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 Engineering the Next Era of Semiconductor Innovation  - The semiconductor industry is entering a transformative new phase, driven by the convergence of artificial intelligence, cloud computing, and increasingly complex chip architectures. That message took center stage during the keynote talks at the Siemens EDA User2User 2026 North America conference. Executives...

 The impact of nanoplastics on neurons may depend on their size  - Smaller plastic particles have more effects on neurons, the key information processing cells of the brain, new research from the University of Eastern Finland shows. In the study, neuronal cells were exposed to polystyrene ...

 Chemical efflux imaging using an annular nanosensor array for in situ bladder cancer detection  - An annular carbon-nanotube nanosensor array integrated onto a medical-grade catheter enables near-infrared, in situ spatial mapping of bladder cancer-associated protein biomarker release in the bladder with 182-fold higher sensitivity than urine sampling.

 Nexperia hooks up with Polar for MOSFET fab  - Nexperia is to manufacture power MOSFETs at Polar Semiconductor, the US foundry. Polar , runs a fab in Minnesota, originally built in 1969, which has extensive experience in power processes. With over six decades of semiconductor manufacturing and a 25+ year heritage in automotive production, Polar is...

 A 30% rally in BOE Tech shows how AI buildout can galvanise Chinese LCD maker  - Chinese maker of LCD displays sees a surge in its share price following an attempt to diversify into AI with US manufacturer Corning

 TAITRA says Computex participating firms exceed US$10 trillion in market value  - Computex 2026 is set to officially open in Taipei, and Taiwan External Trade Development Council (TAITRA) Chairman James C.F. Huang has stated that the combined market capitalization of foreign companies participating in forums and keynote sessions at this year's event exceeds US$10 trillion. He also...

 Humanoid robot mass production hits a thermal wall

 From boom-bust to structural growth? Memory's US$1 trillion moment puts AI thesis to the test

 Taiwan's Wah Lee expands into specialty gases as materials costs are passed on quarterly

 Unitree sprints toward IPO as profits crumble under rising costs

 Samsung reportedly to expand Vietnam footprint with new memory chip testing plant

 TSMC CEO promises bonus growth above 30% in 2026 if performance holds

 Dreame's 941-company ecosystem targets growth far beyond robot vacuum cleaners

 Xiaomi saw nearly 60% profit drop amid memory cost 'super cycle'

 OpenAI targets smaller advertisers in push to make ChatGPT ads pay off

 Hiwin opens Italy HQ, bridging Europe to global markets

 Dropbox co-founder Andrew Houston to step down as CEO, Ashraf Alkarmi named successor

 Nvidia CEO says Taiwan needs more electricity, ministry confirms 5.2 GW of gas capacity to be added

 CSP capex surge fuels hot AI server demand and tight supply in 2026

 Qualcomm's ByteDance deal gives smartphone chipmaker entry into AI data center market

 China clears 9 domestic AI chips for state procurement

 WinWay's new Kaohsiung plant to break ground on May 29

 Samsung wage deal pushed through by chip workers, widening bonus divide

 Global DRAM revenue surges toward US$100 billion in 1Q26 on AI-driven demand

 ICP DAS expands semiconductor controller orders and accelerates TPU medical pivot, plans factory expansion

 Daxin Materials advances into Low Dk and Low Df market for booming AI server and LEO satellite applications

 Jensen Huang: Taiwan is center of AI revolution, with US$150 billion in capex powering local ecosystem

 WinWay weighs Texas shift after AI chip testing surge in North America

 Acer sees CPU shortages worse than memory as 2H24 PC market weakens

 Qualcomm and ByteDance's rumored AI ASIC deal signals potential shift in China's data center chip supply

 IREN signs US$1.6bn Dell deal for Blackwell AI systems to expand Texas data center capacity

 Cadenceは EMA Design Automation と FlowCAD を迎え入れます  - 皆様に嬉しいお知らせをお届けします。EMA Design Automation(以下、EMA) と FlowCAD のチームがケイデンスデザインシステムズ(以下…

 Taking Custom Logic Further With the Latest CLB Enhancements  - A brief look at the CLB peripheral on the new PIC18F-Q35 microcontroller and how it expands on the CLB from its previous iteration.

 Implementing feature rich applications on entry-level MCUs  - Here is an MCU benchmark, or point of reference, that can be used to figure out if an application is feasible and cost-effective. The post Implementing feature rich applications on entry-level MCUs appeared first on EDN .

