The EU Cyber Resilience Act: A New Reality for Device Manufacturers - Driving automation introduces increasingly complex perception challenges. Vehicles must reliably detect vulnerable road users, distinguish closely spaced objects and operate consistently in dense traffic, poor weather or low‑visibility environments.
CPUs regain central role in AI as Intel highlights growing importance alongside rising ASIC demand - Intel executives are placing renewed emphasis on the central role of CPUs in artificial intelligence (AI), arguing that shifting workloads are elevating their importance even as specialized chips gain traction. Management said the transition from model training to real-world deployment is driving stronger...
Demystifying Custom Silicon in the Data Center - Exploring heterogeneous compute in the data center—how custom ASIC designs help create XPUs to accelerate modern AI workloads. Data Center Insights by Jerry Chang, Sr. Director, Head of Marketing, Americas and Europe.
BE Semiconductor Industries N.V. Announces Results of 2026 Annual General Meeting of Shareholders - Duiven, the Netherlands, April 23, 2026 - BE Semiconductor Industries N.V. (the "Company" or "Besi") (Euronext Amsterdam: BESI; OTC: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, today announced the results of its Annual General Meeting of Shareholders (“AGM”)....
ESP32Synth : an Audio Synthesis Library for the ESP32 - With MCUs becoming increasingly more powerful it was only a matter of time before they would enable some more serious audio-processing tasks. [Danilo Gabriel]’s ESP32Synth library is a good example here, …read more
Signal generators enable Pulsar signal testing - A software option for Rohde & Schwarz vector signal generators supports Pulsar signal simulation testing in production settings. The post Signal generators enable Pulsar signal testing appeared first on EDN .
TSMC introduces A13 node; says no need for high-NA through 2029 - TSMC has no plans to buy ASML’s most advanced litho tool – the $350 million high-NA EUV machine, according to deputy co-COO Kevin Zhang, speaking at TSMC’s 2026 Technology Symposium. “We continue to be able to harvest the benefit from current EUV,” said Zhang said, which would continue to be...
Applied Materials to Report Fiscal Second Quarter 2026 Results on May 14, 2026 - SANTA CLARA, Calif., April 23, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced that it will hold its fiscal second quarter 2026 earnings conference call on Thursday, May 14, 2026, at 4:30 p.m. ET / 1:30 p.m. PT. The call will be webcast live at: https://ir.appliedmaterials.com.
Why 6.4 Gbps DDR5 Designs Fail and How to Avoid It - In the world of high-speed SoC design, “almost working” is really just a polite way of saying “an expensive paperweight.” As we push beyond the 6.4 Gbps threshold with DDR5, the margin for error has essentially disappeared. For engineering leads and decision-makers, the goal is no longer just...
[News] Micron Reportedly Urges Tighter U.S. Chip Equipment Curbs on China; Toolmakers Seek Relief - Micron is reportedly urging the U.S. government to tighten restrictions on chipmaking equipment sales to China. According to Reuters, sources say the company has been a key force pushing Congress to advance legislation that would impose new export controls on the tools used by its Chinese rivals to ......
Samsung Foundry and Cadence: Accelerating Chiplet Solutions for Physical AI - Artificial Intelligence (AI) is rapidly expanding beyond digital environments and into the physical world. AI-driven systems that give machines the ability to perceive, comprehend, learn from, and respond to real-time environments are quickly moving from imagination to reality. Training and …
LandMark Optoelectronics ramps up semiconductor-grade equipment for 6-inch SiPh amid surging demand - Silicon photonics (SiPh) products continue to see strong demand, with optical communication epitaxy manufacturer LandMark Optoelectronics reporting output still far below customer needs. The company plans to increase capital expenditure (capex) to NT$1.315 billion (US$41.7 million) in 2026 to prepare...
Jedec previews LPDDR6 update for non-mobile AI platforms - The JEDEC Solid State Technology Association is previewing a set of new features planned for incorporation into the next version of its Low Power Double Data Rate 6 (LPDDR6) standard (JESD209‑6). The relevant subcommittee has been working on extending LPDDR6 beyond mobile platforms. For example, to...
Chip Industry Week In Review - Marvell's plasmonics buy; Onto's process control stake; TSMC A14/13 and EDA flows; Apple shuffle; LPDDR6; SOCAMM2 chipset; MATCH Act progress; EV resist crunch; India 3D packaging fab; digital test card for HPC; telemetry platform for power management; edge AI MCU for voice; new Google TPUs. The post...
Smart factory: The rise of PoE in industrial environments - Power over Ethernet (PoE) meets industrial IoT demands by leveraging the unique ability to deliver power and data over a single cable. The post Smart factory: The rise of PoE in industrial environments appeared first on EDN .
