Scientists Create Tiny “Nanolaser” That Could Revolutionize Future Computers - Researchers have created an ultra-compact nanolaser that could transform how data moves within microchips, replacing electrical signals with light. The idea of computers communicating with light instead of electricity is moving closer to reality, thanks to a breakthrough nanolaser developed at the Technical...
Samsung bets on turnkey strategy as non-memory strength becomes critical - Samsung Electronics is aggressively pushing its semiconductor "super-gap" core strategy centered on a turnkey solution model. However, the success of this approach hinges on restoring and rebuilding competitiveness in its non-memory businesses.
Toshiba’s DTMOSVI 600V super junction power MOSFETs address datacentres - Toshiba is expanding its DTMOSVI series lineup – for switched-mode power supplies for industrial equipment – with DTMOSVI 600V HSD (High-Speed Diode) N-channel power MOSFETs. Featuring a super junction structure, the seven new products are available in TO-247, TOLL, and DFN8×8 packages. TK058V60Z5...
New Carbon Nanotube Coating Could Supercharge 6G Technology - Ultrathin nanotube films absorb terahertz waves, boosting 6G performance and enabling advanced shielding and medical applications. Researchers at Skoltech, working with colleagues from KTH Royal Institute of Technology in Sweden, have developed a key technology that could support future 6G communications...
JEDEC updates LPDDR5/5X SPD with Enhanced Mode Switching support - Jedec has officially updated its LPDDR5/5X Serial Presence Detect (SPD) Contents standard, adding support for calculating recovery time when switching operating modes, with JESD406-5D. Bill Gervasi, of Monolithic Power Systems, and Chair of the JEDEC SPD Task Group, commented: “Reducing power consumption...
Overcoming interconnect obstacles with co-packaged optics (CPO) - CPO integrates optical components directly into a package, replacing long copper traces with shorter connections. The post Overcoming interconnect obstacles with co-packaged optics (CPO) appeared first on EDN .
Semicon China 2026: AI spending nears US$800 billion, IBS flags 2028 chip cycle risk - SEMICON China 2026 spotlighted the scale of the AI investment boom, with Handel Jones, CEO of International Business Strategies (IBS), estimating that global AI and data center capital expenditure has surged from about US$110 billion in 2020 to roughly US$600 billion in 2026.
Systematic Analysis of CPU-Induced Slowdowns in Multi-GPU LLM Inference (Georgia Tech) - A new technical paper, “Characterizing CPU-Induced Slowdowns in Multi-GPU LLM Inference,” was published by the Georgia Institute of Technology. Abstract “Large-scale machine learning workloads increasingly rely on multi-GPU systems, yet their performance is often limited by an overlooked component:...
[Blog] Advancing Embedded AI, Security, and Connectivity at embedded world 2026 - One of the year’s largest global trade shows, embedded world is a place for Lattice and its industry partners to gather and discuss the innovative solutions enabling engineers to deploy intelligent, scalable designs from cloud to sensor. If we missed you at the event, here’s a snapshot of our presence...
Intel confirms CPU price rises amid supply constraints, raising global hardware costs - Intel has confirmed it has begun raising CPU prices for OEM customers in response to ongoing supply constraints and rising raw material costs. According to Nikkei Asia , both Intel and AMD have notified clients of planned price increases in March and April 2026. The report notes that AI-driven global...
