Semi. Fabs and Clean Rooms 4¼h ago: The semiconductor fab sector is in hyper-expansion mode with TSMC running ~20 simultaneous fab projects, record revenues, and capacity shifting to equipment install phase. India is pushing cleanroom infrastructure with new labs and OSAT ramps, while U.S. fabs like TSMC Arizona and Intel Fab 52 advance to volume production. Yield and metrology tools are ramping to support advanced packaging and CPO demands amid electricity constraints from AI growth.
Inside Architect Labs’ Two-Week Chip Design - Architect Labs says its AI can drag custom chip design from years to weeks with Redwood. The post Inside Architect Labs’ Two-Week Chip Design appeared first on EE Times .
Fabships Aim to Exploit ‘Free’ Space Vacuum for Compound Semiconductor Substrates - Space is the next frontier for semiconductor manufacturing, as startup Besxar, founded by an ex-OpenAI technical director, completed its first SpaceX flight and recovered wafer samples without contamination. The post Fabships Aim to Exploit ‘Free’ Space Vacuum for Compound Semiconductor Substrates...
What Is Intel’s Diamond Rapids Server CPU? - At Hot Chips 2026, Intel finally detailed the architecture of their upcoming server CPU code named Diamond Rapids. Read more ▶ The post What Is Intel’s Diamond Rapids Server CPU? appeared first on Semiaccurate .
Insight: More Models but Fewer Winners, Chinese NEV Proliferation Collides with Global Consolidation - This report analyses the latest additions to the TechInsights EV/HEV Technologies Supply and Fitment Database, highlighting a widening of the strategic divide in electrified vehicle markets. Chinese automakers continue to frequently launch new brands, models, and variants as competition intensifies and...
Quantinuum, PsiQuantum, GlobalFoundries, Secure $575M in Funding: Week in Brief: 9/11/26 - Infleqtion and Cisco are collaborating to pursue joint research and development focused on connecting, operating, and scaling quantum systems. The collaboration brings together Infleqtion’s neutral-atom quantum computers and sensors with Cisco’s networking stack to accelerate scalable, distributed...
Exports up 83% in September on chips - Exports up 83% in September on chips Korea’s exports surged nearly 83 percent on year in the first 10 days of September, driven primarily by semiconductor shipments influenced by the AI boom. 9/10/2026 - 08:54 PM
Enterprise Routers Market Shares Q2 2026 - Contains both current and projected regional and global market share data for enterprise router vendors, usually covering revenue, shipments, vendor rankings, and percentage share for the quarter.
New Semiconductor Tech Slashes AI Power from the Cloud to the Edge - I get to hear a lot of things in my self-appointed role as collector, curator, and communicator of technological information. Sometimes things seem too good to be true, causing me to raise a quizzical eyebrow. For example, some companies come to me saying they’ve got a great solution for reducing AI...
Leankon expands 13.56 MHz NFC antenna portfolio - Leankon is expanding its Near Field Communication or 13.56 MHz NFC antenna portfolio with nine new products. The parts include the LK18604xx series, pictured. 13.56 MHz NFC antenna Designed to […] The post Leankon expands 13.56 MHz NFC antenna portfolio appeared first on Electronics Weekly .
Webinar – ChipAgents Shows You How to Break the Timing Closure Bottleneck with AI - We all know timing closure is one of the most challenging processes in chip design. Extracting actionable insight from massive timing reports, tracing violations back to RTL, and selecting the right fix across complex PPA tradeoffs all require deep expertise. And every change can trigger hours or days...
From Transistors to AI: The Chiplet Revolution with Ramune Nagisetty - My podcast guest this week is a powerhouse of the semiconductor industry: Ramune Nagisetty. Ramune, best known for developing the chiplet-based system-in-package architecture concept, joins me this week to discuss her foundational work on chiplet-based system-in-package architectures, the current reality...
Commentary: Apple sends off Cook with a foldable flourish, but Ternus's trial is still ahead - Apple has finally unveiled the long-anticipated foldable iPhone Duo, with former CEO Tim Cook making a brief appearance at the start of the launch video. The moment suggested the device was Cook's farewell act, rather than John Ternus' first turn as chief executive, even as Apple used the 2026 fall event...
Technical Report: onsemi AR0827 Exploratory Analysis - This report presents an Exploratory Device Essentials analysis of the onsemi AR0827AT image sensor, an 8.3 MP, 2.1 µm pixel pitch stacked back-illuminated CMOS image sensor built on onsemi's Hyperlux technology. The device integrates high dynamic range (HDR) and LED flicker mitigation (LFM) capabilities...
TSMC’s 2026 OIP Forum to Spotlight the Technologies Shaping the Next Era of Chips - It’s that time of year again. Time certainly flies when AI is chasing you! This year marks the 18th TSMC OIP Ecosystem Forum, and it promises to be bigger and better than ever. My SemiWiki partners, Mike Gianfagna and Kalar Rajendiran , will join me in covering the event live, so stay tuned for all...
