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 Semiconductors rewrite market history as Intel leads the charge  - Detroit Free Press

 Taiwan Semiconductor Manufacturing Company Ltd. $TSM Shares Sold by Matthews International Capital Management LLC

 BE Semiconductor Industries (OTCMKTS:BESIY) Upgraded by Zacks Research to Strong-Buy Rating

 Assessing BE Semiconductor Industries (ENXTAM:BESI) Valuation After A Powerful Share Price Rally

 Semiconductor stocks are on a historic winning streak. Why it’s time to cash in.

 Geneos Wealth Management Inc. Grows Position in Taiwan Semiconductor Manufacturing Company Ltd. $TSM

 India accelerates semiconductor drive with landmark 3D packaging project

 Cypress Asset Management Inc. TX Acquires 1,439 Shares of Taiwan Semiconductor Manufacturing Company Ltd. $TSM

 Intel climbs ahead of earnings as semiconductor and software stocks continue to diverge

 Taiwan Semiconductor likely to report 'strong' quarter, guidance, aided by AI: Wedbush

 Samsung says it’s on track for 2026 opening

 Semiconductor Peltier Module Market Analysis By Application,

 Intel's Q1 report puts chip sector in focus: Here are 10 semiconductor stocks with lowest forward P/E

 Semiconductor Wafer Level And Advanced Packaging Inspection

 Approach Retirement Advisors LLC Acquires New Holdings in Taiwan Semiconductor Manufacturing Company Ltd. $TSM

 Semiconductor Failure Analysis Services Market to Reach

 Taiwan Semiconductor (TSM) and ASML’s post-earnings Price Movements May be a Sign of What’s to Come from Chip Firms

 Semiconductor Wafer Polishing Pad Market Analysis

 Calamos Wealth Management LLC Boosts Stock Holdings in Taiwan Semiconductor Manufacturing Company Ltd. $TSM

 Omdia Raises 2026 Semiconductor Forecast to 62.7% as AI Drives Global Memory Crunch

 Advanced Optics Material Market To Reach New Heights by 2035 on Photonics and Semiconductor Growth - News and Statistics

 West-MEC launches first-of-its-kind cleanroom lab

 How Google is playing semiconductor kingmaker—and making Marvell a winner

 Calamos Advisors LLC Has $35.07 Million Stock Position in Taiwan Semiconductor Manufacturing Company Ltd. $TSM

 The EU Cyber Resilience Act: A New Reality for Device Manufacturers  - Driving automation introduces increasingly complex perception challenges. Vehicles must reliably detect vulnerable road users, distinguish closely spaced objects and operate consistently in dense traffic, poor weather or low‑visibility environments.

 INFICON reports strong first quarter and raises guidance  - Ad hoc 24 Apr 2026 INFICON reports strong first quarter and raises guidance «Ad hoc announcement pursuant to Art. 53 LR»

 CPUs regain central role in AI as Intel highlights growing importance alongside rising ASIC demand  - Intel executives are placing renewed emphasis on the central role of CPUs in artificial intelligence (AI), arguing that shifting workloads are elevating their importance even as specialized chips gain traction. Management said the transition from model training to real-world deployment is driving stronger...

 Liteon startup platform sharpens edge AI ecosystem focus for 2026 growth reset

 EU targets Android access rules, putting Gemini integration edge at risk

 Microsoft and Meta announce workforce reductions amid heavy AI investment

 Strait of Hormuz disruption puts semiconductor supply chains at risk as photoresist shortages grow

 STMicroelectronics tops 1Q26 guidance, sees data center revenue surpass US$1 billion by 2027

 TSMC CoPoS equipment orders face reshuffle with legal turmoil at Taiwanese equipment maker

 Google splits AI chips into training and inference TPUs, signaling shift toward workload-specialized AI infrastructure

 M31 and TSMC complete eUSB2V2 tapeout on N2P process

 Memory price surge reshapes global notebook competition in 2026

 DeepSeek previews V4 models with Huawei integration, signaling shift in China's AI stack

 Chipmakers face higher cost pressure as packaging outpaces foundry price hikes

 AI PCB supply crunch squeezes margins on rising materials and energy costs

 Zhen Ding to invest CNY40 billion in Huai'an to expand high-end PCB capacity

 Commentary: DeepSeek rethinks funding strategy under talent drain and AI race

 SK Hynix deepens TSMC ties with HBM4, advances memory-logic integration

 Texas Instruments eyes further price hikes amid strong data center, industrial chip demand

