Re-Spins Get You Fired, Says Intel CEO Lip-Bu Tan - Intel CEO Lip-Bu Tan’s statement that “re-spins get you fired” reflects the enormous pressure facing semiconductor companies as chip complexity, manufacturing costs, and competitive demands continue to rise. In the semiconductor industry, a “re-spin” occurs when a chip design must be revised...
AI and ultralow-energy lasers enable an ultrafast authentication system - The security of modern communications heavily relies on systems that can rapidly and reliably verify users and the devices they are using. This process, known as authentication, essentially entails confirming that users or ...
Dstl connects UK’s first optical downlink from space - The UK’s Defence Science and Technology Laboratory (Dstl) has demonstrated the country’s first successful download of data from space using a deployable laser communications ground station. During a 90-second satellite pass, says the defence organisation, “many gigabits” of data were downloaded...
Arm deepens ties with Taiwan chip designer QBit around edge AI and cybersecurity - Arm EVP and Chief Commercial Officer Will Abbey visited QBit Semiconductor's Taiwan headquarters on May 27, signaling deeper cooperation that could shape future chip design for edge AI, physical AI, and quantum-computing cybersecurity. The visit highlights how platform alliances are increasingly influencing...
/C O R R E C T I O N -- SEMIFIVE/ - May 7, 2026 /PRNewswire/ -- SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, and ICY Tech, a Chinese AI semiconductor company, today announced the successful tape-out of next-generation Edge AI SoC jointly developed utilizing
[Blog] Always-On Vehicle Monitoring—Without the Battery Drain - Drivers expect their vehicles to be safe whether they are behind the wheel or not. But delivering on that expectation, with a system that monitors, detects, and responds around the clock, has proven harder than it sounds. Last year saw car thefts in the US drop to their lowest level in decades, down 23%...
Swapping Out Chiplets: I/Os Vs. Compute - Key Takeaways: Companies can save time and money by swapping out a compute, memory, or I/O chiplet to gain technology improvements, while keeping the other dies stable. Chip architects may choose to keep their I/Os stable and swap out compute to move from a 5nm process node to 3nm to achieve performance...
De-commingling (?) LAN equipment: It’s all in what you call it - A welcome career transition (and employer-responsibility expansion) begs for a hardware-plus-software evolution. Hold his beer; this engineer’s got this. The post De-commingling (?) LAN equipment: It’s all in what you call it appeared first on EDN .
IBM Cloud Announces Sovereignty Risk Profile - New tool can help enterprises document control, demonstrate their compliance, and build greater trust in an AI-driven world Across global enterprises, digital sovereignty has become a defining...
AI in Design Verification: From Experimentation to Measurable Capability - AI in design verification no longer asks if AI helps tasks, but does it measurably improve real verification flows? The post AI in Design Verification: From Experimentation to Measurable Capability appeared first on EE Times .
Wax on, wax off - The printing press, the calculator and the internet haven’t fundamentally changed how we educate our youngsters, and neither will AI, argues Martijn Heck.
Navigating the AI Wave in Education with Help from Google and MediaTek - With the rapid rise of AI, both students and teachers are experiencing a major technological shift. Educators like Ms. Fang, from Sheng-Li Junior High School, emphasize that the goal of modern education is to build digital resilience and the ability to adapt to rapid changes in information...
MediaTek to Empower the Agentic AI Era with Edge-to-Cloud Tech at Computex 2026 - TAIPEI, Taiwan - May 28, 2026 – MediaTek will showcase its next-generation edge-to-cloud technologies and solutions for the Agentic AI era at Computex 2026. Themed "AI Without Limits," booth highlights include the award-winning Wi-Fi 8 product series; edge computing platforms empowering Agentic AI across...
NY Creates and its Albany NanoTech Complex Featured in Advanced Manufacturing Article - NY Creates, and its Albany NanoTech Complex, was featured in an article by Advanced Manufacturing. NY Creates Communications Director, Steve Ference, spoke with Advanced Manufacturing: “Ference describes the site’s mission as threefold: ‘We engage in and support world-class semiconductor-based r&d...
The impact of nanoplastics on neurons may depend on their size - Smaller plastic particles have more effects on neurons, the key information processing cells of the brain, new research from the University of Eastern Finland shows. In the study, neuronal cells were exposed to polystyrene ...
Gartner Says Supply Chain Confront Geopolitical and AI Challenges - Gartner Supply Chain Symposium highlights strategies to navigate chaos, orchestrate agility, and accelerate Innovation. The post Gartner Says Supply Chain Confront Geopolitical and AI Challenges appeared first on EE Times .
Honda invests in Nexeon - Nexeon, a leader in silicon anode materials for the battery industry, has had a a new investment from Honda. “We are pleased to welcome Honda as a shareholder as we enter an exciting phase and commercialise our technology, and we look forward to collaborating closely with them and our other partners...
