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☀️ EMEA 🇨🇭🇫🇷🇮🇱 🌑
🇩🇪 --- 🌑

27m: MIPI Alliance Elects Sony Semiconductor Solutions as Promoter Member

29m: Sterling and Wilson and Shinsung E\u0026G partner on cleanroom systems for next-gen semiconductor and battery facilities

54m: Washing Chamber Baffle Inserts Market Growth Outlook to 2035: Semiconductor and Automation Demand Accelerate - News and Statistics

69m: New technique cools high-performance chips from the inside out

71m: A semiconductor factory in the US is built on a foundation that uses more concrete than the Burj Khalifa. Why? Even the slightest vibration can disrupt production and damage millions of chips, each worth hundreds, sometimes thousands, of dollars. It takes abo

72m: Nvidia Leads A.I. Chip Rally as Semiconductor Sector Surges

97m: Bio Slump, Semiconductor Surge Reshape KOSDAQ Leadership

2¼h: Taiwan Semiconductor VP Makes $75K Stock Purchase

2½h: What Makes Taiwan Semiconductor Manufacturing (TSM) a Strong Bet?

2¾h: Taiwan Semiconductor Manufacturing Co.’s (TSM) 25% Capex Budget Hike Surged Market Confidence

3h: CSA Catapult appoints head of quantum

3½h: Video | Semiconductors in Europe: growth, gaps and the road to 2030

3½h: Is Lattice Semiconductor (LSCC) Outperforming Other Computer and Technology Stocks This Year?

4h: SEALSQ Corp Secures European Patent for Innovative \

4¼h: MIPI Alliance Welcomes Sony Semiconductor Solutions as a Promoter Member

4¼h: Taiwan Semiconductor Manufacturing Company Ltd. (TSM) Is a Trending Stock: Facts to Know Before Betting on It

4¼h: TSMC and Amkor Technology Announce Long Term Partnership to Accelerate Advanced Packaging in the United States

5h: SEMICON Taiwan 2026 to Serve as Global Stage Where the Semiconductor Industry Defines What’s Next

5¼h: Oregon chip stocks are roaring back. Will the jobs ever return?

5¼h: The Department of Commerce’s CHIPS Program Announces a Letter of Intent with Coherent for up to $50 Million to Expand Indium Phosphide Production

5¾h: Europe’s Chips Act 2.0: Europe’s attempt to move up the value chain while deepening alignment with trusted partners

5¾h: Rapidus expands semiconductor ties with Italian foundation

6¾h: Valens Semiconductor's HDBaseT Chipsets Power Barco's ClickShare USB-C Extension Over CAT Kit

7¼h: SOXQ (NASDAQ: SOXQ) Edges Out SMH And SOXX As The Top Semiconductor ETF Pick For Investors

8h: The Nexus for Silicon Intelligence – Connecting Semiconductor Innovation in the AI Era

 SanDisk Optimus GX Pro 8100 8TB SSD Review — the undisputed king of high-capacity PCIe 5.0 SSDs  - The SanDisk Optimus GX Pro 8100 is a top-tier drive with excellent performance, exceptional random read latency, and good power efficiency. As you'd imagine, it just has a pricing issue.

 48,000+ Engineers and leaders read the eeNews Europe newsletter — join them  - In the electronics industry, innovation moves quickly and market dynamics change daily. Staying informed is essential. That’s why more than…

 A tower-like heterogeneous packaging architecture for the AI era  - For years, advanced packaging has been described mostly in planar terms: chiplets placed side by side, connected through interposers, bridges, redistribution layers, substrates, and short-reach electrical links. This view remains important. It supports today’s GPU, HBM, chiplet, and 2.5D integration...

 PREVAIL: A Unique European Testing Platform for Edge AI  - The European PREVAIL consortium has recently reached a major milestone with the commissioning of a state-of-the-art infrastructure designed to accelerate the development and prototyping of the next generation of Edge AI chips in Europe. Coordinated by CEA-Leti, the project brings together Europe’s four...

