Semi. Fabs and Clean Rooms 5½h ago: Active fab buildouts across U.S., Asia, and India with Samsung's second Austin fab groundbreaking, GlobalFoundries capacity boost, Applied Materials' massive cleanroom R&D center, Tesla Giga Texas construction, and TSMC N2/A14 ramps. AI/ML driving yield optimization but equipment incidents noted. Kaynes Semicon packaging facility operational in India.
Vanilla’s Sweet Secret Could Help Heal Stubborn Wounds - Vanillin could help form wound-care materials while supplying antibacterial activity, a combination made more practical by its low-cost and abundant supply. The compound behind vanilla’s sweet aroma could become an ingredient in wound-care materials. A team from Flinders University’s Biomedical Nanoengineering...
Taiwan’s AI Ambitions Run into Talent Gap - AMD’s David Wang told EE Times that while Taiwan has huge opportunities in rack-scale AI, physical AI, and AI PC markets, the sticking point may well be talent. The post Taiwan’s AI Ambitions Run into Talent Gap appeared first on EE Times .
Kospi rebounds over 2% on eased chip rout, Fed bets - Kospi rebounds over 2% on eased chip rout, Fed bets Stocks rose 2.05 percent as bargain hunting in chip stocks and renewed hopes over Federal Reserve policy lifted investor sentiment. 10/16/2026 - 03:42 AM
Novel high-pressure silicon allotrope with quartz topology from first principles - …i.e., they are mechanically and dynamically stable. Electronic structure calculations show that qtz Si is a semimetal with a vanishing gap, whereas dia Si and lon Si are semiconductors , and bsn and gsi allotropes are weakly metallic. Energy-volume equations of state place gsi and qtz 0.11-0.15 eV/atom...
ABM Maps the Six Phases of a Fab’s Life - With WGNSTAR now part of ABM, the company says it can staff a fab from construction cleaning to decommissioning as U.S. projects multiply The post ABM Maps the Six Phases of a Fab’s Life appeared first on Semiconductor Digest .
Coherent Corp. Announces Timing of FY2027 First Quarter Earnings Release - Coherent Corp. announced today that it will release its financial results for the quarter ended September 30, 2026, on Wednesday, November 4, after the New York Stock Exchange closes. The release will be followed by a live audio webcast at 4:30 p.m. ET to discuss the results.
Fable: The Commonsense CEO - There was once a mega-company which was in trouble – its market cap of $96 billion was down 80% from its value 18 years earlier. It had made an annual […] The post Fable: The Commonsense CEO appeared first on Electronics Weekly .
Dynamic Scattering Controls Speckle Noise and Aberrations in OCT Imaging - Speckle noise and aberrations limit high-resolution optical imaging by obscuring the fine detail in an image. Speckle is linked to the use of spatially coherent light — without coherence, speckle disappears. But, so does the ability to perform interferometric imaging techniques like OCT, which uses...
What Makes a USB SmartHub Different? - Connected embedded systems increasingly require more than basic USB expansion to support internal (chip-to-chip) interface requirements. USB SmartHub ICs combine high-speed hub functionality, interface bridging and flexible port management in a single device, helping developers reduce system complexity...
What Is Next-Generation AI Industrial Competitiveness? - AI competition is shifting from building powerful AI models to creating value with AI. This article analyzes the U.S.–China AI race through a four-layer framework of AI industrial competitiveness and explores how organizations can leverage AI as a strategic resource to drive business value creation....
2026 world GDP growth of 3.1% says IMF - The IMF now reckons the world economy will grow 3.1% this year. In July it said 3%. Countries upgraded since the last forecast are India, the United Kingdom and Germany. […] The post 2026 world GDP growth of 3.1% says IMF appeared first on Electronics Weekly .
NXP's P3B1602DP Brings the Industry's First I3C Bus Buffer to Market - As I3C adoption accelerates across next-generation computing and embedded systems, NXP recognized a critical infrastructure gap: designers needed a purpose-built buffer that could preserve I3C performance while supporting voltage translation, larger bus capacitance, and longer PCB traces.