 Andy Ault, Hemlock Semiconductor’s SVP of Manufacturing, to Retire  - Ault served for nearly two decades at the company, focusing on safe and efficient production HEMLOCK, Mich. — Hemlock Semiconductor, the nation’s leading producer of hyper-pure polysilicon for the semiconductor and solar industries, today announced that Senior Vice President of Manufacturing Andy...

 LightSpeed Photonics Targets AI Data Centers With 400-Gbps Near-Packaged Optical Interconnects  - The Singapore-based startup develops optical transceivers for the next generation of data center infrastructure. The post LightSpeed Photonics Targets AI Data Centers With 400-Gbps Near-Packaged Optical Interconnects appeared first on EE Times .

 CEVA Accelerates Wireless Edge Innovation with Bluetooth HDT and Integrated RF Design Win  - CEVA, the leading licensor of wireless connectivity and smart sensing technologies, is advancing its full-stack wireless strategy with the introduction of next-generation Bluetooth High Data Throughput (HDT) capabilities and a major integrated RF subsystem design win. The announcement underscores CEVA’s...

 Huawei’s new chip scaling law aims to sidestep ASML chokepoint but hurdles remain: analysts  - If proven, the innovation marks a significant milestone for Huawei, which has been cut off from advanced semiconductor technology since 2019

 Huawei's chip law looks less like Moore and more like marketing  - Chinese tech biz shows off clever workaround for its process node gap, but it isn't catching up with Intel and TSMC

 Huawei claims path to 1.4nm-class chips without leading-edge litho  - Huawei has outlined an alternative semiconductor scaling roadmap that it says could deliver chip technology equivalent to the 1.4nm-class process node by 2031.

 Optimised layer improves chip bead ferrite resistance  - Chip bead ferrites can be made more resistant to high current surges, write Würth Elektronik’s Markus Holzbrecher and Mohamed Koobar. Figure 1: Typical application with peak current at switch-on (5A/DIV |100μs/DIV) Chip bead ferrites are sensitive to current peaks, which typically occur when switching...

 Research Bits: May 26  - Three approaches toward energy-harvesting displays. The post Research Bits: May 26 appeared first on Semiconductor Engineering .

 Flash diagnostics and health monitoring for NOR memory  - The premise of NOR flash diagnostics marks a shift from reactive fault handling to proactive health monitoring of memory device. The post Flash diagnostics and health monitoring for NOR memory appeared first on EDN .

 Emerging Battery Technologies Accelerate Off-Highway Electrification  - Future battery technologies beyond just NMC and LFP will be critical to the electrification of many off-highway machines. This article highlights which technologies are able to meet the unique demands of such machines and are expected to see greater adoption in the future off-highway market.

 18-channel LIN RGB LED controller with an integrated DC/DC converter,  - Melexis has brought out the MLX81119, an 18-channel LIN RGB LED controller with an integrated DC/DC converter, designed to simplify and optimize automotive lighting systems. By generating the LED supply voltage locally on chip, the MLX81119 significantly reduces power dissipation, external components...

 [News] SK hynix Introduces iHBM Solution, Targets HBM5 Adoption with 30% Thermal Resistance Reduction  - As thermal management emerges as a key challenge for HBM, SK hynix has unveiled its iHBM solution, which integrates cooling elements (ICEs) directly into the HBM package. The company plans to adopt the technology in next-generation products, including HBM5, according to its press release. Accordi...

 An Interview with Nvidia's Deepu Talla About Physical AI and Robotics  - Industrial businesses orchestrating across embodied & digital agents, world models, hybrid edge-cloud & \\

 Huawei will now power electric two-wheelers with HarmonyOS tech  - Huawei has formed a partnership with Aima Technologies to provide smart driving services for new electric two-wheelers featuring the HarmonyOS intelligent ecosystem. The company will share...

 TOPPANグループのSiam Toppan、世界包装機構「ワールドスター賞 2026」を受賞  - タイの伝統文化とサステナビリティを融合した「One More Thai Craft Chocolates」のパッケージが選出、「interpack 2026」にて授賞式が開催

 How Rack Power Density Is Opening a New Market for Active Copper  - As AI racks grow too dense to power and cool, their scale-up networks spread across cabinets, and the short links in between are where active copper finds its market.

 Chinese GPU maker sells out over 30,000 gaming GPUs within 48 hours despite lukewarm benchmarks — LX 7G100 proves hype trumps performance  - Lisuan Tech reports having sold out 30,,000 preorder LX 7G100 graphics cards with a second batch on June 18.