TSMC's Margins in Uncharted Territory - 66.2% in the weakest quarter of the year. The biggest sequential jump on record. And 10 points above the long-term target they just raised.
Design Faster, Waste Less: The Sustainability Advantage of Simulation - Learn how simulation-driven design helps engineers build more efficient, sustainable electronics. By enabling deep virtual exploration before hardware is built, QSPICE® reduces prototype cycles, conserves materials and accelerates development—helping organizations improve performance, meet sustainability...
From air to tea: New sensor reveals invisible pollution in minutes - Fine particulate matter in the air or nanoparticles in water—a remarkable new technology developed at TU Wien makes it possible to detect tiny amounts of a wide range of substances in a very short time.
System-in-Package Challenges - Engineering considerations in multi-chiplet designs. The post System-in-Package Challenges appeared first on Semiconductor Engineering .
Join Our Expert Webinar on Humanoid Robots in Industry - Join IDTechEx Technology Analyst Shihao Fu on Thursday 30th April for the expert-led webinar, "Humanoid Robots in Industry: Market Readiness, ROI, and 10-Year Outlook". Choose your preferred time zone - the webinar runs three times in one day.
How MediaTek is Leading the Next Generation of AI Chromebooks - Powered by the Kompanio Ultra processor, devices like the Acer Chromebook Plus 714 and Lenovo Chromebook Plus deliver on-device AI with intelligent productivity features, and more.Explore how MediaTek's on-device AI capabilities are accelerating across Chromebooks and Android for Desktop.
SemiWiki Acquires IPnest! - After more than 15 years of collaboration with Dr. Eric Esteve and IPnest, SemiWiki has acquired the famed IP reports with Eric Esteve staying on through 2026 to ease the transition. Not only will SemiWiki provide the industry standard Interface IP and Design IP reports, SemiWiki will be expanding the...
Scientists Overcome Major Quantum Bottleneck, Potentially Transforming Teleportation and Computing - A new method reveals hidden order in quantum systems, potentially transforming how they are measured and used. A long-standing challenge in quantum physics may finally have a practical solution. Researchers in Japan have developed a new way to identify complex quantum states in a single step, potentially...
[Blog] Designing Edge AI Under Real-World Constraints - As demand for artificial intelligence at the edge continues to grow, it has become increasingly difficult for designers and developers to support. Constrained edge systems often lack the power, processing, and space required to run these high-performance workloads effectively. In a recent webinar hosted...
Pickleball Kingdom Accelerates Expansion in California with Multi-Unit Bay Area Deal - entrepreneur with over 20 years of experience developing software solutions in the Electronic Design Automation space, enabling chip design teams at major semiconductor companies across Silicon Valley, Taiwan, Europe, and Japan to deliver high-quality products. Now focused on launching innovative ventures...
Want to Build Chips 10X faster and at 50% Lower Cost (Without Changing Existing Tools or Workflows)? - I have some news that will make chip and chiplet designers (we’re talking ASIC, ASSP, SoC, and multi-die systems) squeal in delight. However, before we leap headfirst into the fray with gusto and abandon (and, it goes without saying, but I’ll say it anyway, aplomb), I just got off a call with my old...
Three Pillars Shaping Blue Hydrogen's Future - Blue hydrogen, produced from natural gas using reforming processes with carbon capture, offers a lower-carbon alternative to grey hydrogen and serves as a transitional solution toward a hydrogen-based economy. Successfully scaling blue hydrogen requires the alignment of three key pillars: regulatory support,...
What Apple's new CEO inherits: AI, China, and a governance reckoning - Apple Inc. announced that John Ternus, Vice President of Hardware Engineering, will succeed Tim Cook as CEO in September, following Cook's 15-year tenure. The transition marks a pivotal moment as Apple navigates converging pressures from AI transformation and global operations, presenting a leadership...
Can Edge AI Keep Up? - Key Takeaways: Model development is outpacing silicon design cycles, so edge AI architectures must prioritize adaptability. The required cadence for model updates is highly application-dependent and is closely tied to product lifetime and operational risk. Adaptability can conflict with power, performance,...
Besi sees orders double on hybrid-bonding demand - BE Semiconductor Industries reported a sharp uptick in order intake for the first quarter of 2026, driven primarily by demand for hybrid-bonding systems and AI-related packaging.
Switchable 2D–3D display through a metasurface lenticular lens - A full-colour 2D–3D switchable light-field display powered by a metasurface lenticular lens is proposed that is a promising solution for next-generation display technologies in both consumer electronics and commercial applications.