Learn How llmda Uses Agentic AI to Generate Hardware Docs & Keep Them Consistent - Accurate, complete, and consistent technical documentation is a critical element of success for any embedded system design project. This includes IP, SoCs, and the associated hardware and software infrastructure. When documentation contains errors, the consequences go beyond engineering inefficiency....
Nvidia CEO Jensen Huang hosts trillion-dollar dinner for Taiwan AI suppliers - Nvidia CEO Jensen Huang hosted another "trillion-dollar dinner" at Juan Yau Restaurant in Taipei, Taiwan, on May 28, with chairmen and presidents from multiple Taiwanese artificial intelligence (AI) server and semiconductor supply chain companies attending and posing for group photos.
Wiwynn and Ecosystem Partners to Showcase Co-Packaged Optics Innovations at Computex 2026 - said D.D. Hu, General Manager of FOCI. "Leveraging our core optical interconnect technologies, developed through years of collaboration with the semiconductor industry, we will work together to address key challenges in silicon photonics packaging, including reflow compatibility and system pluggability....
IBM and Abertis are Driving the Future of Mobility with a Global Technology Modernization Agreement - IBM has announced a new five-year global agreement with Abertis, a leading infrastructure and mobility management group, to modernize Abertis's technological infrastructure. The collaboration includes migrating to SAP S/4HANA, and aims to improve system scalability, reliability and user experience across...
Open CPX Sets the Stage for More Flexible, Scalable Connectivity - Co-packaged connectivity is coming. The Open CPX MSA (Co-packaging Multisource Agreement) is working to simplify adoption. The consortium, which includes Marvell and other leaders in connectivity, is developing specifications and standards for solutions for integrating near-packaged optical (NPO) and/or...
IQE looking at 20%+ FY 2026 growth - IQE’s financial year 2025 saw a decrease in revenues from 2024’s £118m to £97.3n. Photonics revenue of £57.1m (FY 2024: £49.9m) increased 15% year-on-year driven by funding releases for certain US military and defence programmes in H2 2025 and continued growth in AI and data centre-related markets....
Join Our Webinar on Emerging Carbon Dioxide Utilization - Join IDTechEx Senior Technology Analyst Eve Pope on Thursday 4 June for the expert-led webinar, "Emerging Carbon Dioxide Utilization: Chemicals, Fuels, Concrete, and the CCUS Business Case". Choose your preferred time zone - the webinar runs three times in one day.
VelocityNET™ Industrial Ethernet Solutions - Designing for harsh industrial environments demands more than standard Ethernet. This blog post explores industrial Ethernet fundamentals, including TSN and network redundancy, and highlights our VelocityNET™ solutions that help engineers build low-latency, reliable and scalable automation networks....
[Blog] A New Approach to Platform Management with Compute and FPGA - ASPEED’s management compute and Lattice’s low power programmability come together in a single device — the configuration modern platforms have been asking for. Server architectures aren’t getting any simpler. AI workloads keep pushing platforms toward disaggregation, modular I/O, and faster iteration...
ByteDance's chip ambition grows with US$70 billion capex plan - ByteDance is considering a sharp increase in capital spending this year as the TikTok owner pushes deeper into artificial intelligence infrastructure — a move that could make it one of China's most aggressive investors in data centers, servers, and custom chips.
AI’s new approach to protein engineering - A new approach to protein engineering is emerging in which generative AI models and automated laboratory systems are tightly integrated, says Imec, it is called AI-driven lab-in-the-loop protein engineering. Instead of relying on incremental mutations, AI models can propose large batches of novel protein...
Scientists Create Tiny Chip That Uses Light Instead of Electricity To Process Information - Researchers have created a compact chip that manipulates light-based quantum information with remarkable precision, advancing the development of next-generation photonic and quantum technologies. What if computers could process information using light instead of electricity? Researchers at Monash University...
Micron Technology to Report Fiscal Third Quarter Results on June 24, 2026 - BOISE, Idaho, May 27, 2026 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU) announced today that it will hold its fiscal third quarter earnings conference call on Wednesday, June 24, 2026, at 2:30 p.m. Mountain time. The call will be webcast live at http://investors.micron.com/.
SECO brings Modular Vision 10.1 MX95 HMI platform to market - SECO it taking pre-orders for its Modular Vision 10.1 MX95, an industrial HMI platform it unveiled at embedded world 2026. Featuring real-time control, and on-device AI acceleration, the interface is powered by the NXP i.MX 95 applications processor. The company describes it as a scalable, AI-ready, and...
SRAM compilers targeting automotive SoCs on advanced nodes - Processor IP garners the most attention in SoC design, but it’s not the only IP category begging for smart choices. Every processor core needs to be fed with data; however, frequent off-chip DRAM access incurs a large clock-cycle penalty each time. Architects now want SRAM blocks distributed throughout...