Ultrafast oxide-ion conductors offer route to low-temperature fuel cells - Solid-oxide fuel cells (SOFCs), which convert chemical energy directly into electrical power, are promising energy-conversion technologies because they can operate on various fuels, including hydrogen, natural gas and biogas.
10 years of TME Education – a decade of supporting technical education - Learn more about TME Education – an educational project based on practical learning and collaboration with local communities. The post 10 years of TME Education – a decade of supporting technical education appeared first on Electronics Weekly .
Did Intel’s Cost Cutting Bite Them? - Intel's Foundry arm is picking up the customers SemiAccurate told you about last year, but is this a good thing? Read more ▶ The post Did Intel’s Cost Cutting Bite Them? appeared first on Semiaccurate .
Special Report: Design Win Tracking - Image Sensor - The most recent design win tracker (DWT-July 2026) has been updated with the latest data. The Executive Summary spotlights the newest devices we have analyzed and highlights upcoming reports that dive deep into the latest sensor technologies.
China startup demoes prototype EUV light source - Chinese startup Langdao Silex showcased its laser-produced plasma EUV source at a trade show, but the technology will likely take many years before it gets to decent EUV power levels. Even if it does, China will need many more advancements to build a practical EUV lithography tool.
Microchip POL-05-20S is radiation-tolerant GaN point-of-load converter - Microchip is expanding its space power Portfolio with the POL-05-20S, a radiation-tolerant GaN point-of-load converter that delivers up to 20A of output current. Measuring 1.51” x 1.51” x 0.45” in […] The post Microchip POL-05-20S is radiation-tolerant GaN point-of-load converter appeared first...
Large Scale Wireless Network Validation - Laboratory testing can verify functionality, but real-world deployments introduce challenges such as RF interference, physical barriers and increasing node density. Learn how a sector-based validation infrastructure helps engineers assess wireless network performance at scale before moving systems into...
Korea vows crackdown on unfair trading amid Kospi volatility - Korea vows crackdown on unfair trading amid Kospi volatility The government pledged strict action against unfair trading as the Kospi sank for a seventh session amid AI-sector and rate concerns. 10/15/2026 - 11:34 PM
Enabling large language model agents for high-fidelity many-body perturbation theory calculations - …demonstrate autonomous calculations and post-processing on 1D, 2D, and bulk materials, including the many-body enhancement of Fröhlich electron-phonon coupling in polar semiconductors . Our approach provides a general framework for knowledge engineering to enable reliable agentic workflows in computational...
IBM 攜手西門子推進奈米堆疊半導體技術，邁向埃米世代與 3D 晶片新紀元 - IBM 與西門子（Siemens）宣布展開全新研究合作，致力於推進 IBM 於 2026 稍早推出的「奈米堆疊」（Nanostack）電晶體架構。此合作結合 IBM 在半導體元件創新的領導地位，以及西門子在電子設計自動化（EDA）、製程模擬、微影曝光（Lithography）優化與先進製造軟體的技術優勢，以加速奈米堆疊技術的開發與量產準備。...
Strengthening supply chains behind US semiconductors - New research maps hidden upstream dependencies in the US semiconductor supply chain and outlines potential mitigation strategies to make the ecosystem more resilient.
Data Orchestration: The Foundation for the Next-generation Semiconductor Enterprise - Data orchestration gives semiconductor engineering teams a practical way to unify disconnected equipment, systems, and data without replacing existing infrastructure. By creating a connected execution layer across engineering, OT, IT, facilities, and production environments, the solution contextualizes...
AI bull market calls for a rethink of diversification - AI bull market calls for a rethink of diversification As AI heavyweights prop up U.S. and Korean indexes, investors should diversify by earnings drivers, not simply by stock count. 10/15/2026 - 11:01 AM Opinion Desk
Kospi plunges over 7% as AI doubts, U.S. rate fears hit Seoul - Kospi plunges over 7% as AI doubts, U.S. rate fears hit Seoul Korean stocks tumbled as AI return concerns, Chinese chip supply fears and rising U.S. rates prompted heavy foreign selling. 10/14/2026 - 10:34 PM News Team
Small Volumes, Big Impact: Europe’s Hidden Role in Advanced Chipmaking - A Fraunhofer–IMS Nanofabrication partnership illustrates how Europe's low-volume semiconductor manufacturing can support the world's most advanced chipmaking. The post Small Volumes, Big Impact: Europe’s Hidden Role in Advanced Chipmaking appeared first on EE Times .
