What does Arm’s own chip stand for? - Arm finally unveils its own CPU for agentic AI workloads in an audacious strategy shift. The post What does Arm’s own chip stand for? appeared first on EDN .
Toshiba’s DTMOSVI 600V super junction power MOSFETs address datacentres - Toshiba is expanding its DTMOSVI series lineup – for switched-mode power supplies for industrial equipment – with DTMOSVI 600V HSD (High-Speed Diode) N-channel power MOSFETs. Featuring a super junction structure, the seven new products are available in TO-247, TOLL, and DFN8×8 packages. TK058V60Z5...
The Tapo Hub: TP-Link joins the low-bandwidth, long-range RF club - Leveraging low-power wireless connectivity isn’t proprietary to a single smart-home technology and product supplier, no matter that each company’s implementation of the concept may be. The post The Tapo Hub: TP-Link joins the low-bandwidth, long-range RF club appeared first on EDN .
Holy Stone expects AI-driven surge in MLCC demand to lift 2026 revenue - Holy Stone Enterprise expects a 20–30% rise in passive component revenue in 2026 as demand for high-power AI server components accelerates globally. Doubling AI product sales could improve profits by shifting to a higher-value product mix, with implications for supply chains and procurement across...
Intel Celebrates vPro 20th Anniversary With New Hardware And Software - Intel is celebrating the 20th anniversary of the vPro launch with a few new goodies. Read more ▶ The post Intel Celebrates vPro 20th Anniversary With New Hardware And Software appeared first on Semiaccurate .
What Velocity Means—and Why It Matters Now - AI is compressing chip development timelines and raising the stakes for equipment suppliers Here is how Lam is responding Speed has always mattered in the semiconductor industry. What is different...
The Quiet Convergence of Power and RF - RF and power engineers once lived in separate worlds. Not anymore. Fast switching, tight layouts and unforgiving systems mean sloppy power can turn your PCB into a broadband noise generator. Discover why modern RF performance now depends on treating power management like RF design.
Rethink Retail discusses edge AI in retail tech with MediaTek - Top AI Leader Kimberly Morgan chats with Sameer Sharma and CK Wang from MediaTek in The AiR Podcast to discuss how edge AI IoT platforms are delivering measurable ROI across retail operations. Key themes include shrink reduction, checkout optimization, infrastructure strategy, and the...
C SUN invests in Contrel, cementing role in G2C+ semiconductor alliance - C SUN and Contrel have announced a significant equity partnership, as C SUN agreed to invest approximately NT$1.02 billion (approx. US$32 million) as a strategic investor to acquire 20,000 private placement shares in Contrel, becoming its largest single shareholder with a 10.82% stake. The deal also formally...
Chip Industry Week In Review - Arm's game-changer; QC breaks in 2029; GF's 11 patent lawsuits; new fabs; helium atom beam litho; AI tool funding; 90% less GenAI cost; 2D materials roadmap; Intel's security report. The post Chip Industry Week In Review appeared first on Semiconductor Engineering .
Semicon China 2026: AI efficiency fuels demand growth under Jevons paradox, AMD warns - At SEMICON China 2026, AMD VP and Head of Corporate Strategy and Partnerships Mario Morales delivered a stark warning: while the AI market is rapidly expanding toward a projected US$1.7 trillion valuation, the ultimate constraint may not be silicon capability — but electricity.
When AI Meets Multi-Die (and Neither Lets Go) - I really wish I could have attended this year’s Chiplet Summit , which took place from February 17 to February 19, 2026. This auspicious event was held at the Santa Clara Convention Center in California. I know this facility well—it’s where I met my first telepresence robot—but that’s a story...
Shift Verification Left: AI Tools For Faster, Smarter Chip Design - If designers can verify individual blocks before subsystem integration, the verification team can focus on complex system-level interactions. The post Shift Verification Left: AI Tools For Faster, Smarter Chip Design appeared first on Semiconductor Engineering .
AI Won’t Kill Verification IP, But It Will Redefine It - Key Takeaways AI will enhance, not replace, verification IP by automating test generation and debug. Verification IP’s core value will increasingly lie in trust, accountability, and system-level realism, especially as designs become more complex, multi-die, and security-sensitive. AI shifts verification...
