New Smart Material Can Control Heat Like a Computer Chip - Scientists have created a programmable material that gives engineers unprecedented control over heat, with potential applications ranging from energy systems to next-generation photonic memory. Heat normally follows strict rules. A material that efficiently absorbs heat from a particular direction and...
Apple’s $30B Broadcom Deal Signals Expansions in AI, U.S. Supply Chain - Apple’s $30B Broadcom bet drags AI data centers and U.S. chipmaking into its orbit… and may hand Intel a lifeline. The post Apple’s $30B Broadcom Deal Signals Expansions in AI, U.S. Supply Chain appeared first on EE Times .
What Defines "Elite" in the Age of Physical AI? - As AI enters the physical world, intelligence alone is no longer enough. Just as elite athletes rely on instinct and reflexes under pressure, physical AI systems must act safely, reliably and instantly in unpredictable environments.
Stackpole expands CSSU series of current sense resistors - Stackpole is expanding its CSSU series of high-power metal alloy current sense resistors with 0.5 mΩ and 20 mΩ options. The new 0.5 mΩ resistor enables lower power dissipation and reduced measurement losses in high-current circuits, highlights the company. And the 20 mΩ value broadens the usable...
Insight: Sony Ends Physical Disc Production - Console Gaming's Ownership Crisis - Sony’s move to end physical PlayStation game discs in January 2028 is more than a distribution shift—it is a defining test of consumer trust. By pushing new releases to the PlayStation Store, Sony can tighten control, reduce hardware complexity, and capture more digital value. But the timing is risky....
CEO Interview with Mark Ren of Agentrys - Mark Ren has 26 years of EDA and AI R&D experience spanning IBM Research and NVIDIA Research, driving design automation innovations that power modern chip design. He received the IBM Corporate Award for contributions to the design closure for high-performance microprocessors. At NVIDIA, he helped establish...
Students Explore Electronic Engineering with Intel and DCU - In June 2026, the School of Electronic Engineering at DCU, in partnership with Intel and the Higher Education Authority (HEA), hosted a transformative introduction to electronic engineering bootcamps ...
TSMC A16 Backside Power at VLSI 2026 - TSMC’s A16 technology , presented as Paper T1.5 at the June 2026 IEEE/JSAP VLSI Symposium , marks the company’s first angstrom-class CMOS platform combining enhanced nanosheet gate-all-around transistors with backside power delivery. The key integration feature is Super Power Rail , or SPR, which...
Component Price Landscape Q2 2026 - The Q2 2026 update to TechInsights’ semiconductor market forecast calls for topline semiconductor sales to skyrocket by 98% in 2026, another substantial increase from the 67% revenue growth projected in the Q1 version. Driving this growth are the ongoing AI boom, with datacenter demand for key products...
Taiwan PCB leaders launch fundraising wave for AI data centers - Taiwan's PCB industry is entering a new expansion cycle as investment in AI data centers and other emerging applications accelerates. Since 2025, several board makers and upstream material suppliers have launched large-scale fundraising plans at home and overseas, including three bellwethers: Zhen Ding...
Hanyang University Researchers Achieve Controllable Doping in Organic Semiconductors - An innovative method leveraging solvent polarity to regulate doping could unlock new applications in wearable electronics and self-powered sensors. The post Hanyang University Researchers Achieve Controllable Doping in Organic Semiconductors appeared first on Semiconductor Digest .
Meta prepares to fab its third custom datacentre chip - Meta is to put the third of its multi-generational MTIA (Meta Training and Inference Accelerators) into production in September as part of its plan to have 14GW of computing power in place in 2027. The chip – dubbed MTIA v3 and nicknamed Iris (pictured) – was designed with Broadcom and is for handling...