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 🌑 🇹🇼🇨🇳 AsiaPac 
🇰🇷🇦🇺 ---  ☀️ +

 Semi. Fabs and Clean Rooms
2½h ago: Micron shifting to long-term cleanroom contracts in Taiwan amid $300B+ expansion, with multiple new halls under construction. TSMC ramping capex to $60B+ in 2026. India advancing first AI-enabled fab (Tata) and multiple packaging plants with first silicon fab targeted 2028. US projects continuing with TSMC Arizona in HVM, Intel 18A ramping, Samsung Texas resuming. Construction labor now the key bottleneck alongside power and advanced packaging.

 [News] Apple Said to Have Signed NAND LTA with Kioxia Seen as Likely Partner; Foldable iPhone Memory Suppliers in Focus  - Ahead of Apple’s product launch event later this week, memory is back in the spotlight as surging prices put the company’s sourcing strategy under close watch. South Korean media outlet Economy Tribune reports that Apple has recently turned to a long-term supply agreement (LTA) for NAND, marking......

 Automotive coolant level sensors: Fundamentals to stay cool  - Vehicle engines churn out enormous heat, and without coolant level sensors, the consequences are catastrophic. The post Automotive coolant level sensors: Fundamentals to stay cool appeared first on EDN .

 TSMC COUPE Is Evolving: From a Silicon Photonics Engine to an Active Photonics Integration Platform\  - TSMC COUPE Is Evolving: From a Silicon Photonics Engine to an Active Photonics Integration Platform

 Weekly news roundup: AI memory race heats up, Taiwan manufacturing rebounds, Nexperia rift deepens  - AI infrastructure and semiconductor supply chains led reader interest this week, from Taiwan's manufacturing recovery and Nexperia's legal battle to Sandisk's HBF, Micron's HBM expansion, and Marvell's silicon photonics roadmap. Samsung also refreshed its smartphone lineup with the Galaxy S26 FE. Below...

 AAOI UPDATE  - CURRENT THOUGHTS

 Tech The Money: Nvidia’s New Friends Are Old Friends  - But first, I’m keeping a promise: Prices are rising.

 China’s semiconductor long march reaches its midpoint  - China’s semiconductor long march reaches its midpoint As Chinese memory makers gain ground under U.S. sanctions, Korea needs a long-term strategy to preserve semiconductor leadership. 9/6/2026 - 11:01 AM Opinion Desk

 When AI Chips Depend on a Bottle of Gas: How WF\u2086 Is Emerging as a New Bottleneck  - Oroginal Article By SemiVision Research [Reading time: 10 mins]

 Stock Market Weekly Retrospect #2  - Jointly released from TheBigBerbowski Investing and me.

 America owes the Philippines more than empty praise  - Elbridge Colby touts alliance, but path from promise to payoff is fraught

 Samsung Electronics union runs Times Square ad opposing AI-driven job cuts  - Samsung Electronics union runs Times Square ad opposing AI-driven job cuts The union, which represents the nonsemiconductor consumer electronics and smartphones division, also plans to hold protests near Samsung Electronics Executive Chairman Lee Jae-yong's residence in central Seoul. 9/5/2026 - 05:01...

 ☀️ 🇩🇪🇨🇭🇫🇷 EMEA 
🇮🇱  ---  🌑

 Romanian software branch now fully in Sioux’s hands  - Sioux Technologies has fully acquired its software branch in Cluj-Napoca.

 The Things Conference 2026 to focus on IoT, Edge AI and connectivity  - The The Things Conference 2026 will take place in Amsterdam on 22 and 23 September, bringing together developers, technology…

 China’s semiconductor long march reaches its midpoint (KOR)  - China’s semiconductor long march reaches its midpoint (KOR) As Chinese memory makers gain ground under U.S. sanctions, Korea needs a long-term strategy to preserve semiconductor leadership. 9/6/2026 - 09:44 PM Opinion Desk

 台積電揪團搶攻算力商機 OIP論壇瞄準3方向 輝達、聯發科等大咖登場開講  - 台積電集結AI生態系,搶攻新一波算力商機。 度開放創新平台(OIP)生態系論壇首站將於9 23 在美國矽谷登場,先進製程、3D IC與共同封裝光學(CPO)將成焦點。業界觀察,台積電正將製程優勢延伸至晶片、封裝與系統協同設計,為下一代AI晶片商用鋪路。...