 Technical Ceramics Market worth $20.27 billion by 2031 - Exclusive Report by MarketsandMarkets™  - Ceramics Market by Material (Oxide, Non-oxide), Product Type (Monolithic Ceramics, Ceramic Coatings), End-use Industry (Electronics & Semiconductor, Automotive, Energy & Power, Medical, Military & Defense), and Region - Global Forecast to 2031', The technical ceramics market is projected

 Elmos: Annual General Meeting approves dividend of 1.50 Euro per share  - Large majority for all agenda items - Guido Meyer (60) and Tobias Weyer (42) elected to the Supervisory Board

 Huawei says Chinese AI models are just 2.7% behind US in performance  - Huawei has revealed the curtain on another important piece of news that says the Chinese AI models are just 2.7% behind the US technologies regarding the...

 SkyWater Expands Advanced Packaging Capabilities to Support AI and Next-Generation Computing  - As the advanced packaging community gathers for the 76th IEEE Electronic Components and Technology Conference this week, SkyWater Technology is...

 The Impact of Rising Silver Prices on the Conductive Ink Market  - The conductive ink market relies heavily on silver as the conductive element of the ink. With sharply increasing silver prices, alternative inks are coming to the market including low-silver, copper and carbon inks.

 Curvilinear Masks Push The Limits Of Inspection And Metrology  - Key Takeaways: Curvilinear masks require native data flows across design, mask data prep, writing, inspection, and metrology. Inspection is shifting from finding all defects to identifying which mask variations actually print on wafer. High-NA EUV will intensify inspection challenges, particularly for...

 Alibaba gets Android 16 running on RISC-V  - Beijing’s sovereign stack ambitions strengthen

 Inside Akeana and Cadence’s Secret Sauce for Faster RISC-V Chip Verification  - The Nightmare of Chip Testing (And How to Fix It) Let's be real: designing ambitious…

 Power Tips #153: How to generate a regulated negative output from a negative input using a boost controller  - How to deal with the reality that a standard buck controller power stage won’t work for negative-input conversion. The post Power Tips #153: How to generate a regulated negative output from a negative input using a boost controller appeared first on EDN .

 Low-power, flexible radio-frequency transistors break 100 GHz barrier  - Over the past decades, electronics engineers worldwide have been trying to develop devices that could enable even faster communications between devices, all while consuming less energy. To meet the demands of the sixth generation ...

 You Say “Ultra-Low-Power Connected Edge AI,” I Say “Nordic Semiconductor”  - There are many ways to slice and dice embedded engineering space (where, as everyone should know by now, no one can hear you scream). Take microcontrollers, for example. If I were to raise the topic of MCUs in a room full of embedded engineers, it wouldn’t take long before names like STMicroelectronics,...

 SEMI Foundation News Release: SEMI Foundation and the U.S. National Science Foundation Launch First Four Regional Nodes of the National Network for Microelectronics Education (NNME)  - View the original SEMI Foundation News Release here. National Workforce Infrastructure Initiative Activates More Than 325 Organizations Across the United States to Accelerate America’s Microelectronics Talent Pipeline MILPITAS, Calif., May 26, 2026 — The SEMI Foundation, serving as the Hub Operator...

 EnSilica attending TSMC 2026 European Technology Symposium in Amsterdam.  - The EnSilica leadership team is looking forward to attending the TSMC 2026 European Technology Symposium in ...

 Single-step 8-9x expansion reveals nanoscale centrioles without electron microscopy  - In a study published in ACS Nano, researchers from National Taiwan University report a new expansion microscopy strategy termed high-fold homogeneous expansion microscopy (hiHomoExM), capable of achieving approximately 8–9× ...

 Micron’s Fab 6 Starts LPDDR4 and DDR4 Production, but DDR4 Shortage Is Expected to Persist, Says TrendForce  - Micron has announced that its Fab 6 facility in Virginia, USA, has begun production of LPDDR4 and DDR4 DRAM using the 1α nm process. The LPDDR4 and DDR4 products manufactured at this fab will be shipped to clients in key application segments such as automotive electronics, industrial equipment, networking,...

 Unlocking PPA with Innovus: What’s New and How to Unleash it  - Design teams building low-power silicon face nonstop PPA pressure: reduce dynamic…

 Inside the 800VDC Revolution – Part 1  - Four-Phase 800VDC Transition, Power Rack Economics, SST, Equipment Content/MW Build, Supplier Implications…

 Inside China's humanoid robot boom: Price war, fractured supply chains  - China's humanoid robot market is expanding rapidly, but intensifying price competition and growing concerns over product reliability are beginning to expose structural weaknesses across the supply chain.