 Heran's three-brand strategy targets all appliance segments, with Yamada brand driving 2026 growth

 Tesla's hidden US$2 billion AI hardware deal points to deeper chip, compute ambitions

 White House accuses China of 'industrial-scale' AI theft, signals crackdown

 Global PMX drives smart driving transformation with three key engines

 GMI pursues vertical integration amid surging AI leasing demand

 PC chipmakers warn CPU shortages cloud 2026 shipment outlook

 DIGITIMES Insight: SK Hynix's US HBM push sets up a showdown with Micron

 BizLink builds Southeast Asia manufacturing network with distinct roles across key markets

 Intel's AI-driven CPU rebound signals early-stage revival

 Intel says 18A yield improves as 14A advances to early customer engagement stage

 Apple faces US$38B antitrust fine in India, eyes Trump card for relief

 Samsung labor unions rally 40,000 workers, prepares for 18-day strike in May

 Intel bets on CPUs as backbone of AI growth

 Intel flags price increases and supply shortages as CPU demand strengthens

 Europe's humanoid robot push stalls on safety rules and liability gaps

 Intel keeps capex steady as it shifts spending toward capacity expansion

 Intel Has Moved From \u201CCan It Survive?\u201D to \u201CHow Fast Can It Expand Capacity?\u201D  - Original Article By SemiVision Research [Reading time: 16 mins]

 Rambus DDR5 RDIMM 8000 Chipset Named Semiconductor Product of the Year from the Data Breakthrough Award  - Explore Rambus IP here At Rambus, we spend a lot of time solving hard problems at the intersection of memory and compute. Bandwidth limits. Power integrity. Signal integrity. Thermal constraints. These challenges become even more complex as AI training, inference, …

 Demystifying Custom Silicon in the Data Center  - Exploring heterogeneous compute in the data center—how custom ASIC designs help create XPUs to accelerate modern AI workloads. Data Center Insights by Jerry Chang, Sr. Director, Head of Marketing, Americas and Europe.

 BE Semiconductor Industries N.V. Announces Results of 2026 Annual General Meeting of Shareholders  - Duiven, the Netherlands, April 23, 2026 - BE Semiconductor Industries N.V. (the "Company" or "Besi") (Euronext Amsterdam: BESI; OTC: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, today announced the results of its Annual General Meeting of Shareholders (“AGM”)....

 ESP32Synth : an Audio Synthesis Library for the ESP32  - With MCUs becoming increasingly more powerful it was only a matter of time before they would enable some more serious audio-processing tasks. [Danilo Gabriel]’s ESP32Synth library is a good example here, …read more

 TSMC introduces A13 node; says no need for high-NA through 2029  - TSMC has no plans to buy ASML’s most advanced litho tool – the $350 million high-NA EUV machine, according to deputy co-COO Kevin Zhang, speaking at TSMC’s 2026 Technology Symposium. “We continue to be able to harvest the benefit from current EUV,” said Zhang said, which would continue to be...

 Applied Materials to Report Fiscal Second Quarter 2026 Results on May 14, 2026  - SANTA CLARA, Calif., April 23, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced that it will hold its fiscal second quarter 2026 earnings conference call on Thursday, May 14, 2026, at 4:30 p.m. ET / 1:30 p.m. PT. The call will be webcast live at: https://ir.appliedmaterials.com.

 Musk bets Tesla's AI future on Intel node that isn't finished yet  - EV maker leaning on still-in-development 14A process for Terafab, says it needs to build own silicon

 AXT closes public offering, raising $550m  - Overallotment option could boost gross proceeds to $632.5m

 Why 6.4 Gbps DDR5 Designs Fail and How to Avoid It  - In the world of high-speed SoC design, “almost working” is really just a polite way of saying “an expensive paperweight.” As we push beyond the 6.4 Gbps threshold with DDR5, the margin for error has essentially disappeared. For engineering leads and decision-makers, the goal is no longer just...

 [News] Micron Reportedly Urges Tighter U.S. Chip Equipment Curbs on China; Toolmakers Seek Relief  - Micron is reportedly urging the U.S. government to tighten restrictions on chipmaking equipment sales to China. According to Reuters, sources say the company has been a key force pushing Congress to advance legislation that would impose new export controls on the tools used by its Chinese rivals to ......

