Semi. Fabs and Clean Rooms 15h ago: Strong momentum in U.S. and global semiconductor fab construction and cleanroom expansions driven by AI demand and CHIPS Act funding. GlobalFoundries advancing major expansions, TSMC exploring U.S. capacity including potential Terafab collaboration, Samsung locking in long-term capacity deals, with positive yield progress in advanced packaging and ongoing industry events at SEMICON West.
A $1 Trillion Chip Rout Draws Billions Into Leveraged ETF Bets - As chip stocks shed $1 trillion in market value, ETF investors are pouring billions into the selloff, putting a fund that triples their daily exposure to the sector on pace for record weekly inflows.
China's AMEC targets 60% of high-end chip equipment market with US$1.94 billion R&D plan - Chinese semiconductor equipment maker AMEC plans to develop 102 new equipment models over the next three to five years, backed by nearly CNY13 billion (≈ US$1.94 billion) in research and development investment. The expansion will extend its portfolio beyond plasma etching into thin-film deposition,...
Show Daily 2026 — Day Three - View or Download the SEMICON West Show Daily — Day Three! The post Show Daily 2026 — Day Three appeared first on Semiconductor Digest .
Dynamic Scattering Controls Speckle Noise and Aberrations in OCT Imaging - Speckle noise and aberrations limit high-resolution optical imaging by obscuring the fine detail in an image. Speckle is linked to the use of spatially coherent light — without coherence, speckle disappears. But, so does the ability to perform interferometric imaging techniques like OCT, which uses...
L'economia del data center che si produce l'energia da solo - Un campus AI in isola non conviene per il prezzo dell'energia. Conviene per il tempo. E quando la rete non c'\u00E8, il punto in cui si incontrano tutte le fonti non \u00E8 pi\u00F9 il contatore
[News] TSMC Lifts 2026 Growth Forecast to 44%, Eyes Record 4Q Revenue of Up to US$54.3B, Up 14% QoQ - After posting new high net profit in the third quarter, TSMC management projects 4Q26 revenue to land between $52.3 billion and $54.3 billion, representing a year-over-year increase of approximately 58% and a sequential gain of around 14%. Profitability, however, could face some pressure as its 2...
What Is Next-Generation AI Industrial Competitiveness? - AI competition is shifting from building powerful AI models to creating value with AI. This article analyzes the U.S.–China AI race through a four-layer framework of AI industrial competitiveness and explores how organizations can leverage AI as a strategic resource to drive business value creation....
SEMI Scales Up Workforce Programs as U.S. Talent Gap Nears 200,000 - When SEMI asks member companies what could hold back their growth, the number one answer is talent, Joe Stockunas, president of SEMI Americas, said at Monday’s SEMICON West press conference. The post SEMI Scales Up Workforce Programs as U.S. Talent Gap Nears 200,000 appeared first on Semiconductor Digest...
Beyond Lithography: 3D Scaling Puts New Demands on Materials - ASM International shows how building increasingly complex 3D devices requires advances in materials and processes. The post Beyond Lithography: 3D Scaling Puts New Demands on Materials appeared first on EE Times .
Chip Stocks Set to Erase $1 Trillion in Value as Rout Deepens - A closely watched gauge of semiconductor stocks is on pace to erase more than $1 trillion in market value as concerns mount over higher interest rates, stretched valuations and the enormous cost of building artificial-intelligence infrastructure.
CTO Interview with Sirish Munipalli of Moores Lab AI - Sirish Munipalli is Co-Founder and CTO of Moores Lab AI, where he leads the development of agentic AI for chip design verification, including SpecAgent(tm), the company’s specification and modeling platform. He has spent about 15 years designing and verifying complex silicon: FPGA prototyping at Intel,...
Simulations Pinpoint Leakage Pathway In GAAFETs (Sandia, Luxembourg) - Researchers at Sandia National Laboratories and Luxembourg Institute of Science and Technology published a technical paper titled “Revealing New Leakage Paths in GAAFETs using Predictive First-Principles Simulations.” Abstract Excerpt: “Gate-All-Around Field-Effect Transistors (GAAFETs) are emerging...