Propolys Validates Key Technology Building Blocks for Tomorrow’s Micro-LED Displays - The Propolys project, conducted at CEA-Leti between 2021 and 2025, successfully validated several key technology building blocks for the development of full-color micro-LED displays. Supported by Carnot funding, the project will contribute to future augmented reality applications.
Indian Researchers Look Beyond GPUs to Neuromorphic AI Hardware - As AI workloads become more computationally demanding, Indian researchers argue that the next advance may come from rethinking computing architecture itself. The post Indian Researchers Look Beyond GPUs to Neuromorphic AI Hardware appeared first on EE Times .
Taiyo Holdings Launches Next-Generation Semiconductor Packaging Material “FPIM Series” - Taiyo Holdings Co., Ltd., based in Tokyo, presented a paper on September 10, 2026, at the 11th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2026), held in Helsinki, Finland, on the "FPIM Series", a next-generation semiconductor-packaging material. The post Taiyo Holdings Launches...
Why are Nvidia and Samsung’s P/E ratios falling? - Why are Nvidia and Samsung’s P/E ratios falling? Fast-rising earnings are pushing valuation multiples lower, but investors must judge whether those profits can endure. 9/10/2026 - 11:01 AM Opinion Desk
Debugging intermittent Comcast, part 4: Broadband diagnostics - There’s a lot you can do to boost your WAN’s speeds, as well as minimize its latency. But only if your service provider lets you. The post Debugging intermittent Comcast, part 4: Broadband diagnostics appeared first on EDN .
The Comms Company Formerly Known as Broad - AI Business the Hard Way. \ Broadcom takes over as Google lose interest in owning Anthropic infrastructure. Owning Chip IP is a better deal.
Heterogeneous Memory Chiplets Accelerate Multi-Request LLM Inference (NUS) - Researchers at the National University of Singapore published a technical paper titled “CHIPSMORE: Compute-in-Interconnect and -Memory Chiplets for Multi-Mode Multi-Request LLM Inference Acceleration.” Abstract Excerpt: “This paper presents CHIPSMORE, a multi-mode and multi-request LLM inference...
Xanadu, ASML to Advance Lithography for Photonic Quantum Hardware - Through this collaboration, Canadian photonic quantum computing company Xanadu and ASML will explore lithography-enabled process approaches for improved patterning control and lower-loss photonic structures. The post Xanadu, ASML to Advance Lithography for Photonic Quantum Hardware appeared first on Semiconductor...
Intel’s StrongARM commitment looking wobbly - 28 years ago Intel’s commitment to making Arm processors was looking wobbly. The ‘x86 everywhere’ concept could have cost the company dearly. In March 1998, EW reported: Intel’s commitment to […] The post Intel’s StrongARM commitment looking wobbly appeared first on Electronics Weekly .
You just Inherited a Simulink model you have never seen before. Now what? - Here is a three-step pattern for working with an inherited model: generate an overview, drill down into subsystems, and perform a targeted search. The post You just Inherited a Simulink model you have never seen before. Now what? appeared first on EDN .
US Space Force selects Texas as third DARC site - The U.S. Space Force has approved the location for the third and final site of the Deep Space Advanced Radar Capability (DARC), which involves a partnership of Australia, the UK […] The post US Space Force selects Texas as third DARC site appeared first on Electronics Weekly .
Chip Industry Week in Review - 12-inch high-NA EUV masks; Arm's edge AI push; Amkor's expansion; 3D memory; FeRAM startup makes waves; Qualcomm-AWS $60B custom silicon deal; Ayar Labs' scale-up deal; new iPhone chip and format; rogue OpenAI agents in Germany; fab factory; fine-pitch RDL tech for advanced packaging. The post Chip Industry...
PDF Solutions CONNECT 2026: Where Semiconductor Data Meets AI - The semiconductor industry is entering a period in which manufacturing leadership will depend not simply on producing more data, but on turning that data into timely, trustworthy decisions. PDF Solutions CONNECT 2026 is designed around this challenge. Taking place October 15–16 at the Westin St. Francis...
CEO Talk: Kazushige Koshika, President of TOPPAN Technical Design Center Inc. - This interview features Mr. Kazushige Koshika, President of TOPPAN Technical Design Center Inc. Tell me a bit about your background? How did you first get started with TOPPAN Technical Design Center Inc.? I had been involved in semiconductor design businesses for many years. Through my previous experience,...
Ig Nobel Prize celebrates 3D printing with a mosquito proboscis - I'm not a big fan of the Nobel prize system myself, which is why I pay attention to news of the Ig Nobel awards. Check out this year's and the techniques for 3D printing with a mosquito proboscis! The post Ig Nobel Prize celebrates 3D printing with a mosquito proboscis appeared first on Electronics Weekly...
Celero Communications Raises $275M - Celero Communications, a developer of advanced coherent digital signal processing (DSP) technology for AI infrastructure, has raised $275 million in Series C funding. The financing will accelerate Celero’s product roadmap, R&D investments, and...
ADI Snaps Alif Semiconductor to Push AI into Physical Systems - The $1.35 billion deal marks another edge AI leap of faith, combining analog sensing with low-power AI processors. The post ADI Snaps Alif Semiconductor to Push AI into Physical Systems appeared first on EE Times .