 Samsung Foundry and Cadence: Accelerating Chiplet Solutions for Physical AI  - Artificial Intelligence (AI) is rapidly expanding beyond digital environments and into the physical world. AI-driven systems that give machines the ability to perceive, comprehend, learn from, and respond to real-time environments are quickly moving from imagination to reality. Training and …

 LandMark Optoelectronics ramps up semiconductor-grade equipment for 6-inch SiPh amid surging demand  - Silicon photonics (SiPh) products continue to see strong demand, with optical communication epitaxy manufacturer LandMark Optoelectronics reporting output still far below customer needs. The company plans to increase capital expenditure (capex) to NT$1.315 billion (US$41.7 million) in 2026 to prepare...

 Jedec previews LPDDR6 update for non-mobile AI platforms  - The JEDEC Solid State Technology Association is previewing a set of new features planned for incorporation into the next version of its Low Power Double Data Rate 6 (LPDDR6) standard (JESD209‑6). The relevant subcommittee has been working on extending LPDDR6 beyond mobile platforms. For example, to...

 MediaTek Showcases its Active Intelligent Cockpit Solution, Ushering the Industry into New Era of AI-defined Vehicles  - BEIJING, China – April 24, 2026 –During the 19th Beijing International Automotive Exhibition, MediaTek showcased its active intelligent cockpit solution, helping to bring the automotive industry into a new generation of AI-defined vehicles (AIDV). Together with its ecosystem partners, MediaTek presented...

 How Intel is riding the ‘CPU comeback’ as AI shifts - and where China stands  - What’s behind the ‘CPU renaissance’ and where China stands in designing and manufacturing central processing units in the AI age

 Protected: Mass-Producing the “Invisible Infrastructure” of AR Glasses  - There is no excerpt because this is a protected post.

 Meta Arms itself to the teeth by signing for 'tens of millions' of AWS Graviton cores  - After flubbing the Metaverse, Zuck embraces the Neoverse

 Chip Industry Week In Review  - Marvell's plasmonics buy; Onto's process control stake; TSMC A14/13 and EDA flows; Apple shuffle; LPDDR6; SOCAMM2 chipset; MATCH Act progress; EV resist crunch; India 3D packaging fab; digital test card for HPC; telemetry platform for power management; edge AI MCU for voice; new Google TPUs. The post...

 TSMC maps dual-track roadmap to 2029 with A12, A13 and N2U  - TSMC has updated its roadmap through 2029, adding two leading-edge nodes and one node extension.

 Smart factory: The rise of PoE in industrial environments  - Power over Ethernet (PoE) meets industrial IoT demands by leveraging the unique ability to deliver power and data over a single cable. The post Smart factory: The rise of PoE in industrial environments appeared first on EDN .

 Intel is still cheap on price/book value.  - Of all the vertical charts, this one is still worth chasing.

 S32K3: One Scalable Microcontroller Series for Today and Tomorrow  - The S32K3 Series delivers scalable automotive MCUs with high memory, advanced connectivity, built-in safety, and long-term reliability.

 ST targets wide-voltage precision with new op amps  - STMicroelectronics has introduced a new dual operational amplifier aimed at high-precision applications across a wide supply range. The…

 TSMC's Margins in Uncharted Territory  - 66.2% in the weakest quarter of the year. The biggest sequential jump on record. And 10 points above the long-term target they just raised.

 Design Faster, Waste Less: The Sustainability Advantage of Simulation  - Learn how simulation-driven design helps engineers build more efficient, sustainable electronics. By enabling deep virtual exploration before hardware is built, QSPICE® reduces prototype cycles, conserves materials and accelerates development—helping organizations improve performance, meet sustainability...

 First Intel Wildcat Lake laptop spotted in the wild, geared to compete with MacBook Neo — features an aluminum chassis with 11W fanless mode  - Intel's Wildcat Lake family was launched recently, but no devices featuring the CPUs have actually shown up yet. Analyst Vaidyanathan S shared pictures of a real laptop running the new 'Core Series 3' silicon, but it's just an Intel reference machine. It also shows that Wildcat Lake has a 17W PL1 and...