 Chip Industry Technical Paper Roundup: June 16  - Multi-GPU traffic modeling; physical neural computing; RISC-V fault injection; automotive CAN timing analysis; EUV source optimization; lithography defect detection; dual-beam EUV efficiency. The post Chip Industry Technical Paper Roundup: June 16 appeared first on Semiconductor Engineering .

 [News] Samsung Reportedly Plans MPW Expansion to 2nm in 2027, Unveils 18-Run Program Across Nodes  - As Samsung accelerates efforts to secure 2nm customers, it is taking the next step in its MPW strategy. Citing Samsung Foundry Executive Director Song Tae-jung, ZDNet reports that the company’s MPW services are expected to extend to the 2nm node in 2027. iNews24 notes this is the first time Sam...

 Chips&Media’s Next-Generation Video CODEC IP Powers Ambarella’s Expanding Edge AI Portfolio  - Chips&Media has announced a strategic licensing agreement with Ambarella for its latest-generation video CODEC intellectual property (IP), marking a significant milestone in the evolution of edge AI, computer vision, and physical AI systems. The agreement follows an extensive technical evaluation process...

 AMD takes over MEXT to 'address growing memory constraints' in the data center — memory tiering technology enables flash to appear as DRAM to applications  - AMD acquires MEXT to get Predictive Memory Engine that offloads infrequently accessed data from DRAM to NAND storage.

 Don't Just Buy What is There  - The Nvidia journey from a Device Company to a Supply Chain Giant

 Neural telemetry: New chip delivers 10x compression while preserving signal integrity  - Neuromorphic compression breakthrough lays the foundation for scalable brain-computer interfaces (BCIs). The post Neural telemetry: New chip delivers 10x compression while preserving signal integrity appeared first on EDN .

 The ‘rice of electronics’: how AI-driven demand for MLCCs triggered a supply bottleneck  - Power-hungry data centres fuel demand for MLCCs, which are crucial components for modern innovations including smartphones and electric cars

 Optical interconnect market explodes to $39B by 2030  - The market for co-packaged optics (CPO) and near-packaged optics (NPO) is expected to grow from around 100 million dollars in 2025 to more than 39 billion dollars by 2030, according to Trendforce.

 EU and Brazil strengthen digital partnership  - The European Union and Brazil have taken a significant step in their digital relationship, signing a new Digital…

 Surface resistance and resistivity testers for ESD applications  - These precision measurements define whether a material behaves as conductive, dissipative, or insulative to ensure effective ESD control. The post Surface resistance and resistivity testers for ESD applications appeared first on EDN .

 [News] SK hynix Reportedly Pulls Forward HBM4E Sample Timeline, Eyeing June–July Shipments to Key Customers  - Samsung announced the start of HBM4E sampling in late May and later unveiled an HBM5 mock-up for the first time at COMPUTEX 2026. Against this backdrop, rival SK hynix is also stepping up its next-generation HBM push, with South Korean media outlet Newsis reporting that the memory giant has secured ......

 Chunghwa Leading Photonics targets SWIR testing demand in advanced packaging  - Chunghwa Leading Photonics Tech, a subsidiary of Chunghwa Telecom, is set to list on the Taipei Emerging Stock Board. The company has recorded record-high revenue and gross margin in the first four months of 2026, boosted by rising demand in Industry 5.0 applications, advanced semiconductor process inspection,...

☀️ Americas 
🇺🇸 --- 🌘

 Using an oscilloscope’s time, frequency, and statistical measurement domains  - Multiple domains provide designers and test engineers with complementary views of acquired signals. The post Using an oscilloscope’s time, frequency, and statistical measurement domains appeared first on EDN .

 'The retail SSD market has almost disappeared,' says Silicon Motion exec — PC OEMs are buying third-party drives as direct NAND supply dries up  - Vice president of client storage solutions at Silicon Motion warns that the retail SSD market has almost disappeared as NAND makers prioritize shipments of memory to AI data centers.

