Micron Advances Made-in-America Memory With Manufacturing Expansion in Virginia - News highlights: Micron starts manufacturing of 1α (1-alpha) DRAM, the most advanced memory ever produced in the United States, at its Manassas, Virginia, fab, supporting American memory production for critical industries including automotive, defense and aerospace, industrial, networking and
From specification to simulation: Modeling PPTC devices in QSPICE - Here is a short tutorial on the characteristics and SPICE modeling of polymer positive temperature coefficient (PPTC) devices. The post From specification to simulation: Modeling PPTC devices in QSPICE appeared first on EDN .
Chip Industry Week In Review - Taiwan, Europe packaging buildout; 2nm ramps; quantum big $; 2 new university hubs; agent honeypots; Samsung strike averted; extreme environment chip design; quantum-dot qubit device fabricated w/high-NA EUV; EU flagship power electronics project; CNTs. The post Chip Industry Week In Review appeared first...
E-Fortune Cookie Will Humble, But Never Crumble - Will your next project be a success? Only time will tell, but if you build [gokux]’s tiny ESP32 fortune cookie, we predict that, at the very least, there won’t be …read more
ASIC Design Services for Startups | From Idea to Silicon - Launching a hardware startup is difficult. Launching a semiconductor startup is even more complex. Unlike software, where products can be tested, fixed and released quickly, an ASIC project requires careful planning, strong technical execution and the right partners from the very beginning. One mistake...
Cost-Effective High-Performance Flip Chip MicroLeadFrame (fcMLF) Package Introduction - Enabling electrical and thermal performance enhancements while maintaining the manufacturing efficiency and scalability of the MLF leadframe technology. The post Cost-Effective High-Performance Flip Chip MicroLeadFrame (fcMLF) Package Introduction appeared first on Semiconductor Engineering .
SK Hynix reportedly shifts Cheongju mask fab toward HBM yield push - SK Hynix is reportedly moving to reshape part of its Cheongju campus around wafer testing, a shift that underscores how high-bandwidth memory, or HBM, is putting new pressure on the back end of the chipmaking process.
Putting frontier AI to work to strengthen defenses - As AI accelerates cyberattacks, the biggest risk for enterprises is no longer whether vulnerabilities will be found, but how quickly organizations can respond. Frontier models are shrinking...
Four-Tier Memory Hierarchy for LLM Reasoning (USC, UW) - A new technical paper, “Not All Thoughts Need HBM: Semantics-Aware Memory Hierarchy for LLM Reasoning,” was published by researchers at USC and University of Wisconsin-Madison. Abstract “Reasoning LLMs produce thousands of chain-of-thought tokens whose KV cache must reside in scarce GPU HBM. The...
Statement from Creates President & CEO Dave Anderson on Federal Quantum Investments - “The Department of Commerce’s quantum investments announcement supporting related R&D and manufacturing by a number of our industry partners marks a defining moment for quantum innovation in the United States, and we are proud that, in particular, IBM’s first-of-its-kind quantum foundry will be...
U.S. Injects $2B into Quantum Computing Companies - Washington signals its intent to lead the quantum computing revolution with a $2 billion investment and equity stakes. The post U.S. Injects $2B into Quantum Computing Companies appeared first on EE Times .
Axion Semiconductor adquiere Moov Technologies - Axion Semiconductor. Esta adquisición permitirá a Moov ampliar su plataforma y servicios, a la vez que seguirá satisfaciendo las necesidades operativas de los fabricantes de semiconductores y proveedores de equipos en todo el mundo.Para obtener más información sobre Axion Semiconductor, visite
IBM and US DoC put $2bn into Anderon quantum foundry - Yesterday, IBM and the U.S. Department of Commerce (DoC) announced a Letter of Intent (LOI) to build an American quantum chip foundry called Anderon. In addition to the $1 billion in CHIPS incentives provided by the DoC, IBM will contribute $1 billion of cash into Anderon, plus significant IP, assets,...
Taiwan rides chip-led export boom to bankroll industrial overhaul - AI-driven demand and other emerging technologies kept Taiwan's export momentum strong in the first quarter of 2026, with exports reaching US$195.74 billion, rising 51% year on year. Economic growth hit 13.69%, the highest quarterly growth in 39 years. Taiwan's GDP is forecast to reach NT$32 trillion (US$1.02...
[Blog] A New Approach to BMC Architecture - Modern server platforms are entering a new era of complexity. AI and machine learning (ML) workloads are demanding denser, more specialized compute configurations. Heterogeneous accelerators, from GPUs to custom ASICs, are becoming standard fixtures alongside traditional CPUs. Disaggregated and modular...
Lam Research Corporation Declares Quarterly Dividend - Lam Research Corporation (Nasdaq: LRCX) today announced that its Board of Directors has approved a quarterly dividend of $0.26 per share of common stock. The dividend payment will be made on July...
Semiconductors Historic Start to 2026 - The global semiconductor market grew 25% in the 1st quarter of 2026 from the 4th quarter of 2025 to reach $299 billion, according to WSTS. The 1st quarter of 2026 was up 79% from a year earlier. The 25% quarter-to-quarter growth was the highest in the over 40-year history of WSTS data, surpassing the...