 NVIDIA and Google Cloud target physical AI factories  - NVIDIA and Google Cloud have expanded their long-running partnership with a set of announcements at Google Cloud Next 2026 that…

 From air to tea: New sensor reveals invisible pollution in minutes  - Fine particulate matter in the air or nanoparticles in water—a remarkable new technology developed at TU Wien makes it possible to detect tiny amounts of a wide range of substances in a very short time.

 Interfacial polarity modulation of positive electrode active materials for high-potential lithium metal batteries  - A molecular engineering strategy using self-assembled monolayers to modulate interfacial polarity stabilizes high-potential lithium metal batteries by regulating interfacial solvent interactions and suppressing electrolyte decomposition up to 4.7 V.

 TSMC Starts Work On Arizona Packaging Plant  - Taiwan's TSMC says it has broken ground on advanced packaging plant at existing Arizona facility, as it addresses key bottleneck

 Key Takeaways from TSMC\u2019s 2026 North America Technology Symposium  - Origianl Article By SemiVision Research [Reading time: 13 mins]

 System-in-Package Challenges  - Engineering considerations in multi-chiplet designs. The post System-in-Package Challenges appeared first on Semiconductor Engineering .

 Join Our Expert Webinar on Humanoid Robots in Industry  - Join IDTechEx Technology Analyst Shihao Fu on Thursday 30th April for the expert-led webinar, "Humanoid Robots in Industry: Market Readiness, ROI, and 10-Year Outlook". Choose your preferred time zone - the webinar runs three times in one day.

 How MediaTek is Leading the Next Generation of AI Chromebooks  - Powered by the Kompanio Ultra processor, devices like the Acer Chromebook Plus 714 and Lenovo Chromebook Plus deliver on-device AI with intelligent productivity features, and more.Explore how MediaTek's on-device AI capabilities are accelerating across Chromebooks and Android for Desktop.

 TOPPANグループ、世界最大規模の包装展「interpack 2026」に出展  - 循環型社会の実現に貢献するモノマテリアルハイバリア包材に不可欠な基材フィルムやバリアフィルムをグローバル市場に紹介

 Intel Shares Soar 27% After Confirming 'Unprecedented' Agentic AI Demand for CPUs. Here Are the Biggest Takeaways from Earnings.  - When most of Wall Street and the mainstream media held a stale, skeptical fundamental view on Intel, Key Context was very bullish on Intel shares.

 SemiWiki Acquires IPnest!  - After more than 15 years of collaboration with Dr. Eric Esteve and IPnest, SemiWiki has acquired the famed IP reports with Eric Esteve staying on through 2026 to ease the transition. Not only will SemiWiki provide the industry standard Interface IP and Design IP reports, SemiWiki will be expanding the...

 The system architect’s sketchbook: The buildout frenzy  - We need to triple hiring because AI is here. The post The system architect’s sketchbook: The buildout frenzy appeared first on EDN .

 \uD83C\uDF6A TWiC: TPU v8, Intel Rises Up, Marvell-Polariton  - This Week in Chips: Everybody loves a good XPU.

 Beijing moves to clean up online ad ecosystem in first-of-its-kind campaign  - Market watchdog flags AI abuse and traffic-driven tactics as it launches first campaign to overhaul online advertising

 Scientists Overcome Major Quantum Bottleneck, Potentially Transforming Teleportation and Computing  - A new method reveals hidden order in quantum systems, potentially transforming how they are measured and used. A long-standing challenge in quantum physics may finally have a practical solution. Researchers in Japan have developed a new way to identify complex quantum states in a single step, potentially...

 Intel Shares Jump On Data Centre Expectations  - Intel sees shares rise sharply after it projects stronger-than-expected sales of data centre chips, boosted by AI demand

 An Interview with OpenAI President Greg Brockman: \u2018There\u2019s not going to be enough compute\u2019  - Key Context spoke with OpenAI cofounder Greg Brockman to discuss the latest model, the company\u2019s AI infrastructure commitments and how AI agents will change everything.

 Unraveling Embedded Clock Mode in MIPI D-PHY: Simplifying High-Speed Serial Link  - As flagship smartphones push camera sensors beyond 200 megapixels and display resolutions…

 [Blog] Designing Edge AI Under Real-World Constraints  - As demand for artificial intelligence at the edge continues to grow, it has become increasingly difficult for designers and developers to support. Constrained edge systems often lack the power, processing, and space required to run these high-performance workloads effectively. In a recent webinar hosted...