 SK hynix unveils 'iHBM' thermal solution to boost AI performance  - the AI environment for its customers."About SK hynix Inc.SK hynix Inc., headquartered in Korea, is the world's top-tier semiconductor supplier offering Dynamic Random Access Memory chips ("DRAM") and flash memory chips ("NAND flash") for a wide range of distinguished customers

 Micron's HBM4 Ramp-Up Progressing Smoothly, HBM4E Mass Production Set for Next Year  - Micron Technology's ramp-up of sixth-generation high bandwidth memory (HBM4) production capacity is progressing smoothly. The company also plans to begin mass production of next-generation HBM4E standard products next year.Manish Bhatia, executive vice president of global operations at Micron Techno

 Designing low-power CGMs with TMR-based magnetic sensing  - Continuous glucose monitors (CGMs) have reshaped diabetes management by delivering real-time glucose readings, freeing patients from frequent finger-stick testing. These Continue Reading The post Designing low-power CGMs with TMR-based magnetic sensing appeared first on EDN .

 US chipmakers in China see revenue rise, defying trade tensions: Hurun list  - American semiconductor firms saw a significant boost in sales from the mainland, as a top list shows which are leading the gains amid high-end silicon demand

 Portable jump starters: A dubious primary use case, but not a total waste  - While its vehicle battery resurrection skills are uncertain at best, this device also offers other useful abilities. The post Portable jump starters: A dubious primary use case, but not a total waste appeared first on EDN .

 Metamaterial-enhanced near-field radiative heat transfer  - Near-field radiative heat transfer between silicon nitride membranes is enhanced several-fold by using metamaterials, opening opportunities for thermal energy harvesting and infrared sensing applications.

 AI boosts the cable market  - Cables of all kinds are seeing significant growth for a number of key reasons. From the expansion of AI datacentres requiring high-performance copper and optical cables to renewable energy and…

 Polar Semiconductor and Nexperia Partner on Power MOSFET Manufacturing to Strengthen Global Supply  - Foundry collaboration strengthens supply stability and supports growth in AI server infrastructure, robotics, industrial, and automotive applications Bloomington, Minnesota, USA / Nijmegen, Netherlands; May 27, 2026 - Polar Semiconductor, LLC and Nexperia B.V. today…

 ~0.1% resolution capacitive position sensor  - Simple circuit ratios sensor capacitance to reference capacitor to measure micrometers. The post ~0.1% resolution capacitive position sensor appeared first on EDN .

 Huawei's Tau Scaling Is Really a Hybrid Bonding Bet  - Tau Scaling is just extreme co-design and a hybrid bonding bet. The same \u201Cworkaround\u201D on a leading-edge node only widens the lead for those with EUV.

 Value of South Korean chip giant SK hynix tops $1 tn  - The market value of South Korean memory chip maker SK hynix soared past $1 trillion on Wednesday thanks to frenzied global demand for the computing hardware that powers artificial intelligence tools.

 VIS\u2019s AI Moment: Why Mature-Node Specialty Processes Are Becoming Strategic Again  - Original Article By SemiVision Research [Reading time: 25 mins]

 Necessity is the Mother of Invention: Huawei Replaces Moore’s Law With Her’s Law  - We now know what China’s been working on to counter U.S. sanctions on EUV technology. The post Necessity is the Mother of Invention: Huawei Replaces Moore’s Law With Her’s Law appeared first on EE Times .

 Samsung strike called off as pay rise agreed  - The threatened strike at Samsung Electronics has been averted as 74% of Samsung’s 78,000 workers in its semiconductor unit voted to accept an offer of a bonus of an average $340,000. However there is bitterness at the differences in the level of the bonus with workers in the memory unit getting $400,000...

 AI infrastructure spending lifts Taiwan electronics sector outlook  - Cloud providers' large-scale investments in AI infrastructure have strengthened demand for Taiwan's electronics supply chain, boosting optimism among local manufacturers, according to a Taiwan Institute of Economic Research (TIER) survey. The survey noted that nearly 40% of Taiwan's electronics and machinery...

 Top 10 circuit-protection devices  - Manufacturers of circuit-protection devices have significantly improved the performance of their safety components to protect electronic devices and equipment from Continue Reading The post Top 10 circuit-protection devices appeared first on EDN .