 Chinese fab SMIC's 7nm metal pitch beats Intel 18A but lags 38% on density, teardown finds — Huawei's sanctions-beating HiSilicon Kirin 9030 is the first subject of SemiAnalysis's new teardown lab

 TSMC says panel packaging won't replace CoWoS anytime soon for the largest future AI processors — wafer-level tech can scale to 58 massive dies in one package

 AMD’s massive SP7 socket for EPYC Venice and Intel’s gargantuan 9,324-pin socket for Diamond Rapids appear at Computex — SP7 and LGA9324-1 sockets will power the next generation of AI servers

 Intel's one-two punch plan in desktop CPUs is taking shape — Z990 spotted, Nova Lake detailed, ‘Raptor Lake Next’ teased

 Save 40% on this ultra-fast Samsung microSD card with 256GB storage, now just $47.99 — $32 saving on P9 Express model with read speeds of up to 800 MB/s, perfect for a gaming laptop or a Nintendo Switch 2

 AGI AI858 2TB SSD Review — High-end PCIe 5 speeds on a budget

 SMI's PCIe 6.0 SSD controller for consumer SSDs coming next year, but severe NAND shortages will get even worse in 2027 as AI data centers swallow supply — An interview with Silicon Motion's SVP Nelson Duann

 MSI MPG Coreliquid P22 360 Review: Low noise, strong performance, budget price

 Noctua finally releases its first AIO coolers — prices start at $220 for 240mm, features the company’s legendary A-series fans

 Intel's long-lost data center prototype 'Arctic Sound' Xe-HP multi-tile GPU surfaces in new engineering sample — Company's cancelled AI processor features 32GB of HBM2E

 Amazon UK has slashed 43% off this excellent 4K 32-inch OLED gaming monitor — lowest-ever price on this ASUS ROG Strix OLED now just £599

 Intel & SAP put HANA Cloud Platform at the center of a newly formed Co-Development  - By tightly aligning SAP software development with Intel’s hardware & software roadmap, new capabilities can be integrated earlier, bringing customer benefits to market faster than ever before.

 Element Six and Orbray accelerate wafer-scale single-crystal diamond for volume production  - Reproducible process for 3-inch WSC diamond established; 4-inch being developed; epi-optimized 2-inch nearing finalization

 Rapidus、伊Chips-IT財団と将来の半導体製造のための基本合意締結  - ~ 本政府とイタリアが進める技術協力の枠組みの一環として推進~

 Contract Prices Surged More Than 100% in 1H26; Structural Shortages to Keep NOR Flash and SLC NAND Prices Rising in 2H26, Says TrendForce  - Major memory suppliers continue to prioritize capacity allocation toward higher-value products such as HBM and advanced-layer 3D NAND, according to TrendForce’s latest research on the memory industry. This has squeezed the mature-node capacity for NOR Flash and SLC NAND.

 SEMICON Taiwan 2026 targets AI-driven semiconductor growth  - SEMICON Taiwan 2026 is set to return to Taipei in September with record-scale ambitions, reflecting the…

 AMD to acquire MEXT to expand AI memory optimization tools  - AMD said it will acquire MEXT, a move aimed at strengthening its AI and data center portfolio amid rising global memory demand. The deal is intended to help customers improve performance, reduce infrastructure costs, and accelerate the deployment of AI, analytics, and high-performance workloads across...