 OpenAI Unveils GPT-5.5. Company Says Expect a Faster Model Release Pace  - On Thursday, OpenAI unveiled its newest flagship AI model called GPT-5.5.

 Want to Build Chips 10X faster and at 50% Lower Cost (Without Changing Existing Tools or Workflows)?  - I have some news that will make chip and chiplet designers (we’re talking ASIC, ASSP, SoC, and multi-die systems) squeal in delight. However, before we leap headfirst into the fray with gusto and abandon (and, it goes without saying, but I’ll say it anyway, aplomb), I just got off a call with my old...

 Three Pillars Shaping Blue Hydrogen's Future  - Blue hydrogen, produced from natural gas using reforming processes with carbon capture, offers a lower-carbon alternative to grey hydrogen and serves as a transitional solution toward a hydrogen-based economy. Successfully scaling blue hydrogen requires the alignment of three key pillars: regulatory support,...

 What Apple's new CEO inherits: AI, China, and a governance reckoning  - Apple Inc. announced that John Ternus, Vice President of Hardware Engineering, will succeed Tim Cook as CEO in September, following Cook's 15-year tenure. The transition marks a pivotal moment as Apple navigates converging pressures from AI transformation and global operations, presenting a leadership...

 Tencent, Alibaba circle DeepSeek in US$20 billion AI deal talks

 AI shifts and soaring costs drive PC brands to cut jobs in 2026

 Apple reshapes AI strategy by doubling down on Siri and privacy

 SaiMemory wins NEDO backing for next-generation ZAM memory, partners with Intel

 Machvision targets 70% high-end equipment share, eyes record 2026 revenue

 Samsung and LG turn to AI at WIS 2026 to tackle sluggish consumer electronics market

 SpaceX eyes GPU push as Tesla taps Samsung for chip upgrade

 IBM reports steady AI-driven growth despite facing software momentum questions

 Rockwell Automation flags key AI challenges, unveils three-step strategy for Taiwan's shift to autonomous manufacturing

 Samsung and SK Hynix race to upgrade China chip plants as NAND demand surges

 TSMC to open Arizona packaging facility by 2029, signals caution on high-NA EUV

 LandMark sees profit soar 650% in 1Q26, secures deal for 5-year InP substrate supply

 IBM's watsonx, mainframe surge, and sovereign AI push power a landmark 1Q26

 Supermicro GPU smuggling prompts Nvidia to intensify supply chain audit

 Rockwell Automation highlights talent and ecosystem challenges for overseas plant constructions

 SK Hynix flags persistent HBM shortage as demand outpaces supply

 Parade offsets weak PC demand with TTED, high-speed, and automotive growth

 Tesla tap Intel's advanced 14A chip for Terafab project

 SK Hynix to shift over half of NAND output to 321-layer chips

 SK Hynix dismisses peak fears, points to structural memory upcycle

 Former Samsung Electronics researcher sentenced to 7-year prison term for leaking DRAM trade secrets

 Cyient Semiconductors’ Power Play: How Kinetic Technologies Fits the Puzzle  - Cyient Semiconductors amps up India's custom silicon game with Kinetic Technologies. The post Cyient Semiconductors’ Power Play: How Kinetic Technologies Fits the Puzzle appeared first on EE Times .

 Can Edge AI Keep Up?  - Key Takeaways: Model development is outpacing silicon design cycles, so edge AI architectures must prioritize adaptability. The required cadence for model updates is highly application-dependent and is closely tied to product lifetime and operational risk. Adaptability can conflict with power, performance,...

 Besi sees orders double on hybrid-bonding demand  - BE Semiconductor Industries reported a sharp uptick in order intake for the first quarter of 2026, driven primarily by demand for hybrid-bonding systems and AI-related packaging.

 BE Semiconductor Industries N.V. Announces Q1-26 Results  - Q1-26 Orders of € 269.7 Million Up 104.5% vs. Q1-25. Revenue of € 184.9 Million and Net Income of € 51.6 Million Up 28.3% and 63.8%, Respectively, vs. Q1-25

 Switchable 2D–3D display through a metasurface lenticular lens  - A full-colour 2D–3D switchable light-field display powered by a metasurface lenticular lens is proposed that is a promising solution for next-generation display technologies in both consumer electronics and commercial applications.

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