Monolithic three-dimensional integration of silicon transistors - Uniformly doped, ultrathin single-crystalline silicon nanomembranes can be vertically stacked at low temperature using a roll-transfer-printing process that is scalable to wafer scale and tolerant to substrate topology and surface roughness for constructing high-performance monolithic three-dimensional...
Nexans pilots DC microgrid for electrified buildings - Nexans has commissioned the first phase of a direct current (DC) microgrid pilot at its AmpaCity research and development centre in Lyon, France. The demonstrator…
Nexperia hooks up with Polar for MOSFET fab - Nexperia is to manufacture power MOSFETs at Polar Semiconductor, the US foundry. Polar , runs a fab in Minnesota, originally built in 1969, which has extensive experience in power processes. With over six decades of semiconductor manufacturing and a 25+ year heritage in automotive production, Polar is...
How Precise Must We Be? - To how many significant digits does Pi (and its peers) remain relevant? The post How Precise Must We Be? appeared first on EDN .
Corporate - James McBreen, Senior Programme Manager, Technology Innovation for Conservation at IUCN, spoke at Huawei's Innovative Data Infrastructure Forum 2026 on the power of technology and innovation in nature conservation.
AWS lands US$6 billion Snowflake deal as AI shift brings CPUs into chip battleground - Amazon Web Services (AWS) won a US$6 billion AI infrastructure agreement with Snowflake, announcing expanded deployment of its in-house Graviton CPUs and AI compute capacity as cloud providers shift focus beyond GPU-centric large language model workloads. Executives said the deal, reported by Bloomberg...
Bring Back Your Bose with an ESP32 - It’s become a familiar theme over the last couple of decades — hardware is rendered useless when its manufacturer pulls the cloud service on which it depends. This is particularly …read more
This Circuit Board Can Rewire Itself - I want you to close your eyes and imagine something. I’ll tell you when you can open them again. Hmmm, that won’t work, will it? OK, let’s try something different. Imagine you’ve closed your eyes and you are visualizing a printed circuit board (PCB) from the future, except the ‘P’ is a misnomer...
Photronics Reports Second Quarter 2026 Results - BROOKFIELD, Conn., May 28, 2026 (GLOBE NEWSWIRE) — Photronics, Inc. (NASDAQ:PLAB), a worldwide leader in photomask technologies and solutions, today reported financial results for its second quarter of fiscal year...
ASE launches first automated PLP line, eyes 1H27 production - Advanced Semiconductor Engineering (ASE) has unveiled its industry-first automated panel-level packaging (PLP) system, a development poised to reshape global artificial intelligence (AI) and high-performance computing supply chains by significantly improving chip integration speeds and manufacturing efficiency...
Piezoelectric Ceramics Market worth $2.10 billion in 2031 - Exclusive Report by MarketsandMarkets™ - sustainable electronic technologies. Asia Pacific remains the largest and fastest-growing market, driven by large-scale electronics manufacturing, semiconductor production, EV expansion, 5G infrastructure development, and growing defense modernization activities across China, Japan, South Korea, and India....
Taming the beast: Memory efficiency in an AI/crypto world - The careful selection of energy-efficient components like voltage regulators plays a vital role in reducing energy use of a data center. The post Taming the beast: Memory efficiency in an AI/crypto world appeared first on EDN .
HUAWEI introduit la loi d'échelle Tau pour les futures puces - lors du Symposium international 2026 de l'IEEE sur les circuits et les systèmes qui s'est tenu à Shanghai, He Tingbo, Président du département Semiconductor Business de HUAWEI, a présenté la loi d'échelle Tau (τ), qui succède à la loi de Moore pour orienter le développement des semi-conducteurs.Le...
Photonics-Based Metrology Solution Wins Lam Capital Venture Competition - The 2026 Lam Capital Venture Competition highlighted breakthrough semiconductor innovations with Lightfinder winning for its chip-scale optical sensing technology designed to enable real-time, in-tool metrology. This event showcased Lam Research's leadership in supporting startups that build the AI backbone...
[News] US AI Firm Fabric. AI to Demonstrate Micro LED Optical Interconnect Platform by Late 2026 - U.S.-based AI infrastructure company Fabric. AI recently announced plans to demonstrate its flagship Micro LED optical interconnect platform by the end of 2026. Fabric.AI is developing a fabless semiconductor technology stack aimed at next-generation AI data centers. Its core product, Neural I/o�......
Synopsys Posts Financial Results for Second Quarter Fiscal Year 2026 - a strong second quarter with solid execution and strength across the business," said Sassine Ghazi, Synopsys president and CEO. "AI is scaling semiconductor demand, architectural diversity and complexity of chips and the systems they power - driving demand across our portfolio. Our momentum, leadership...
A closer look at Huawei’s chip design workaround without EUV - Chinese tech firm’s 3D stacking breakthrough defies the U.S. sanctions on the latest EDA and lithography tools. The post A closer look at Huawei’s chip design workaround without EUV appeared first on EDN .
