Industry Performance (TCI Graphics) – July 15, 2026 - The semiconductor equipment market remained stable this week, with an overall temperature of 99 °F. The data gives weekly, monthly, quarterly, and yearly views and analysis to help manage the supply chain.
New Material Beats Copper’s Thermal Conductivity - Meet θ-TaN, a metal that moves heat nearly 3× better than copper—and could upend chip cooling layers. The post New Material Beats Copper’s Thermal Conductivity appeared first on EE Times .
Securing the Silicon: The Seismic Shift to Hardware Security - My podcast guest this week is Jason Oberg from Arteris. Jason and I discuss this profound transition toward hardware security, explore how Cycuity’s integration into Arteris is changing the game for system-level security and discuss how teams can address the emerging risks in our era of distributed...
Future of Memory And Storage - Future of Memory & Storage has long been regarded by the industry as the world’s most important and...
Murata: Should you buy? - The world's #1 capacitor maker just became famous. That's exactly the problem. How a Kyoto ceramics house became the toll booth of the AI build-out and what does it mean for the stock price.
[News] TSMC After Earnings Call: Foreign Brokerages See EUV-Driven CapEx Surge and 2027 Price Hikes - At TSMC’s earnings call yesterday, the foundry giant surprised the market by raising both its 2026 CapEx and full-year revenue growth outlook, even as it warned that the 2nm ramp-up and overseas expansion would weigh on gross margins. Following the updated guidance, foreign brokerages released fre......
Market Data: Wafer Demand - These reports cover the number of wafers produced by year by product category and technology node as well as product category by wafer size through the next five years.
Deterministic single-electron trapping on solid neon using engineered dielectric surface geometry - …ultra-clean, inert environment suppresses conventional decoherence pathways associated with lattice disorder, charge traps, and nuclear-spin baths that limit coherence in semiconductor qubits. Yet, uncontrolled surface features such as bumps, valleys, and electrode-defined gaps can bind electrons unintentionally,...
AI Changes the Conversation: The Network-on-Chip Strikes Back - I bet you woke up this morning saying something like, “I wonder what the latest and greatest interconnect technologies are for System-on-Chip (SoC) devices and multi-die system (MDS) solutions.” Well, this is your lucky day because I’m about to reveal all. You’ve doubtless heard the popular saying,...
Snapdragon C Targets $300 Laptop Market Imperiled by ‘RAMageddon’ - Following the launch of Apple’s MacBook Neo in March, PC OEMs are once again focusing on the value market segment. While the MacBook Neo recycles Apple’s A18 Pro SoC from the iPhone 16 Pro from 2024, Qualcomm takes a deeper dive into its product portfolio, essentially repurposing a Dragonwing-branded...
TYLsemi De-Risks Chiplets With New Business Model - Startup TYLsemi wants to address the gap between ASIC houses and design services, taking on the risk of developing large chiplet-based chips for AI infrastructure customers. The post TYLsemi De-Risks Chiplets With New Business Model appeared first on EE Times .
CEO Interview with Madhulima Tewari of VerifAIX - Madhulima Tewari is the CEO and founder of VerifAIX. After two decades building EDA tools, taping out chips, and working on distributed systems, cloud infrastructure, and enterprise AI applications, she teamed up with chip design and methodology leaders and university researchers to build an agentic AI...
Rapidus and Cadence Partner on Agentic AI for Advanced SoC Design - Collaboration combines Rapidus’ AI-Agentic Design Solution with Cadence InnoStack AI Super Agent to target up to a 2X acceleration of design turnaround times. The post Rapidus and Cadence Partner on Agentic AI for Advanced SoC Design appeared first on Semiconductor Digest .
A ferroelectric-fluid motor may challenge magnetic-motor designs - It took 100 years to come to fruition, but this recently created fluid enables non-magnetic electrostatic-based motors. The post A ferroelectric-fluid motor may challenge magnetic-motor designs appeared first on EDN .