 Apple's Siri AI push drives 12GB DRAM demand for Samsung and SK Hynix

 TSMC reportedly teams with Ibiden, Innolux to push CoPoS, glass substrates

 Walrus Pump sees stronger liquid cooling demand, eyes higher 2026 growth

 Huawei's PanguLM comeback hinges on Richard Yu after credibility hit

 ByteDance in talks for Iluvatar, Baidu Kunlunxin AI chips as Doubao demand grows

 Samsung reportedly deepens foundry ties with Elon Musk's companies as turnaround timeline pushes toward 2028

 South Korea launches ultra-innovation economy push with major investment in next-generation power semiconductors

 Kioxia surpasses Toyota, eyes M&A push in face of AI boom

 Nvidia reportedly tightens grip on AI inference market despite growing competition

 Commentary: AI memory boom turns WF6 squeeze into an opening for CXMT

 AT&S to invest up to EUR2 billion in Malaysia to expand AI substrate capacity

 Salesforce agrees to buy Fin in US$3.6 billion AI customer service deal

 Supply security over cost: Google leads CSP charge to diversify InP substrate sourcing

 TSMC PLP timeline faces skepticism from Taiwan industry sources

 Adani-Jabil partnership highlights India's push for domestic AI infrastructure

 AI chip race sends WF6 prices soaring after Japan supply shock

 Tata iPhone components plant faces pollution probe as India supply chain risks rise

 Foxconn and Schneider Electric strike strategic partnership to build next-generation data center reference architecture

 Yaskawa eyes physical AI boom with JPY25 billion capex

 Apple leans on Google Cloud and Nvidia GPUs in a pragmatic AI reset

 Rapidus signs UK chip pact in push for 2nm customers

 Interview: From language to motion— Japanese startup APTO builds the data backbone for physical AI

 SK Hynix reportedly readies HBM4E samples for Nvidia as Samsung pulls ahead

 Physical Neural Networks: A Survey (U. of Lübeck, TU Hamburg)  - Researchers from the University of Lübeck and TU Hamburg published a technical paper titled “Beyond Silicon: Materials, Mechanisms, and Methods for Physical Neural Computing.” Abstract: “Physical implementations of neural computation now extend far beyond silicon hardware, encompassing substrates...

 Liquid cooling technology for semiconductor chips is 10 times more efficient than previous record  - AI data centers are power-hungry. Not only do artificial intelligence computations consume enormous amounts of electricity, but a significant amount of energy is also required to cool the semiconductor chips that heat up ...

 The Chip Insider®–Q&A: Intel's Resurgence. New Chip Concepts.  - Inside G. Dan Hutcheson’s latest analysis, Intel surges back to strength, turning geopolitics into partnerships while advancing next-gen compute from GPUs to silicon photonics.

 Florida Semiconductor Institute and Ecotek Lab Inspire Future Innovators Through Hands-On Semiconductor STEM Camp  - The Florida Semiconductor Institute and Ecotek Lab hosted a three-day Semiconductor STEM Camp at NeoCity from June 9-11, providing middle and high school students with hands-on exposure to one of the nation’s fastest-growing industries.

 Rapidus signs MoU with UKSC  - Rapidus, the Japanese initiative targetting 2nm process technology, has signed an MoU with the UK Semiconductor Centre (UKSC) covering future semiconductor manufacturing. In January 2026, the leaders of Japan and the UK agreed to strengthen cooperation in the technology sector. Building on this, Japan...

 How AI forms the future of Europe’s EDA industry  - The User2User event hosted by Siemens EDA brings together the electronic design automation community to share their real-world experiences.

 IQE and Tower sign InP epiwafer supply deal  - IQE and Tower Semiconductor have signed a multi-year agreement for the supply of Indium Phosphide (InP) epiwafers for optical connectivity applications serving AI-driven data centre infrastructure. IQE’s InP epiwafers will be used in several of Tower’s advanced silicon photonics platforms for next-generation...

 [News] Infineon Found to Infringe Innoscience GaN Patent, Barred from Selling Certain Products in China  - Innoscience announced that China’s Supreme People’s Court has upheld a sales injunction against certain gallium nitride (GaN) products manufactured by Infineon Technologies AG, bringing a patent infringement dispute between the two companies to a final conclusion in China, according to its compa......

 Imec Pushes Quantum Toward Manufacturable Silicon Systems  - Imec says advanced lithography and semiconductor integration techniques may help scale silicon spin qubits toward manufacturable quantum systems. The post Imec Pushes Quantum Toward Manufacturable Silicon Systems appeared first on EE Times .