 Comparing Advanced Packaging from TSMC, Intel Foundry, and Samsung Foundry  - Advanced semiconductor packaging has become essential to improving computing performance as conventional transistor scaling grows more difficult and expensive. Instead of manufacturing an entire processor as one large monolithic die, chipmakers can divide it into smaller chiplets and combine logic, memory,...

 Huawei paper shows Tau Scaling Law chip solves overheating ahead of Kirin 2026 launch  - The research directly counters claims that vertical stacking creates a thermal bottleneck, the tech giant’s paper says

 Hot Chips 2026: HBM Base Die Evolves from a Memory Interface into a Computing Engine — Samsung Unveils a Three-Phase Roadmap Toward Custom HBM, aHBM, and zHBM  - At Hot Chips 2026, Samsung Memory Business presented \u201CHBM Base Die: How HBM Will Evolve Using Advanced Logic Processes,\u201D outlining a structural shift in the evolution of High Bandwidth Memory.

 South Korea exports surpass full-year record, hit $709.4bn so far  - Booming demand for AI chips powers shipments

 Industry Performance (TCI Graphics) – September 3, 2026  - Semiconductor equipment order activity held steady at 99 °F this week. The data gives weekly, monthly, quarterly, and yearly views and analysis to help manage the supply chain.

 🌑 🇨🇦 Americas 
🇺🇸 ---  🌔 +

 High rates and won strength lift South Korea bank stocks as haven  - With semiconductor stocks faltering and the KOSPI stuck in a trading range, bank stocks are emerging as a new haven.