IoT Gets a Powerful Edge AI Upgrade: MediaTek at Embedded World - At Embedded World, MediaTek demonstrated how we’re bringing a new level of edge AI capabilities to a wide range of IoT devices and applications, from robots and drones to smart homes and vehicles. We’re proving that edge AI isn’t limited to small, power-constrained devices anymore. Our Genio......
The Recovery Revolution Sparked by Platinum Group Metals - Higher rates of critical material recovery are crucial to insulating supply chains from the introduction of export controls on highly geographically localised primary mineral sources. In this article, IDTechEx presents the valuable lessons that can be learned from the success of the platinum group metals...
DigiKey unlocks Engineering Unlocked video series - A new video series looking at the future of engineering – dubbed Engineering Unlocked – has been launched by the Thief River Falls-based distributor, DigiKey. The three-episode series, which is supported by Microchip and Molex, considers the future of electronics design. Specifically, explores how...
Samsung's 2nm yield surpasses 60%, tripling in 6-month span - Samsung Electronics has reportedly raised the yield of its 2nm wafer foundry process above 60%, a significant jump from around 20% in the second half of 2025. Industry analysts say this improvement not only cuts manufacturing costs but also boosts Samsung's chances of securing new orders.
What Policymakers Must Fix in Europe’s Chips Act 2.0 - As Brussels prepares the next phase of its semiconductor push, the real challenge may lie less in technological choices than in fixing the policy machinery itself. The post What Policymakers Must Fix in Europe’s Chips Act 2.0 appeared first on EE Times .
Redefining What’s Possible in Photonics: Visible GaN Lasers and Compact Coherent Transceivers - By Marcus Duelk, Mathieu Faucher & Marco Rossetti The rapid evolution of photonics is reshaping what’s possible in precision sensing, quantum technologies, and advanced imaging. At the core of many of these breakthroughs lies a fundamental component: the single-frequency laser. …
Panasonic thick-film resistors as accurate as thin film - Panasonic’s ERJPC high precision thick-film resistors series claim to deliver accuracy levels previously only achievable with thin film technology. With a TCR (Temperature Coefficient of Resistance) as low as 25ppm/K and tight tolerance options down to ±0.1% and ±0.5%, the new devices provide twice...
[News] Decoding Google’s TurboQuant: 6x KV Cache Cut—Headwind for Memory Players? - Please note that this article cites information from Tom’s Hardware, Investing.com, and Google. A new Google research breakthrough is sending ripples through the memory sector, with claims that it can sharply reduce memory consumption without any loss in model accuracy. According to Tom’s Hardw......
Phison partners with EU vendors to deploy Pascari PCIe Gen5 SSDs - Phison Electronics is partnering with AIC, InWin, and other platform, server, and PC solution providers to deploy Pascari PCIe Gen5 SSDs across the EU, targeting storage bottlenecks for AI and data-center workloads. The move carries wider implications for global supply, energy efficiency, data sovereignty,...
War and Chips. And the KMT. - [Opinion] Once atop an authoritarian dictatorship, the KMT's role in maintaining peace, and keeping the chips flowing, is of increasing importance.
Chiplets: 8 best practices for engineering multi-die designs - Multi-die designs introduce new engineering complexities and design considerations spanning packaging, verification, and thermal dynamics. The post Chiplets: 8 best practices for engineering multi-die designs appeared first on EDN .
Grating Coupled COUPE for CPO, and Himax's Fragile FAU Moat - An engineering deep dive into TSMC's COUPE optical engine, explaining why the co-design position of Himax makes them critical near-term suppliers for NVIDIA\u2019s CPO, but without a long-term moat.
Scientists Reinvent a Classic Material To Help Power the Future of Quantum Tech - A reengineered version of a classic crystal reveals unexpected behavior, hinting at new possibilities for faster, more efficient information transfer. A new twist on a long-known material could help push quantum computing forward and cut energy use in modern data centers, according to a team led by Penn...