Extending the Mission Envelope of High-Performance Plastic MCUs - The new SAMV71Q21RT extends the mission envelope of high-performance radiation-tolerant MCUs with 50 krad(Si) TID capability and an enhanced Plastic Class 1 quality grade equivalent to QML Class P. Built from the proven SAMV71 architecture, it gives space designers greater flexibility to balance radiation...
ASML’s Guidance Key to Instill Confidence in Fragile Chip Trade - ASML Holding NV’s guidance for building out capacity has become a crucial new part of the Dutch company’s earnings days, and will be even more so this time as investors seek signs of reassurance in the sector’s faltering rally.
New platform tackles critical material risks in electric motors - As manufacturers face growing uncertainty tied to critical material shortages and global supply chain disruptions, the Department of Energy's (DOE) Oak Ridge National Laboratory (ORNL) researchers have developed a super intelligence ...
IMF cuts Korea debt-to-GDP forecast through 2031 - IMF cuts Korea debt-to-GDP forecast through 2031 The International Monetary Fund lowered its forecast for Korea’s government debt-to-GDP ratio through 2031, citing strong economic growth and improving tax revenue prospects. 10/14/2026 - 12:21 AM
Apple heads Home: Distributed identity validation, and how much does Matter matter? - Apple branding is key to its resurrected smart home “push”. Broader ecosystem compatibility, also feasible, is absent from the messaging. The post Apple heads Home: Distributed identity validation, and how much does Matter matter? appeared first on EDN .
Teradyne Unveils Magnum E2 for the Next Wave of AI Memory - Teradyne has announced Magnum E2, a memory test system designed to address the increasingly demanding interfaces used in artificial intelligence and high performance computing. The platform targets advanced DRAM and flash technologies, including LPDDR6, DDR6, GDDR7, and NAND flash, while combining engineering...
Save $249 on 32GB of DDR5 with this 3-item Newegg bundle - Score 32GB of G.Skill DDR5-6000 RAM for just $321 in Newegg’s new AM5 combo. For $1,094 ($249 off), you also get a Ryzen 7 9800X3D and an MSI X870E Tomahawk MAX WiFi board, plus a free AIO cooler.
Japan Offers GlobalFoundries $21B for U.S. Fab Expansion - Japan’s $21B offer to GlobalFoundries would add two New York fabs and lift U.S. chip capacity 10%; see why analysts warn on state support. The post Japan Offers GlobalFoundries $21B for U.S. Fab Expansion appeared first on EE Times .
Coherent Corp. Announces Timing of FY2027 First Quarter Earnings Release - Coherent Corp. announced today that it will release its financial results for the quarter ended September 30, 2026, on Wednesday, November 4, after the New York Stock Exchange closes. The release will be followed by a live audio webcast at 4:30 p.m. ET to discuss the results.
Kospi plunges over 7% as AI doubts, U.S. rate fears hit Seoul - Kospi plunges over 7% as AI doubts, U.S. rate fears hit Seoul Korean stocks tumbled as AI return concerns, Chinese chip supply fears and rising U.S. rates prompted heavy foreign selling. 10/14/2026 - 10:34 PM News Team
Not all diodes use electrons - Sometimes thinking like a geek pays off. Especially when you're dealing with overheated Judge Judy fanatics. The post Not all diodes use electrons appeared first on EDN .
Small Volumes, Big Impact: Europe’s Hidden Role in Advanced Chipmaking - A Fraunhofer–IMS Nanofabrication partnership illustrates how Europe's low-volume semiconductor manufacturing can support the world's most advanced chipmaking. The post Small Volumes, Big Impact: Europe’s Hidden Role in Advanced Chipmaking appeared first on EE Times .
Why Open-Weight AI Matters - Proprietary models still hold the edge, but open-weight models add more flexibility for deploying AI. The post Why Open-Weight AI Matters appeared first on Semiconductor Engineering .
What Makes a USB SmartHub Different? - Connected embedded systems increasingly require more than basic USB expansion to support internal (chip-to-chip) interface requirements. USB SmartHub ICs combine high-speed hub functionality, interface bridging and flexible port management in a single device, helping developers reduce system complexity...
ByteDance in Talks to Secure MediaTek AI Chips for Data Centers - ByteDance Ltd. is close to an agreement to buy MediaTek Inc. data center semiconductors, a deal that would secure vital components for TikTok’s owner while helping the Taiwanese chipmaker compete with Qualcomm Inc.
