Semi. Fabs and Clean Rooms 3h ago: The semiconductor industry is in a heavy buildout phase focused on HBM/AI capacity. Major memory producers are redirecting cleanroom space toward HBM, with Micron’s $100B megafab and other expansions targeting 2027-2028. TSMC achieved 98% yield on CoWoS advanced packaging. Multi-year timelines mean supply bottlenecks will persist into 2027-2028 despite massive capex.
Global Smartphone Top 100+ Microvendors Market Share – Q2 2026 - The global smartphone market contracted again in Q2 2026, as steep declines at major Chinese vendors outweighed gains at Samsung, Apple, and Huawei. Microvendors tracked by TechInsights shipped 5.2 million units, 1.9% of the global market, down from 2.4% a year earlier. Even so, several brands defied...
A 0.42-Nanometer Breakthrough From TSMC Could Push Transistors Beyond Silicon - Researchers at National Yang Ming Chiao Tung University and TSMC Corporate Research engineered a 0.42-nanometer aluminum-oxide interface that protects electron transport in monolayer MoS₂ transistors while enabling strong gate control.
Acer COO Jerry Kao resigns; Chairman Jason Chen to fill role - Acer announced a major management change on August 14, saying chief operating officer Jerry Kao has resigned with immediate effect. Chairman and CEO Jason Chen will take on the duties on an interim basis.
Most Read – PCB shortage, Elon’s Cash Cow, Driverless cars - The most popular stories on the site cover the Israeli deep-tech EDA company Hiveware, the value of the Starlink satellite internet service, and Waymo, the Alphabet driverless car unit. The post Most Read – PCB shortage, Elon’s Cash Cow, Driverless cars appeared first on Electronics Weekly .
Narrative - China Smartphone Vendor and OS Marketshare - Q2 2026 - China's smartphone shipments declined year-over-year (YoY) by 3.0% in Q2 2026 amid memory chip shortage and macroeconomic headwinds, including stagnant income, job, and real estate markets. Continued subsidies benefited smartphone sales, but no longer favor the annual comparison. Memory cost surges subdued...
Giant exciton effects and magneto-excitonic coupling in V4S9X4 2D magnetic semiconductors - Room-temperature spin-optoelectronic devices require a combination of robust ferromagnetism and giant exciton binding, a pairing mutually exclusive in conventional semiconductors due to magnetic localization that screens excitons. Cluster-assembled V4S9X4 (X = F, Cl, Br and I) monolayers overcome this...
Former BOK chief warns chip boom cannot simply reverse Korea’s low-growth trend - Former BOK chief warns chip boom cannot simply reverse Korea’s low-growth trend In his first interview since leaving the central bank, Rhee Chang-yong discussed the state of the Korean economy, from the birthrate to an AI-driven economy, with the JoongAng Ilbo. 8/13/2026 - 06:00 PM News Team
the ai unleashed 2026 agenda - AI has moved beyond the demo phase. Enterprises are deploying models, operationalizing agents, rethinking infrastructure, and making consequential decisions about where—and how—to invest.From August 25–27, The Six Five Summit: AI Unleashed 2026 will bring the leaders making those decisions directly...
Bridging Older Tasmota Hardware Into Apple Home - The Tasmota firmware is a popular choice for flashing to a range of Espressif microcontrollers to turn them into smart home devices. If you have such devices in your house, …read more
SEM Analysis for Semiconductor Failure Analysis - Scanning Electron Microscopy (SEM) is one of the most important imaging techniques used in semiconductor failure analysis. While optical microscopes remain extremely useful for initial inspection, many semiconductor defects are simply too small to characterize adequately with visible-light microscopy....
Radon: Level detection, risk determination, and as-needed mitigation - Radon, in both air and ground water, is a health risk whose prevalence should be regularly assessed and, if necessary, dealt with. The post Radon: Level detection, risk determination, and as-needed mitigation appeared first on EDN .
The thermal side of power reliability - As key technologies such as AI continue to grow in importance, datacentres are expected to work harder, faster and to be able to provide more computational power, writes Mark Masera. […] The post The thermal side of power reliability appeared first on Electronics Weekly .