 MLCCs: The \u201CRice of Electronics\u201D Becomes a Power Bottleneck in the AI Era  - Original Article By SemiVision Research [Reading time: 22 mins]

 Exclusive: Wiwynn triples capital, president says it signals confidence  - Wiwynn, Taiwan's smallest-capital server ODM with the highest EPS, is set to triple its share capital after shareholders approve a retained-earnings-to-capital-increase plan in 2026. President William Lin said the move is meant to show the market that the company is optimistic about the future. Wiwynn's...

 Taiwan firms ramped AI investment but must fix architecture to realize ROI

 InnoScience wins China patent ruling, Infineon GaN sales banned

 Wus Printed Circuit sees turnaround on high-end PCB demand

 Taiwan's IC design sector posts sharpest gains in years; May data hints at further acceleration into 2H26

 Southeast Asia shifts from test-and-pack to multi-center advanced packaging hub

 SK Hynix to test ChatGPT and Copilot as Samsung widens enterprise AI use

 China eases InP substrate exports, lifting compound semiconductor supply

 PCIM 2026: How customized AI agents are demystifying EMC design

 Weekly news roundup: Samsung foundry profit rebound may come in 3Q26; Nvidia unveils AI PC vision

 X app age rating raised to 19+ on South Korean Google Play Store after Grok's adult-content policy change

 Exclusive: Wiwynn sees no AI bubble for 4 years as capex surges

 AI power race lifts transformer demand, gives Fortune Electric pricing edge

 SK Hynix readies HBM4 packaging push as Nvidia demand grows

 AI server tracker: Taiwan's AI supply chain posts triple-digit gains in May as server makers and memory chips surge

 Google's TPU diversification challenges MediaTek and other ASIC partners

 CATL maps three-stage battery strategy as US blacklist grows

 India roundup: Meta-Reliance AI data centers, Anthropic-TCS tie-up, EV expansion, Starlink delay and supply chain shifts

 Fortune Electric sees export-led growth as global AI power demand tightens transformer supply

 India advances rare earth supply chain as major local conglomerates show interest

 LG Innotek's Vietnam substrate investment plan comes as FC-BGA demand broadens

 Machine tool suppliers forge alliances to offer one-stop solutions

 The great chip bazaar: India's fragmented fight to build a tech empire

 General-purpose server demand exceeds expectations; component shortages expected to normalize in 3Q26

 Exclusive: Wiwynn president rallies AI ecosystem to tackle power, cooling, optics

 Is SMIC N+3’s Metal Pitch Smaller than Intel 18A’s?  - SMIC N+3 Node Deep Dive vs TSMC N6, TechInsights Private Equity Sale, SemiAnalysis Teardown Engineering & Evaluation Lab…

 This Strange Crystal Bends Light Like Nothing Else in Nature  - This record-breaking crystal can transform from mirror-like to glass-like, opening the door to tiny optical chips, AR displays, and smart contact lenses. Creating truly “invisible” wearable technology such as smart contact lenses and ultrathin augmented reality glasses will require a radical rethink...

🌑 AsiaPac 
🇰🇷🇦🇺 --- ☀️ +

 Qualcomm said to be circling AI chip biz Tenstorrent in $10B RISC-V power play  - Potential takeover would represent significant commitment to the open instruction set architecture

 Nexperia stays profitable despite China disruption  - Nexperia reported a first-quarter 2026 revenue of 300.3 million dollars while remaining profitable despite losing control over its Chinese operations.

 NESCA space accelerator backs 13 North East projects  - NESCA – the North East Space Communications Accelerator – is distributing £490,000 to 13 space communications and technology projects. They cover testing for atmospheric interference, using AI and satellite data to prevent crop disease, and improving laser-based space communications. And the projects...

