohio, has started construction  - Eolian’s proven and enviable track record is evidenced by the successful funding and development of nearly 30 GW of operating…

 🌔 🇺🇸 Americas 
🇨🇦 ---  🌔 +

9¼h Wolfspeed,

↺6½d Coherent2.8% beat 🟢

 China fund managers stick with AI, chips in August despite July sell-off, survey finds  - Investor interest in defensive shares also surges across Asia as more try to hedge against the downside risks of AI investments

 Taiwan’s AI \u201CFive Tigers\u201D: From Silicon to Servers, the Supply Chain Behind AI  - Original Article By SemiVision Research [Reading time: 11 mins]

 Blog Review: Aug. 19  - Memory tagging; digital twin of the Moon; packaging moves front-and-center; streaming sensor data. The post Blog Review: Aug. 19 appeared first on Semiconductor Engineering .

 Cerebras's Next Generation CS-4: Fast Just Got Faster  - Double the Performance with Double the Power…

 Baumer Opens Innovation Lab For Sensor Test and Verification  - Baumer has established a 1300 sq m Innovation Lab to support test and inspection routines for sensors coming from the Baumer R&D Competence Centers. The lab occupies the basement of the Innovation Center in Frauenfeld and is outfitted with state-of-the-art equipment to support around the clock simulations...

 Cerebras Supernova 2026: Irrational Recap  - Some useful information. Meaningful progress.

 Japan chip startup targets AI boom as industry focus turns to materials  - University of Tokyo spinout expands production as customer projects advance

 Analysis: Automotive Software Market Outlook for the SDV  - TechInsights examines the automotive software market as vehicle architectures transition from distributed, hardware-centric designs to centralized and zonal software-defined platforms. The report assesses how architectural consolidation is increasing demand for embedded software, middleware, virtualization,...

 SRC Launches Chip/Packaging Consortium  - The U.S. R&D group launched the Semiconductor and Packaging Advanced Research Consortium

 The Ultimate Glow Up: NUS CDE Researchers Push Flexible Display Brightness to New Records  - From a skin patch that changes colour to flag abnormal blood sugar, to a diver’s sleeve display that stays readable underwater, the need for bright, flexible screens is growing, but no existing technology delivers the combination of simplicity, low power and robustness these applications need. The post...

 six five summit 2026 openers  - Marc Benioff opens this year’s Six Five Summit — but the CEOs, executives, and product leaders who follow him each morning are the ones setting the frame for every conversation that comes after.

 Coherent sampling 300mm high-thermal-conductivity silicon carbide  - Substrates target thermal management requirements of AI and HPC systems

 Smartphone king Xiaomi's profits drop 43% on memory crunch, weak demand  - Handset margins shrink while EV ambitions deepen capital strain

 Apple’s Anti-AI Position Is Becoming Stock Market Baggage  - Apple Inc.’s status as an anti-artificial intelligence play helped the stock tear through the first half of the year as investors grew skeptical of the AI trade. But that sentiment has flipped, and the shares are struggling.

 AI silicon: Package becoming system architecture  - Here is why AI systems are moving from individual package choices to integrated technology platforms. The post AI silicon: Package becoming system architecture appeared first on EDN .

 Moody’s nearly doubles Korea’s 2026 growth forecast to 3.5% on chip boom  - Moody’s nearly doubles Korea’s 2026 growth forecast to 3.5% on chip boom The ratings agency cites surging semiconductor exports and expects the chip upcycle to continue through at least mid-2027. 8/18/2026 - 02:17 AM News Team

 [News] CXMT DDR5 Reportedly Tops 9,000 MT/s on AMD Platform, Narrowing Performance Gap With Global Leaders  - China’s DRAM maker CXMT is advancing at a rapid pace. According to TechPowerUp, Colorful’s CXMT-based DDR5 memory has surpassed 9,000 MT/s on an AMD platform, highlighting improving overclocking potential. A 48GB (24GB×2) iGame Shadow II kit running on Colorful’s iGame X870E VULCAN W OC mothe......

 [News] MLCC Lead Times Diverge as High-End Products Stretch to 5–10 Months; Tightness May Extend Into 2027  - AI-driven demand is tightening the MLCC market, with supply conditions increasingly diverging between standard and high-end products. According to ETNews, lead times for standard-case MLCCs remain relatively stable at 14–18 weeks, or about 3.5–4.5 months, while high-capacitance and high-voltage ......

 Simplifying Secure Industrial Connectivity with the New MCX A5 MCUs  - Explore MCX A5 MCUs with 10BASE-T1S Ethernet, topology discovery and post-quantum security for simpler, secure industrial edge connectivity..

 Novel semiconductor neuron tunes noise to selectively process signals  - In electronic devices, irregular fluctuations in signals are generally referred to as "noise." Because noise interferes with accurate information processing, conventional semiconductor technology has mainly treated it as ...

 Why the Advanced Packaging Semiconductor Market No Longer Moves as One  - Advanced packaging does not move as a single market. See why packaging strategy increasingly depends on workload and application-based market data rather than on a single-processor view.

 NVIDIA’s $500B AI Bet, Anthropic’s Watermark Gamble & the Edge AI Debate | Ep. 315  - NVIDIA mobilizes over $500 billion in third-party capital to finance AI infrastructure, Anthropic doubles down on data-center ownership and mandatory content watermarking, and Patrick Moorhead and Daniel Newman debate whether distributed AI at the edge is finally ready to accelerate, all on Ep. 315 of...

 Yole Group’s MEMS Industry 2026 report confirms: Bosch is one of the top leaders in the MEMS market  - The latest Status of the MEMS Industry 2026 report by Yole Group,…

 The Transformation of the Semiconductor Assembly and Test Business  - TSMC is sharing the wealth for good reason

 Fluid-Side Observability Expands AI Hardware Reliability  - As AI systems increasingly rely on liquid cooling, coolant condition is emerging as a reliability signal. The post Fluid-Side Observability Expands AI Hardware Reliability appeared first on EE Times .

 Precision Under Pressure: Rethinking Bond Reliability In High-Density Semiconductor Test  - Bond testing is emerging as a critical control point for long-term performance and yield. The post Precision Under Pressure: Rethinking Bond Reliability In High-Density Semiconductor Test appeared first on Semiconductor Engineering .

 Measurement basics: A field guide to instrument interfaces  - Understanding GPIB, USB, LXI, PXI, and VXI interfaces equips engineers to unlock the full potential of their T&M tools. The post Measurement basics: A field guide to instrument interfaces appeared first on EDN .