Memory Stocks Are Falling. Korea’s Exports Keep Climbing. - Korea shipped $37.59 billion of memory chips in September. China remains the largest destination, server demand is widening beyond HBM, and the next supply response is already running into equipment c
NXP's P3B1602DP Brings the Industry's First I3C Bus Buffer to Market - As I3C adoption accelerates across next-generation computing and embedded systems, NXP recognized a critical infrastructure gap: designers needed a purpose-built buffer that could preserve I3C performance while supporting voltage translation, larger bus capacitance, and longer PCB traces.
Ultrafast oxide-ion conductors offer route to low-temperature fuel cells - Solid-oxide fuel cells (SOFCs), which convert chemical energy directly into electrical power, are promising energy-conversion technologies because they can operate on various fuels, including hydrogen, natural gas and biogas.
Vishay optical sensors target battery management, energy storage - Vishay’s new automotive grade optical sensors address challenges in modern battery management, energy storage, and industrial automation systems. The four new devices combine an infrared (IR) emitter and PIN photodiode […] The post Vishay optical sensors target battery management, energy storage appeared...
A stroll down memory lane - A stroll down memory lane A model of HBM4E, a type of high bandwidth memory (HBM), is displayed at Samsung Electronics’ booth at Sedex 2026, a comprehensive semiconductor industry exhibition, held at Coex in Gangnam District, southern Seoul, on Oct. 14. 10/14/2026 - 06:03 AM
Software translates test patterns and applies them to interfaces and protocols. - Siemens’ Tessent Silicon Executable software is designed to translate test patterns and apply them directly onto high-speed interfaces and protocols. Test provider partners will embed the Tessent software within automated […] The post Software translates test patterns and applies them to interfaces...
Simplify Electronic-Photonic Design Workflows: eBook - The natural evolution of EDA, extending proven design methodologies to include photonic devices, circuits, and systems. The post Simplify Electronic-Photonic Design Workflows: eBook appeared first on Semiconductor Engineering .
Interview with Eric Hong, VP of Engineering at Mixel, a Silvaco Company - Eric Hong is Vice President of Engineering at Mixel, a Silvaco company, where he leads the development of analog and mixed-signal IP, including high-speed PHY and SerDes solutions. Prior to Mixel, he held engineering leadership and technical roles at Nvidia, eSilicon, Samsung Electro-Mechanics, and Intel,...
2026-2027 CMR Sputtering Targets - This Critical Materials Report delivers a cohesive view of the 2026-2027 semiconductor sputtering targets materials market, combining demand forecasts, supply dynamics, competitive positioning, and pricing trends. It describes the value chain through profiling key players while identifying critical dependencies,...
Agentic AI Automates RTL Waveform Analysis And Debugging (Columbia, Google) - Researchers at Columbia University, Google DeepMind, and Google published a technical paper titled “Back to the Future: Rethinking EDA Infrastructure for Agentic Systems in Chip Design Verification.” Abstract “The unprecedented computational scale of modern artificial intelligence depends on complex,...
Nordson SonoFlex Wins 2026 Best of West Award at SEMICON West - SEMI and Semiconductor Digest today announced that the SonoFlex Acoustic System from Nordson Test & Inspection (Booth 5844) has won the Best of West award to be presented at SEMICON West 2026. The post Nordson SonoFlex Wins 2026 Best of West Award at SEMICON West appeared first on Semiconductor Digest...
Japan Mobility Show puts Physical AI and cross-sector partnerships in focus - Japan Mobility Show Bizweek 2026 showcased Physical AI applications, including Toyota's basketball-playing robot and an air-ground inspection system, as automakers and startups explored new business opportunities beyond traditional vehicles. The business-focused exhibition, held in Japan, sought to demonstrate...
Insight: Apple Reboots Its Smart Home Strategy with Siri AI and Smartphone-Class Silicon - This Insight provides TechInsights’ analysis and perspective on the impact of announcements made by Apple on October 13, 2026, at its Welcome Home product launch event. Apple launched its first smart home display (HomeView) and refreshed its existing Apple TV and Apple HomePod mini products. Apple also...