L'economia del data center che si produce l'energia da solo - Un campus AI in isola non conviene per il prezzo dell'energia. Conviene per il tempo. E quando la rete non c'\u00E8, il punto in cui si incontrano tutte le fonti non \u00E8 pi\u00F9 il contatore
ByteDance in Talks to Secure MediaTek AI Chips for Data Centers - ByteDance Ltd. is close to an agreement to buy MediaTek Inc. data center semiconductors, a deal that would secure vital components for TikTok’s owner while helping the Taiwanese chipmaker compete with Qualcomm Inc.
IBM and Siemens Collaborate on Next-Generation Nanostack Transistors - Collaboration aims to accelerate development of the manufacturing and design capabilities needed for future nanostack generations. The post IBM and Siemens Collaborate on Next-Generation Nanostack Transistors appeared first on Semiconductor Digest .
ASML’s EUV Expansion Runs Through Zeiss - ASML’s plans to expand EUV production depend partly on Zeiss’s ability to increase qualified precision-optics output. The post ASML’s EUV Expansion Runs Through Zeiss appeared first on EE Times .
Systems reduce latency in edge AI automation - AIE-KT78/68 edge AI systems from Aetina are powered by NVIDIA Jetson Thor and Blackwell architectures for deterministic industrial control. The post Systems reduce latency in edge AI automation appeared first on EDN .
Schäfter+Kirchhoff Completes Leadership Transition - Schäfter+Kirchhoff completed its leadership transition, moving to a two-person management structure. The change follows a planned one-year overlap period during which outgoing managing director Ulrich Oechsner transferred his responsibilities...
Panasonic exhibits at Enlit Europe 2026 - Panasonic’s product solutions empower customers to create and manufacture sustainable, dependable and interconnected products
Show Daily 2026 — Day Two - View or Download the SEMICON West Show Daily — Day One! The post Show Daily 2026 — Day Two appeared first on Semiconductor Digest .
ASML’s Guidance Key to Instill Confidence in Fragile Chip Trade - ASML Holding NV’s guidance for building out capacity has become a crucial new part of the Dutch company’s earnings days, and will be even more so this time as investors seek signs of reassurance in the sector’s faltering rally.
Longest Chip Selloff Since 2006 Mints Short Sellers $32 Billion - A historic rout in semiconductor stocks has delivered a windfall for short sellers who were brave enough to bet against what had been one of the highest flying corners of the US equity market for much of the last year.
Braino! Takes the Cheap Yellow Display to School - These days, it’s common to give even very young children a mobile device loaded up with educational software that aims to improve everything from basic motor skills to reading and …read more
South Korea's AI-Driven Economy Faces IMF-Warned Risks - In its October economic outlook, the IMF raised South Korea’s 2024 growth forecast by 0.7 percentage points, from 2.6% to 3.3%, citing factors such as the AI semiconductor boom.
U.S. Army Research Office Grants the University of Central Florida $19.2M: Week in Brief: 10/16/26 - GlobalFoundries (GF) has been selected to operate two semiconductor fabrication facilities at its Malta, N.Y., site under a U.S. Japan initiative providing up to $21 billion in funding. The first fab, expected to begin construction in 2026 and come online in 2029, will add approximately 900,000 300 mm...
Bolt Graphics seeks US$100 million to challenge Nvidia, AMD beyond AI with Zeus GPU - US chip startup Bolt Graphics is seeking approximately US$100 million at a valuation of about US$700 million to develop graphics processors targeting scientific computing and professional rendering, challenging Nvidia and AMD in markets beyond AI acceleration.