 First Technology Developers' Day Honors Samsung, SK Hynix Researchers

 Samsung Probes Housing Fund Misuse Amid Semiconductor Bonus Disputes

 MBK Partners resumes domestic deals amid SS Fund capital depletion

 Taiwan Semiconductor Firms Form Silicon Photonics Alliance

 MBK Partners returns to South Korea, accelerates deals as SS fund deadline nears

 TSMC and Taiwan industry launch silicon photonics alliance to lead AI era

 KOSPI Nears 7,000 on OpenAI AI Infrastructure Optimism

 OpenAI Astra sparks AI frenzy as Korea’s KOSPI nears 7000; chips surge

 Banking Stocks Emerge as Safe Haven on High Rates, Weak Won

 KOTRA drives Korea-India trade as exports to India surge 31%

 Elon Musk Injects $250,000 to Aid Texas Republican Senate Candidate

 Line Works Adopted by Taiwan's Hsinchu City as Official Collaboration Tool

 Naver Cloud Consortium Selected for Cybersecurity AI Foundation Model

 Goldman Sachs backs KOSPI 12,000 as Korea earnings and memory boom rise

 Goyoung Technology debuts 3D chip inspection at Semicon Taiwan 2026

 NVIDIA Emerges as AI Industry's Central Bank

 KOSPI Rises 3% Led by Foreigners, Institutions

 South Korea's Exports to India Surge 30.8% to $16.8 Billion

 Foreigners, institutions drive Korea stocks higher as KOSPI nears 6,900

 KOSPI Surges Over 3% on Memory Semiconductor Rally

 KOSPI Surges 3% as U.S. AI Demand Boosts Samsung, SK Hynix

 OpenAI AI debut powers Korea chip rally, lifts Kospi over 3% at open

 OpenAI's Astra: Memory Retention Drives 99.9% AI Performance

 Hsinchu City Adopts Line Works for Collaboration

 Samsung Electronics, SK Hynix Face Historic Memory Inventory Plunge

 Cho Kuk urges trust reset, seeks apology as South Korea merger talks stall

 SK hynix accelerates 1c DRAM shift to lead HBM4E race in South Korea

 Korea debates doubling nuclear plant lifespans amid power demand surge

 SK Hynix Boosts 1c DRAM Share for HBM4E Leadership

 SK Group Targets Subsidiaries Below 100

 South Korea Exports Surpass 700 Billion, Eye 1 Trillion

 South Korea, U.S. Disagree on Gwangju Relocation Approach

 Ministry's Labor Guidelines Spark Confusion Over Dispute Triggers

 Exclusive: Infineon Dresden fab to hit full capacity in 2-3 years, COO says  - Infineon COO Alexander Gorski told DIGITIMES in an exclusive interview at SEMICON Taiwan 2026 that the company's new Dresden fab is ramping at twice the pace of prior expansions, boosted by AI tools and a single virtual fab strategy. He said the facility could reach full capacity in two to three years...

 India frames its chip build-out as redundancy for the world, and Taiwan as its partner in building it

 SEMICON Taiwan 2027 moves to August, aligning with TSMC's 40th anniversary

 STMicroelectronics says humanoid robots must clear a trio of hurdles

 HBM4 squeezes DRAM supply as Samsung, SK Hynix inventories fall below 10 days

 Model fatigue, China's price pressure, and a profit horizon still years away

 Yaho rides TSMC, Micron expansion wave to tap facility integration, equipment installation market

 Xiaomi warns of more India price hikes as AI squeezes the phone from both sides

 Micron scores seventh PTAB win in YMTC patent fight

 NEC reportedly ends quantum computer hardware development, shifts focus to annealing

 DeepSeek plans to buy 160,000 Huawei chips as China aims to wean itself off Nvidia

 Phison snaps up low-cost China NAND inventory, AI revenue share set to top 40%

 Exclusive: Infineon COO says chip shortage recovery will take longer

 Foxconn revenue climbs on AI server demand, outlook improves

 Huawei Kirin 2026 challenges 3D chip heat limits with Tau Scaling Law

 Chicony Power's August revenue dips as AI server and satellite demand strengthens

 India says it cannot build electronics without China and has started easing the rules to prove it

 Anthropic IPO set to put AI governance under public-market scrutiny

 India's TCS unit secures land in Hyderabad for planned 1GW AI data center campus

 JM-Applied sees gas equipment demand surge on AI expansion, order book exceeds NT$3 billion

 SK Hynix 1c DRAM production share to reach 34% by year-end ahead of HBM4E

 Naura 3D DRAM etching breakthrough could give CXMT a new path beyond EUV

 Analysis: Under tariff threats, Taiwan chipmakers hedge beyond US

 Strong H1 for IQE  - IQE reported a strong first-half performance, with revenue growth of more than 40% year-on-year driving a step change in profitability. Revenue increased 43% year-on-year to £64.6m Adjusted EBITDA of £6.0m, […] The post Strong H1 for IQE appeared first on Electronics Weekly .

 [News] TSMC’s 3nm Reportedly to Overtake 5nm as Top Revenue Node in 2H26; Output Value Could Top NT$400B  - TSMC’s 3nm node is set for a stronger ramp in 2H26, fueled by surging demand for AI and high-performance computing (HPC), particularly as NVIDIA’s Rubin platform ramps up. Citing analysts, the Economic Daily News reports that 3nm is expected to overtake 5nm in revenue contribution for the first ......

 BenQ Materials targets CPO in semiconductor push  - BenQ Materials Group has formally positioned semiconductor materials as a key future growth driver, using its existing coating, membrane, foaming, and adhesive technologies to move into wafer manufacturing, back-end packaging, and co-packaged optics (CPO). With chemical mechanical planarization (CMP)...

 Hot Chips 2026: Irrational Recap  - Spicy chips. No air conditioning.

 Researchers Discover a Gut Microbe Metabolite That Supercharges Cancer Immunotherapy  - A microbial metabolite called 3,4 dihydroxybenzoic acid, derived from dietary fiber, improved antitumor immunity in mice. A compound made by gut bacteria during the breakdown of dietary fiber may offer a way to strengthen cancer immunotherapy. In mouse studies, University of Michigan researchers turned...