Big Tech Competes in Agentic AI CPU Race - Semiconductor design firm Arm also unveiled its first data center CPU, the "AGI CPU," targeting AI inference and agentic AI workloads. Meta participated as a co-development partner with Arm.
LineShine Debuts at No. 1 as the TOP500 Enters a New Global Exascale Era - The 67th edition of the TOP500 list of the world’s most powerful supercomputers was announced today at the ISC 2026 conference in Hamburg, Germany. LineShine, a previously unlisted system installed in China, debuts at No. 1, displacing El Capitan as the world’s most powerful supercomputer as measured...
[News] MediaTek Seen Raising Prices 10–20%, Reportedly Wins TPU v9 Orders on SerDes Shift - Amid tightening supply conditions that have already prompted price hikes from memory makers and major CPU vendors, leading smartphone chip designer MediaTek is also moving in the same direction. According to TechNews, citing a customer notice, the company has acknowledged that it can no longer fully......
Atom Probe Framework Tracks Phase Instability In Si-Doped Gallium Oxide (SUNY, Ohio State, LLNL) - Researchers from University at Buffalo-SUNY, The Ohio State University, and Lawrence Livermore National Laboratory published a technical paper titled “Coordination-Sensitive Nanoscale Analysis of Defect-Driven Phase Transformation in Si-Doped (AlxGa1−x)2O3.” Abstract excerpt: “Defect-driven phase...
TSMC glass substrate rollout unlikely before 2030 - The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving faster in headlines than in production lines. DIGITIMES has been tracking the latest developments in TSMC's CoPoS advanced packaging technology, with glass core substrates...
Will Your Chip’s Memory Work As Expected? - How to ensure that memory is fully tested and repaired. The post Will Your Chip’s Memory Work As Expected? appeared first on Semiconductor Engineering .
Sponsored Content: Siemens’ User2User – How AI forms the future of Europe’s EDA industry - The EDA industry faces major challenges: design complexity is constantly increasing, while products are expected to reach the market faster. At the same time, engineering departments are grappling with a talent gap, as fewer engineers are available. But challenges also bring opportunities. The EU Chips...
Geolocation equipment needs to evolve to fit market requirements - Trackers are expected to provide geolocation information, both indoors and outdoors, while using many technologies without huge cost, writes Suman Thapa. Each year millions of trackers are deployed across industrial and consumer markets for an ever-growing number of use cases. However, a state-of-the-art...
Research Bits: June 23 - Redesigning high-NA EUV; embedded liquid cooling; light wavelength analysis. The post Research Bits: June 23 appeared first on Semiconductor Engineering .
[News] SK hynix Reported Design Hiring Surge Tightens Chip Talent Market, Raises Samsung Concerns - As next-gen memory tech like HBM, SOCAMM, and 3D NAND increasingly need stronger chip design and advanced packaging capabilities, SK hynix, according to The Elec, has launched an unusually large-scale recruitment of design engineers. According to the report, the memory giant plans to hire a tripl...
AION Silicon: Architecting Smarter SoCs with RISC-V: Balancing Performance, Flexibility, and Risk - As semiconductor complexity accelerates across AI, automotive, and edge computing markets, SoC architecture has become a critical determinant of commercial success. Modern silicon programs must simultaneously achieve aggressive performance-per-watt targets, support evolving workloads, and maintain manageable...
CEO Interview with Mark Goranson of EMASS - Mark Goranson is the Chief Executive Officer EMASS, a wholly owned subsidiary of Nanoveu, for which they serve as the semiconductor technology division. With more than 45 years in the global semiconductor industry, he has held senior leadership roles at companies including Intel, Freescale Semiconductor,...
Relationship between architecture and validation in system design - In the architecture-validation loop, here is how system design influences risk in tightly coupled hardware systems. The post Relationship between architecture and validation in system design appeared first on EDN .
The Chip Insider®– The HBM race - Inside G. Dan Hutcheson’s latest briefing, AI becomes the next growth driver, as layered demand builds on prior platforms while HBM, market dynamics, and workforce limits shape the semiconductor outlook.
How Samtec Blazes a Trail to 224/448 Gbps at DesignCon 26 - I recently covered what Samtec was doing at DesignCon 26 . Samtec has a tendency to dominate any show it attends in multiple dimensions. The prior post focused on the company’s contributions to the technical agenda and the high-profile experts in attendance. While all that is interesting and valuable,...
From Battery Management to Motors - IDTechEx Covers EV Tech - The electric vehicle market has been steadily growing in recent years as part of global efforts to reduce harmful emissions and increase the overall sustainability of road transport. Demand for individual vehicle parts including battery cells and motors has therefore ramped up as a result.
美光與 Anthropic 宣布策略合作協議，共同擴展次世代 AI 基礎架構 - 合作範疇涵蓋記憶體與儲存 AI 系統架構設計、供應協議、企業級 AI 導入及策略性投資 愛達荷州博伊西， 2026 6 23 — 美光科技（ Nasdaq: MU ）今 宣布與 Anthropic 達成策略合作協議，合作範疇涵蓋記憶體與儲存 AI 系統架構設計、供應安排、美光內部導入...
YMTC Holdings exits XMC as state-backed Optics Valley investor takes control - China's memory industry is undergoing another round of ownership restructuring. According to a recent merger review case disclosed by China's State Administration for Market Regulation (SAMR), YMTC Holdings, the parent company of Yangtze Memory Technologies (YMTC), will sell its 39% stake in Wuhan Xinxin...
EP 180: HPE Reflections on AI Compute Racks, Analog Analog Analog Semis. - Key Topics: AI infrastructure evolutionServer and rack engineering innovationsAnalog components and power managementSemiconductor industry growth and GPU impactEnterprise and hyperscaler strategies for differentiationCooling technologies and hybrid solutionsNetworking and infrastructure for AI workloadsMulti-cloud...
AmbaSat, NZIIC secure €250K funding for satellite hydrogen monitoring - The European Space Agency (ESA) has awarded AmbaSat and Teesside University a €250,000 contract for a 12-month feasibility study into a satellite-enabled hydrogen monitoring service, for industrial applications. Specifically, the award was to the Northampton company and Teesside University’s Net Zero...
Micron and Anthropic Announce Strategic Agreement to Scale Next-Generation AI Infrastructure - Collaboration spans memory and storage AI architecture design, supply agreement, enterprise AI adoption and a strategic investment BOISE, Idaho, June 22, 2026 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU) today announced a strategic agreement with Anthropic that spans memory and storage
Cook Says Apple Plans Price Hikes - Outgoing Apple chief executive Tim Cook says price increases 'unavoidable' due to 'unsustainable' surge in memory costs
Hongkang ramps silicon photonics testing investment with first system due in August - Semiconductor testing and analysis service provider Hongkang held its annual shareholders' meeting on June 18. Chairperson Hsieh Yung-fen said the company has begun investing in a silicon photonics wafer-and-chip optoelectronic analysis platform in anticipation of growing demand for silicon photonics....