AI/ML integration in medical systems - Artificial intelligence and machine learning (AI/ML) are increasingly being integrated into medical systems. This delivers smarter and faster care by Continue Reading The post AI/ML integration in medical systems appeared first on EDN .
AMD Plans $10B Investment in Taiwan to Boost AI Infrastructure - AMD to invest more than $10 billion in Taiwan ecosystem, ramping HPC chips on TSMC’s 2-nm process amid AI buildout. The post AMD Plans $10B Investment in Taiwan to Boost AI Infrastructure appeared first on EE Times .
Semtech connects with Z-Wave Alliance - Semtech, the mixed-signal and IoT specialist, is joining the Z-Wave Alliance as a new member and will serve on the standard body’s Board of Directors. The Alliance is the SDO (standards developing organisation) for smart home and IoT wireless comms using Z-Wave. The protocol is used primarily for elements...
Large-scale, SRAM-based LLM Inference Deployment (Groq) - A new technical paper, “SHIP: SRAM-Based Huge Inference Pipelines for Fast LLM Serving,” was published by researchers at Nvidia, with work done while at Groq. Abstract “The proliferation of large language models (LLMs) demands inference systems with both low latency and high efficiency at scale....
Commentary: Trump's Taiwan chip claim tests TSMC's silence - US President Donald Trump, after recently concluding a visit to China, again publicly accused Taiwan of having "stolen our chip industry." This was not the first time he had made such a claim. From the 2024 campaign period to a Fox News interview in May 2026, before his departure after visiting China,...
Scaling the Next Generation of Multi-Die Systems - This year’s EE Times Chiplets event will address challenges in the design flow and chiplet technologies to enable straightforward scaling. The post Scaling the Next Generation of Multi-Die Systems appeared first on EE Times .
PCIe-based Switching for AI Scale-up Networks - Peripheral Component Interconnect Express (PCIe)® is the world’s most popular interconnect for connections between chips in a shared system, while ensuring low latency, and it is well suited to be deployed for the scale-up domain. Scale-up networks extend across racks and possess hundreds of processors;...
MLX81119 integrates on-chip DC/DC power with LIN RGB automotive lighting - For the automotive market, Melexis is releasing the MLX81119, an 18-channel LIN RGB LED controller with an integrated 1A DC/DC converter. The latter generates an optimised local LED supply voltage that is programmable between 2.5 V and 6 V. Example applications include in dashboards and door trim parts,...
ASML High-NA EUV is Not Ready for High-Volume Production - Contrary to the popular press, ASML High-NA EUV is not ready for logic production yet—and it may never be, at least not in the form originally envisioned. If you remember how long it took conventional EUV to become production-worthy—arguably 5–10 years—this should not come as a surprise. More...
Semiconductors Historic Start to 2026 - The global semiconductor market grew 25% in the 1st quarter of 2026 from the 4th quarter of 2025 to reach $299 billion, according to WSTS. The 1st quarter of 2026 was up 79% from a year earlier. The 25% quarter-to-quarter growth was the highest in the over 40-year history of… Read more “Semiconductors...
Low-Temp Solders Are Suddenly Critical For Chiplets And Photonics - Key Takeaways: Tin-bismuth-based solders enable reduced warpage and compatibility with silicon photonics and other temperature-sensitive components. A novel soldering process using white light could help prevent cracks in flip-chip BGA package solder balls, while reducing the carbon footprint. Hypoeutectic...
Light-Matter Particles Could Revolutionize AI Computing - Penn scientists may have found a way to power future AI with exotic light-matter particles instead of electrons. Eighty years after the debut of ENIAC, the world’s first general-purpose electronic computer, researchers at the University of Pennsylvania are exploring a radically different future for...
Shock Block SB4000 30A in-line safety breaker sealed to IP69K/NEMA 4X - Littelfuse is introducing a compact 30A ground fault circuit interrupter (GFCI), the Shock Block SB4000. The standard enclosure is IP 69K/NEMA 4X and outdoor rated making it suitable for industrial environments. The models equipped with connections for a neutral wire have built-in grounded-neutral protection...
Siemens EDA Expands AI and Advanced Packaging Collaboration with TSMC - At the recent TSMC Technology Symposium 2026 , Siemens EDA reinforced its position as one of the key ecosystem partners supporting TSMC in the race toward AI-driven semiconductor design, advanced packaging, and next-generation process technologies. The annual forum has become one of the semiconductor...
Driving Innovation Across Smartphones, Data Centers, and More - Over the last 20 years, MediaTek has grown into a key player in modern computing. Today, the focus shifts toward AI, connecting devices from edge to cloud and enabling smarter experiences across industries. Learn more from MediaTek's Rahul Sandil on the company's philosophy behind its...
Enabling Conversational AI at the Edge - Voice is the interface, was the defining message of the voice community in 2025, and it continues to resonate today. Language is one of the first communication skills humans learn and remains the most natural way we interact throughout our lives.
Semicon News Aggregator Page: The freshest links are havested from the domains below.