Kospi surges for fourth straight day on chip rally as won weakens - Kospi surges for fourth straight day on chip rally as won weakens Shares climbed 3.56 percent to continue winning streak as foreign and institutional investors scooped up chipmakers. 8/13/2026 - 04:53 AM
DACRI: Decision-Aware Causal Intervention Ranking for Critical Supply Chains - …Relative to a full-information train-selected static benchmark, LambdaMART improves median normalized net value by 5.7--16.2\%, with paired statistical support on the semiconductor and critical-material archetypes but not on digital infrastructure. On digital infrastructure, a domain-informed constant-buffer...
Self-Supervised Layout Generation To Fix Advanced-Node DRVs (Nvidia, Duke) - Researchers from NVIDIA and Duke University published a technical paper titled “SCALE: Self-Supervised Constraint-Aware Layout GEneration for Local P&R DRV Fixing at Advanced Nodes.” Abstract “As semiconductor manufacturing advances toward sub-2nm nodes, local place-and-route (P&R) design-rule violation...
Boost Front-End SoC Design With Defacto’s AI-Powered Tool - Front-end SoC design has always been a balancing act between speed, accuracy, and the large amount of manual work required to get RTL, IPs, and collaterals to be aligned. In a recent webinar, Defacto CEO and founder Chouki Aktouf joined by product manager Valentin Boyer, walked through how the company...
The Chip Insider®– Why Test is Outpacing WFE - Inside G. Dan Hutcheson’s latest analysis, the AI-driven shift from consumer electronics to advanced computing reveals why semiconductor test is outpacing WFE and reshaping industry economics.
Sony-TSMC $4.7B Deal Helps Thwart Samsung, Analysts Say - Sony and TSMC have joined forces to counter Samsung's growing presence in smartphone image sensors, particularly for Apple. The post Sony-TSMC $4.7B Deal Helps Thwart Samsung, Analysts Say appeared first on EE Times .
ASMPT Names New CEO - Bassel Haddad has been named group CEO and executive director of ASMPT, a supplier of equipment for the packaging industry
Narrative: Global Smartphone Vendor and OS Market Share by Region – Q2 2026 - Global smartphone shipments fell 7.4% year-on-year in Q2 2026, more than three times the rate of decline recorded in Q1. The Q1 story was an entry-level squeeze. Q2 is broader: OPPO, a mid-tier vendor, swung to a double-digit YoY decline, and Honor’s Q1 claim that geographic diversification had insulated...
Insight: GM's Own-Less, Contract-More Reset: A Battery JV Exit and a $4.5B Parts Backstop - In one week, GM exited its Samsung SDI battery joint venture, extended its SAIC partnership to 2047, and set up a $4.5 billion facility to pre-position critical parts. The pattern is deliberate: GM is trading owned supply assets for contracted access, shifting capacity risk onto its cell partners while...
Google joins OpenROAD EDA initiative - Google is joining the OpenROAD Initiative (ORI) as a principal member, for its open source electronic design automation (EDA). As is customary, Google’s Technical Program Manager, Aaron Cunningham, is joining […] The post Google joins OpenROAD EDA initiative appeared first on Electronics Weekly ....
Intel at a Memory Crossroads, Again - The CPU specialist heeds a memory comeback while memory chips transform from commodity to AI gold rush. The post Intel at a Memory Crossroads, Again appeared first on EE Times .
SK Hynix looks beyond memory with new global growth team - SK Hynix has set up a dedicated team to search for growth opportunities beyond its core memory business and has put a senior group executive in charge, a move aimed at turning the company's lead in high-bandwidth memory (HBM) into a wider role in AI infrastructure.
Gate Control of g-factor in Germanium Quantum Dots: A Strain-Based Explanation - The g-factor is a key parameter governing the behavior of semiconductor spin qubits, as it directly determines the qubit frequency and its sensitivity to electrical and magnetic noise. Recent experiments in germanium quantum dots have revealed large g-factor variations under small gate voltage changes,...