[News] After TSMC’s 3Q26 Earnings: Key Brokerage Takeaways as 2028 Capex Forecasts Reach US$105B - Following TSMC’s bullish earnings call, which saw the foundry giant raise its 2026 revenue growth outlook to 44% YoY and forecast another record quarter in 4Q26, foreign brokerages have weighed in with a largely upbeat verdict: all looks strong—except margins. Notably, analysts have revised t...
Chip Industry Week In Review - Fab expansion accelerates; China advances memory and EUV; Teradyne's test deal; SEMICON West and OCP highlights; 3D SiP; TSMC and ASML signals; 300mm fab spending; optical and 3D-compute startups raise fresh funding; quantum HW advances. The post Chip Industry Week In Review appeared first on Semiconductor...
ZEISS Acquires Ceres Holographics - ZEISS acquired Ceres Holographics, a holographic technology company. Ceres Holographics will become part of ZEISS Microoptics, a business unit within ZEISS with a focus on industrializing holography for high-volume automotive, aerospace, and consumer markets. Representatives of ZEISS Microoptics and Ceres...
Insight: Apple Reboots Its Smart Home Strategy with Siri AI and Smartphone-Class Silicon - This Insight provides TechInsights’ analysis and perspective on the impact of announcements made by Apple on October 13, 2026, at its Welcome Home product launch event. Apple launched its first smart home display (HomeView) and refreshed its existing Apple TV and Apple HomePod mini products. Apple also...
A $1 Trillion Chip Rout Draws Billions Into Leveraged ETF Bets - As chip stocks shed $1 trillion in market value, ETF investors are pouring billions into the selloff, putting a fund that triples their daily exposure to the sector on pace for record weekly inflows.
Not all diodes use electrons - Sometimes thinking like a geek pays off. Especially when you're dealing with overheated Judge Judy fanatics. The post Not all diodes use electrons appeared first on EDN .
Show Daily 2026 — Day Three - View or Download the SEMICON West Show Daily — Day Three! The post Show Daily 2026 — Day Three appeared first on Semiconductor Digest .
Thermal Co-Simulation Testing Of Co-Packaged Optics - Ensuring optical engines can operate reliably alongside high-power AI processors in multi-chip packages. The post Thermal Co-Simulation Testing Of Co-Packaged Optics appeared first on Semiconductor Engineering .
Memory Stocks Are Falling. Korea’s Exports Keep Climbing. - Korea shipped $37.59 billion of memory chips in September. China remains the largest destination, server demand is widening beyond HBM, and the next supply response is already running into equipment c
Insight: Autonomous driving developers build toward transferable Physical AI platforms - Among the new and updated entries found in the October 2026 edition of the TechInsights Autonomous Vehicle Start-Ups and Small Companies Database are several specialist developers positioning their technology as a broader “Physical AI” or “embodied AI” (physical Artificial Intelligence or embodied...
Chip Stocks Set to Erase $1 Trillion in Value as Rout Deepens - A closely watched gauge of semiconductor stocks is on pace to erase more than $1 trillion in market value as concerns mount over higher interest rates, stretched valuations and the enormous cost of building artificial-intelligence infrastructure.
CTO Interview with Sirish Munipalli of Moores Lab AI - Sirish Munipalli is Co-Founder and CTO of Moores Lab AI, where he leads the development of agentic AI for chip design verification, including SpecAgent(tm), the company’s specification and modeling platform. He has spent about 15 years designing and verifying complex silicon: FPGA prototyping at Intel,...
Characterization of HBM Power Consumption (ETH Zurich, NYU) - Researchers at ETH Zürich and New York University published a technical paper titled “Understanding the Power Consumption of Modern High Bandwidth Memory: Experimental Analysis and Modeling Using Real HBM2 DRAM Chips.” Abstract Excerpt: “We perform the first comprehensive experimental characterization...
Extending the Mission Envelope of High-Performance Plastic MCUs - The new SAMV71Q21RT extends the mission envelope of high-performance radiation-tolerant MCUs with 50 krad(Si) TID capability and an enhanced Plastic Class 1 quality grade equivalent to QML Class P. Built from the proven SAMV71 architecture, it gives space designers greater flexibility to balance radiation...