 The Chip Insider®–Apple, Nvidia, and TSMC: Bifurcation of the Advanced Technology Roadmap for Semiconductors  - Explore how TSMC’s roadmap split is raising new priorities, yet advancing chips along mobile efficiency and AI-HPC performance paths

 Applied Materials Partners with SCREEN To Bring Advanced Wafer Cleaning Technologies to EPIC Center  - Collaborative R&D at Applied’s EPIC Center in Silicon Valley will enable higher yields and faster commercialization of next-generation chips Partnership deepens long-standing joint development relationship to overcome process challenges in leading-edge chipmaking SANTA CLARA, Calif., May 26, 2026

 Sensing Up Close with Wearables and Quantum  - Wearable devices can bridge the gap between the internal and external, by acting as an interface between the body's inner workings and real-time data displayed on a screen. This article covers wearable devices and quantum sensors used in wearables.

 Huawei Nova 16 series and FreeClip 2 Collector’s colors revealed  - Huawei has now announced the colors of the Nova 16 series and the FreeClip 2 Collector’s Edition. While the company began teasing these new devices starting...

 IBM and Abertis are Driving the Future of Mobility with a Global Technology Modernization Agreement  - IBM has announced a new five-year global agreement with Abertis, a leading infrastructure and mobility management group, to modernize Abertis's technological infrastructure. The collaboration includes migrating to SAP S/4HANA, and aims to improve system scalability, reliability and user experience across...

 Tiny on-chip circuit could power next-generation quantum and AI technologies  - Researchers from Monash University have developed a breakthrough nanoscale circuit that can generate, direct, and read light-based information, all on a single chip.

 In Beijing, the US and China tiptoed around tech and critical minerals  - Summit addressed the top and bottom layers – geopolitical framing and trade mechanics – but left the strategic middle layer largely implicit

 [News] Rapidus Reportedly Taps Lam Research Panel-Level Packaging System for 600mm Square Glass Interposer Push  - As Lam Research announced the establishment of its Panel-Level Packaging Center of Excellence (CoE) in Salzburg, Austria, attention has turned to its customer and partner ecosystem. According to EE Times Japan, Yasumitsu Orii, head of Rapidus’ engineering center, delivered a congratulatory vide...

 Defense as a software business  - Defense is no longer a sector that software-intensive companies can ignore on principle or engage with only through the narrow traditional procurement channels, Jan Bosch observes.

 CEO Interview with Baratunde Cola of Carbice  - Baratunde Cola is the CEO and founder of Carbice, an Atlanta, Georgia-based company that develops scalable interface solutions to protect semiconductors and electrical components from overheating in any physical environment. He received his bachelor’s and master’s degrees from Vanderbilt University...

 Side-Channel Risks Across 2.5D/3D Integration and Chiplet-Based Systems (Grenoble INP – UGA et al.)  - Researchers from Grenoble INP – UGA, CNRS, TIMA have released “Spying Across Chiplets: Side-Channel Attacks in 2.5/3D Integrated Systems”. Abstract “Advanced packaging and chiplet-based integration are increasingly adopted to build complex heterogeneous systems beyond the limits of monolithic...

 半導體風雲/矽光子獨角獸Lightmatter 與台積引領AI革新  - 矽光子被視為推進AI基礎建設、快速支應AI發展的重要技術革新。矽光子發展今 迎來兩大盛事, 首先是台積電在今 的技術論壇揭開矽光子起飛的時代,搭載其光引擎COUPE技術的全球首個200Gbps微環調變器(MRM),將於今 進入量產;其次全球矽光子獨角獸美商Lightmatter也在5...

 From Electrons to Photons: CPO Test Interfaces Become the Next AI Infrastructure Battleground  - Original Article By SemiVision Research [Reading time: 20 mins]

 Library Characterization gets a Boost from AI  - The semiconductor industry creates increasingly complex SoC and chiplets using lots of IP and all of that IP needs to be characterized at the cell level. As we design with 3nm and 2nm nodes, the sheer volume of data required for accurate static timing analysis (STA) is greatly increasing. Modern design...

 Enterprise  - Mobile ward rounds, remote consultation, high-definition medical image access, and hospital-wide smart IoT have become standard necessities for medical institutions. Learn how the Xinghe Intelligent Network is driving smart healthcare forward.

 Huawei Kirin 2026 Chip: 238 MTr/mm2 transistor density rivaling TSMC’s 3nm  - Huawei has revealed its Kirin 2026 details, and it reveals a massive upgrade in the chip architecture, including transistor density. He Tingbo, Director and President of...

 Beyond Silicon Valley: Lam Capital's startup contest goes global  - Lam Research's Lam Capital recently held its fourth startup competition, drawing teams from the US, South Korea, Singapore, India, and Taiwan to vie for a sizeable prize pool. US startup Lightfinder won the top prize with a proposal centered on silicon photonics and intelligent software for a chip-scale...

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