Yellow Envelope Act Chaos Foretold - But after implementation, confusion grew on the ground, as seen in the Samsung Electronics Labor Union’s recent demand to include the Honam Semiconductor Mega Project as a “negotiation subject.”
A “Double Punch” Nanoparticle Could Reveal and Destroy Brain Cancer Cells - Light-activated nanoparticles could help surgeons see glioblastoma more clearly and destroy cancer cells that remain after surgery. Glioblastoma can spread microscopic cancer cells into healthy brain tissue, making the most aggressive form of brain cancer exceptionally difficult to remove completely....
Made by Google 2026: This limited silicon-supply situation really sucks - AI-driven demand underpins capacity constraints, leading to cost increases. Add tariffs to the mix, and Google and end users pay the price. The post Made by Google 2026: This limited silicon-supply situation really sucks appeared first on EDN .
The 1-Megawatt Rack Debate - Is it better to cram more compute into each rack or rethink the architecture? The post The 1-Megawatt Rack Debate appeared first on Semiconductor Engineering .
Apple and AI : Siri the Early Years - One of the reasons for studying technology history is to look for recurring patterns: characteristics of either the technology itself or of firms that are built around it that are repeated time and time again.
Build infrastructure first for Honam chip fabs (KOR) - Build infrastructure first for Honam chip fabs (KOR) The government’s 2029 fab target hinges on building power, water and transport networks before construction begins. 8/12/2026 - 09:32 PM Opinion Desk
MIT selected to lead new NSF materials research center - The Materials Research Science and Engineering Center unites researchers across disciplines to develop technologies for medical imaging, sustainable metals production, and next-generation electronics.
Liquid-cooled SSDs in the Age of AI - Learn how Solidigm is overcoming power and thermal bottlenecks in AI architecture with improved cold plate technology for liquid cooled SSDs.
FSI Advances Workforce Development at 2026 SACA Conference - The Florida Semiconductor Institute’s (FSI) deputy director for workforce development, professor Jack Judy, presented at the 2026 SACA Conference, highlighting progress on new industry-driven semiconductor certifications. The credentials aim to strengthen education and workforce pathways by aligning...
BBCube: A Novel Chip-on-Wafer Technology for Next-Generation AI Chip Integration - Three core technologies involving advanced packaging, chip interconnects, and thermal design enable high-performance semiconductor systems. The post BBCube: A Novel Chip-on-Wafer Technology for Next-Generation AI Chip Integration appeared first on Semiconductor Digest .
Look at direction, not speed, of chip earnings forecasts - Look at direction, not speed, of chip earnings forecasts Steady Big Tech investment and more predictable earnings may help Samsung Electronics and SK hynix overcome deep valuation discounts. 8/12/2026 - 11:01 AM Opinion Desk
Semiconductor Construction: Practical Strategies for More Sustainable Fabs - Skanska's Steve Clem and Myrrh Caplan lay out why decarbonizing fab construction is harder than swapping materials. The post Semiconductor Construction: Practical Strategies for More Sustainable Fabs appeared first on Semiconductor Digest .
Technical Report: RingConn Gen 3 Optical Photoplethysmography Sensors - This report presents an exploratory Device Essentials analysis of the Ringconn Gen 3. The report provides a quick look at the structure and select features of optical photoplethysmography (PPG) sensors, including the photodetector (photodiode) and multi-wavelength light-emitting diodes (LED). It is accompanied...
Where Korea’s economy will be won in the AI era (KOR) - Where Korea’s economy will be won in the AI era (KOR) Korea’s AI strategy overweights chips and data centers, and says productivity, talent and manufacturing-based AI will decide the country’s future. 8/11/2026 - 08:59 PM Opinion Desk
Secrets of oscilloscope time measurements - Oscilloscopes utilize both hardware and software to enhance time measurement resolution. Happily, most of the processing is transparent. The post Secrets of oscilloscope time measurements appeared first on EDN .
Chip Industry Week In Review - Lam Research and ASE expansions; data center shifts; CPO system architecture initiative; 2D-transistor interface solution; USENIX HW security; patent suits; image sensors; programmable AI memtransistor; Nvidia's new plan; earnings. The post Chip Industry Week In Review appeared first on Semiconductor...