Services matter more in the AI era, but regulation isn't enough - Services matter more in the AI era, but regulation isn't enough Semiconductor-led gains mask weak service productivity, leaving Korea’s AI-era competitiveness constrained by regulation and underinvestment. 10/15/2026 - 11:01 AM Opinion Desk
Fable: The Commonsense CEO - There was once a mega-company which was in trouble – its market cap of $96 billion was down 80% from its value 18 years earlier. It had made an annual […] The post Fable: The Commonsense CEO appeared first on Electronics Weekly .
VIG Partners Set to Finalize 300 Billion Won Yulgok Deal - VIG Partners has recently expanded its investment scope from consumer goods and services to manufacturing sectors such as semiconductor equipment, aerospace, and defense.
2026 world GDP growth of 3.1% says IMF - The IMF now reckons the world economy will grow 3.1% this year. In July it said 3%. Countries upgraded since the last forecast are India, the United Kingdom and Germany. […] The post 2026 world GDP growth of 3.1% says IMF appeared first on Electronics Weekly .
先進封裝推升設備需求！ACM Research 擴大全球布局，清洗、沉積產品線持續延伸 - 美商 ACM Research 首席技術專家 Sally-Ann Henry 於 SEMICON West 受訪時表示，清洗製程在先進半導體製造中扮演關鍵角色，隨著晶片架構 益複雜，清洗設備的重要性預期將持續提升。公司也持續擴大產品組合，從既有的濕式清洗設備，延伸至先進封裝、面板級封裝、沉積及其他製程設備，並以客戶需求為基礎推動技術創新。...
Ultrahuman Ring PRO Deep Dive Teardown - The Ultrahuman Ring PRO is a smart ring purchased from the (world) market. The Ultrahuman Ring PRO is a premium smart ring designed for continuous biometric, sleep, recovery, and activity tracking without a mandatory subscription model. Relative to the Ultrahuman Ring AIR, the PRO introduces extended...
Systems reduce latency in edge AI automation - AIE-KT78/68 edge AI systems from Aetina are powered by NVIDIA Jetson Thor and Blackwell architectures for deterministic industrial control. The post Systems reduce latency in edge AI automation appeared first on EDN .
Schäfter+Kirchhoff Completes Leadership Transition - Schäfter+Kirchhoff completed its leadership transition, moving to a two-person management structure. The change follows a planned one-year overlap period during which outgoing managing director Ulrich Oechsner transferred his responsibilities...
Panasonic exhibits at Enlit Europe 2026 - Panasonic’s product solutions empower customers to create and manufacture sustainable, dependable and interconnected products
Show Daily 2026 — Day Two - View or Download the SEMICON West Show Daily — Day One! The post Show Daily 2026 — Day Two appeared first on Semiconductor Digest .
Did Intel’s Cost Cutting Bite Them? - Intel's Foundry arm is picking up the customers SemiAccurate told you about last year, but is this a good thing? Read more ▶ The post Did Intel’s Cost Cutting Bite Them? appeared first on Semiaccurate .
SK hynix sees 20-fold AI infrastructure growth - SK hynix sees 20-fold AI infrastructure growth The chipmaker forecasts a 20-fold increase in AI infrastructure performance by 2030 as inference demand drives new memory needs. 10/14/2026 - 02:56 AM
NXP's P3B1602DP Brings the Industry's First I3C Bus Buffer to Market - As I3C adoption accelerates across next-generation computing and embedded systems, NXP recognized a critical infrastructure gap: designers needed a purpose-built buffer that could preserve I3C performance while supporting voltage translation, larger bus capacitance, and longer PCB traces.
Amperesand Aims to Smooth AI Data Center Power Spikes - See how Amperesand’s solid-state transformers aim to tame AI data center power spikes with batteries, 800 VDC conversion, and microgrid control. The post Amperesand Aims to Smooth AI Data Center Power Spikes appeared first on EE Times .
Kulicke & Soffa Earns 2026 SEMI Award for North America at SEMICON West - SEMI, the industry association advancing the global semiconductor and electronics design and manufacturing supply chain, today announced Kulicke & Soffa as the recipient of the 2026 SEMI Award for North America. The post Kulicke & Soffa Earns 2026 SEMI Award for North America at SEMICON West...