 FDA Approval of Glucose Monitor Explodes New Over-the-Counter Market  - A metabolic crisis is quietly sweeping through American youths, transforming paediatric prediabetes into one of the country's most urgent health emergencies. Recognising the acute need for accessible intervention, the U.S. Food and Drug Administration (FDA) achieved a historic milestone by expanding the...

 Semiconductor Startup Builds Alternatives for Vital Legacy Chips  - Phoenix targets the high-mix, low-volume demand for obsolete chips in critical systems

 半導體風雲/AI晶片戰隱形冠軍 高階材料掀地緣新賽局  - 台積電 前召開股東會,股東高度關注美國、 本及歐洲廠區營運現況與成本結構,管理階層也多次強調全球布局的重要性。對上游材料業者而言,過去只要滿足台灣單一生產基地需求,如今則必須思考如何同步支援北美、 本甚至歐洲客戶需求,供應模式已出現改變。...

 [News] TSMC Reportedly Runs Dual-Track Evaluation on CoPoS Pilot Line, Sparking Global, Local Vendor Competition  - TSMC Chairman C.C.Wei, as reported by the Economic Daily News, reaffirmed at the shareholders’ meeting in early June that a CoPoS (Chip-on-Panel-on-Substrate) pilot line is already in place, with mass production expected in 2–3 years—keeping the company’s panel-level packaging push in focus.......

 GlobalFoundries: First Chipmaker to Support Open Standard for AI Scale Up  - GlobalFoundries leads with the first silicon to support OCI MSA, shaking up AI data centers. The post GlobalFoundries: First Chipmaker to Support Open Standard for AI Scale Up appeared first on EE Times .

 CGD and NXP collaborate to accelerate time to market  - Firms to deliver complete power conversion solutions for automotive and data-center markets

 Nanoengineered wood sets new record for transformer insulation  - The world's power grid is straining under the surge in electricity demand from data centers, electric vehicles and renewable energy. And a century-old technology, the power transformer, must support this dramatic increase. ...

 Wi-Fi Flies Higher As Edge AI Build-Out Takes Root  - Chip and system designers scramble to leverage existing and future standards as edge AI increases demand for faster data movement and greater reliability. The post Wi-Fi Flies Higher As Edge AI Build-Out Takes Root appeared first on Semiconductor Engineering .

 Mask Contamination: The Big Operational Headache for EUV Lithography  - Pellicles lasting less than a day of exposures, masks getting dirty at unknown times and getting worn out by cleans

 Battery-Free Artificial Photosynthesis Turns Sunlight, Water, and CO2 Into Fuel  - A self-regulating artificial photosynthesis system makes solar fuel without batteries, offering a simpler and potentially cheaper path to clean energy storage. Researchers at Osaka Metropolitan University have created a new artificial photosynthesis system that can produce solar fuel more consistently...

 Chinese compound chip stocks surge after Supreme Court blocks Infineon in GaN patent case  - A decision by China’s Supreme People’s Court on Friday upheld a lower court’s injunction issued against the German company in May

 CEA-Leti Scales Ferroelectric RAM to 22nm Node, Unlocking Denser, More Efficient Memory for Edge AI  - Breakthrough Reported at VLSI 2026 Also Extends to High-Performance Computing, Aerospace & Defense Systems, and IoT Platforms​

 This week’s outside five sigma (#103)  - Optical Circuit Switch with Lasers

 Optical Interconnects Become Critical to AI Factory Expansion; CPO/NPO Market Expected to Exceed US$39 Billion by 2030, Says TrendForce  - TrendForce’s recent research on silicon photonics (SiPh) shows that the rapid growth of AI training and inference workloads is pushing AI data centers toward increased power use, higher rack densities, and larger clusters. As data transfer becomes a major energy drain, CSPs are treating interconnect...

 Rapidus、UK Semiconductor Centreと将来の半導体製造のための基本合意締結  - ~ 本政府と英国が進める技術協力の枠組みの一環として推進~


 [EOT] @lithos_graphein2026-Jun-16 13:14:51