[News] YMTC Reportedly Invests in SOI Micro, Backing an Alternative Chipmaking Approach Without EUV - China is actively exploring alternative approaches to chipmaking, with another domestic company gaining attention following new investment from the country’s leading NAND flash maker. According to South China Morning Post, Guangzhou-based SOI Micro is developing a low-power logic process aimed at ......
Humanoid hype may be outrunning reality, IDC analyst warns - As Tesla, OpenAI, Nvidia and dozens of startups push bipedal robots forward, IDC's Phil Solis says the industry needs more focus on affordability, reliability and real-world deployments.
Using Claude AI for Chip Design - After speaking with dozens of semiconductor professionals at the Design Automation Conference in Long Beach about AI in the chip-design workflow, Claude emerged as the common denominator in every conversation. We’re still at the tip of the iceberg when it comes to using AI in the design flow. If management...
Verific Is Even More Terrific Than You Thought - If you cast your mind back to the 1980s and 1990s, the electronic design automation (EDA) landscape was a very different place to the one we find ourselves in today. There were lots and lots of small EDA companies, each beavering away on some clever new tool or technology. It was an exciting time to be...
Water strategy becomes urgent as extreme droughts become routine - Water strategy becomes urgent as extreme droughts become routine As extreme droughts become more frequent, Korea must build resilient water infrastructure and maintain long-term policies beyond political shifts. 8/13/2026 - 11:01 AM Opinion Desk
Hong Kong Electronics Fairs Launch in October! - Cutting-Edge Technologies on Display This October, Shaping the Future of Industries The post Hong Kong Electronics Fairs Launch in October! appeared first on EE Times .
IC Decapsulation: Methods, Process and Applications - Many semiconductor failure-analysis techniques require direct access to structures that are hidden inside an IC package. The semiconductor die, bond pads, bond wires and other critical components may be completely covered by epoxy molding compound or other packaging materials. Before these structures...
Detecting mines using RGB imagery - Researchers at Binghampton University in New York have evaluated the use of a deep learning-based strategy for PFM-1 mine detection using RGB imagery and the YOLOv11 algorithm. RGB image-based YOLOv11 […] The post Detecting mines using RGB imagery appeared first on Electronics Weekly .
Technical Report: HiSilicon T30322 5G RedCap RF Transceiver Floorplan Analysis - The HiSilicon T30322 is Huawei/HiSilicon's 5G RedCap modem platform, developed for 3GPP Release 17 Reduced Capability (RedCap) applications. It targets the growing mid-tier IoT market that sits between LTE Cat-4/Cat-6 and full-featured 5G smartphones, including industrial IoT, wearables, surveillance,...
Comparing Intel EMIB and Intel Foveros - Intel EMIB and Intel Foveros are advanced semiconductor-packaging technologies designed to combine multiple silicon dies, or chiplets, within one processor package. Both support heterogeneous integration: manufacturers can build different functions using the process technology best suited to each one,...
Ukraine Is All About Drones - Following the suspension of U.S. military aid under the Trump administration, European countries have increased their support for Ukraine, significantly ramping up the volume of their assistance in 2025 and […] The post Ukraine Is All About Drones appeared first on Electronics Weekly .
An energy storage device designed to be recycled - Smartwatches, phones and even some drones rely on lightweight, rechargeable energy storage systems. Once those devices wear out, many end up as electronic waste. Now, researchers reporting in ACS Energy Letters have developed ...
Cheap and cheerful LMC555 RC PWM pulse generator - This circuit enables you to generate remote control PWM test signals with a (very) generic (and cheap) chip. The post Cheap and cheerful LMC555 RC PWM pulse generator appeared first on EDN .
Light Polarization Sensitive Transistor Action in the van der Waals ferroelectric 4H-SnS2 - Van der Waals (vdW) ferroelectric semiconductors provide a unique platform for exploring the interplay between spontaneous polarization, electronic transport, ion migration, and photocarrier generation at the nanoscale. Here, we establish a room-temperature ferroelectric state in SnS2 and its sensitivity...