Chip Industry Week In Review - Intel's expansion; Cadence AI super agent for PCB, advanced packaging; photonics fab wars; earlier Yongin fab; German funding; new CHIPS Act award; HBM standard; Quadric funding; AMS acquisition; earnings; Rapidus teams up. The post Chip Industry Week In Review appeared first on Semiconductor Engineering...
Scientists Overcome a Major Electrical Bottleneck in Next-Generation Semiconductors - One of the largest obstacles limiting the next generation of computer chips may finally have a solution. The shrinking of computer chips has exposed a stubborn problem: even when a semiconductor can carry electricity efficiently, getting that electricity into the material can waste power and slow the...
Micron Strengthens Automotive Ecosystem Supply Through Strategic Customer Agreements - Collaboration helps support the growing memory and storage demands of connected, smart vehicles BOISE, Idaho, July 16, 2026 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU) has completed Strategic Customer Agreements (SCAs) with key Tier 1 suppliers and ecosystem partners supporting the
TSMC Q2 revenue up 34% YoY; plans another $100bn investment in Arizona - TSMC today announced Q2 revenue of $40.20 billion, which increased 33.7% YoY and increased 12.0% from Q1 for a profit of $22 billion which was up 77% YoY and up 23.4% YoY. Gross margin for the quarter was 67.7%, operating margin was 60.3%, and net profit margin was 55.6% The company announced it would...
India Adds Pieces to Strengthen Its Electronics Supply Chain Puzzle - India races to own more of its electronics value chain, from OSATs to PCBs, but imported materials still hold the leash. The post India Adds Pieces to Strengthen Its Electronics Supply Chain Puzzle appeared first on EE Times .
Trumpf recalibrates strategy as Chinese competition heats up in semiconductors, machine tools - Global suppliers are facing tougher competition as China's semiconductor and machine tool industries expand quickly, with implications for customers, pricing, and technology choices worldwide. Germany's Trumpf says it is responding with innovation in chips and efficiency in machine tools, while trying...
Podcast EP356: An Oveview of the Unique Skills and Broad Impact of Alphacore with Andrew Levy - Daniel is joined by Andrew Levy, Vice President of Business Development, IP & ASIC at Alphacore. Andrew leads strategic growth initiatives, customer engagement, technology commercialization, and business development activities for the company’s semiconductor IP, ASIC design services, and advanced microelectronics…...
Top IC Manufacturing Equipment Suppliers in 2025 - Explore the top IC manufacturing equipment suppliers in 2025 and the market trends driving industry growth. Access TechInsights Total Equipment Market Share Database.
Component Price Landscape Q2 2026 - The Q2 2026 update to TechInsights’ semiconductor market forecast calls for topline semiconductor sales to skyrocket by 98% in 2026, another substantial increase from the 67% revenue growth projected in the Q1 version. Driving this growth are the ongoing AI boom, with datacenter demand for key products...
TSMC Boosts 2026 Expansion Budget, Adds $100B to U.S. Investment - TSMC is raising its 2026 capital budget to $64 billion and adding $100 billion to its U.S. investment for AI. The post TSMC Boosts 2026 Expansion Budget, Adds $100B to U.S. Investment appeared first on EE Times .
Agentrys a New Paradigm for Semiconductor Engineering at 2026 DAC - Agentrys is pioneering Agentic Design Automation (ADA) , a new paradigm for semiconductor engineering. Electronic Design Automation (EDA) has transformed the industry by automating engineering algorithms . Today, frontier AI can automate many engineering tasks by understanding specifications, generating...
PCIe 7 Switch IP with Time Division Multiplexing: Powering the Next Generation of AI Connectivity - PCI Express (PCIe), PCIe switches, Time Division Multiplexing (TDM), Network Interface Cards (NICs), and SmartNICs are all well-established technologies that have formed the backbone of computing and networking systems for years. More recently, SuperNICs have emerged as the next generation of networking...
Why Metal TIM Warpage Simulations Fail—And How To Fix Them - Characterizing the properties of thermal interface materials under actual application conditions. The post Why Metal TIM Warpage Simulations Fail—And How To Fix Them appeared first on Semiconductor Engineering .
