Boost Front-End SoC Design With Defacto’s AI-Powered Tool - Front-end SoC design has always been a balancing act between speed, accuracy, and the large amount of manual work required to get RTL, IPs, and collaterals to be aligned. In a recent webinar, Defacto CEO and founder Chouki Aktouf joined by product manager Valentin Boyer, walked through how the company...
The Chip Insider®– Why Test is Outpacing WFE - Inside G. Dan Hutcheson’s latest analysis, the AI-driven shift from consumer electronics to advanced computing reveals why semiconductor test is outpacing WFE and reshaping industry economics.
Sony-TSMC $4.7B Deal Helps Thwart Samsung, Analysts Say - Sony and TSMC have joined forces to counter Samsung's growing presence in smartphone image sensors, particularly for Apple. The post Sony-TSMC $4.7B Deal Helps Thwart Samsung, Analysts Say appeared first on EE Times .
DACRI: Decision-Aware Causal Intervention Ranking for Critical Supply Chains - …Relative to a full-information train-selected static benchmark, LambdaMART improves median normalized net value by 5.7--16.2\%, with paired statistical support on the semiconductor and critical-material archetypes but not on digital infrastructure. On digital infrastructure, a domain-informed constant-buffer...
Where Korea’s economy will be won in the AI era (KOR) - Where Korea’s economy will be won in the AI era (KOR) Korea’s AI strategy overweights chips and data centers, and says productivity, talent and manufacturing-based AI will decide the country’s future. 8/11/2026 - 08:59 PM Opinion Desk
China drinks twice as much beer as USA - China is the world’s leading producer of beer, according to the latest BarthHaas Report. In 2025, the country’s output stood at 354 million hectolitres of beer. A hectolitre is equivalent […] The post China drinks twice as much beer as USA appeared first on Electronics Weekly .
Google Pixel 11 Analysis | Upcoming Teardown - Every Pixel launch resets expectations for the rest of the Android market. Get the full Pixel 10 teardown now and see the BOM, component sourcing, and design choices the Pixel 11 must top.
TDK vibration-resistant axial capacitors for 125 V - Addressing what it sees as increasing demand for compact and high-ripple-current DC-link capacitor banks, TDK is expanding its axial/soldering star-aluminium electrolytic capacitor lineup. This is both adding 125 V-rated components […] The post TDK vibration-resistant axial capacitors for 125 V appeared...
Korea to enact special law speeding semiconductor, AI megaprojects - Korea to enact special law speeding semiconductor, AI megaprojects The presidential office aims to pass a mega special zones law this year to fast-track approvals, infrastructure and incentives for semiconductor, physical AI and AI data center investments. 8/10/2026 - 08:34 AM News Team
[News] Samsung Reportedly Eyes High-NA EUV for 1nm around 2030 as TSMC Also Takes a Cautious Approach - Samsung is advancing its next-generation lithography roadmap. According to ZDNet, the company is targeting its 1nm process, expected to enter mass production around 2030, for the adoption of High-Numerical Aperture (High-NA) EUV. Citing ChangMin Park, a Master and senior technology expert at Samsung......
LX Semicon Begins Supplying Automotive MCUs to Hyundai Motor and Kia - LX Semicon has begun supplying automotive semiconductors to Hyundai Motor and Kia, marking the first major achievement from a new business initiative launched four years ago to diversify beyond display driver ICs (DDIs).The company said on Aug. 10 that it has been supplying its automotive microcontr
Quantum-Device Simulation of Optical Decoherence of Hole-Spin Qubits in Self-Assembled Quantum Dots - …for communications between distant spin qubits in quantum technologies, but the interband optical excitation can also damp electrically driven hole-spin Rabi oscillations in semiconductor self-assembled quantum dots (SAQDs). We report a device-level modeling workflow that integrates realistic SAQD...
Failure Analysis HW Enables System-Level Debug For 3D ICs (Google, TU Delft) - Researchers from Google and Delft University of Technology published a technical paper titled “Innovative FA Hardware Solution to Enable System-Level Debug of 3D ICs.” Abstract Excerpt: “This paper presents a novel Failure Analysis (FA) hardware and sample preparation solution that enables System-Level...
Semiconductor Failure Analysis Process: From Failure to Root Cause - When a semiconductor device fails, the visible damage is not necessarily the root cause. A damaged metal line, cracked package, leaking transistor or burned bond wire may be the final result of a sequence of events rather than the original problem. The purpose of the semiconductor failure analysis process...
Musk hints at free-electron laser EUV source tech for Terafab - Terafab, the joint chipmaking venture by SpaceX and Tesla, may adopt free-electron lasers (FELs) to produce EUV light rather than the laser-produced plasma sources currently employed by ASML.
Lane Electronics distributing Cinch-Fibreco JCON series beam adapters - The newly released Cinch-Fibreco JCON series, the JCON Junior Bulkhead Expanded Beam Adapter, is now available from Lane Electronics. The design of the adaptor is to simplify panel-mount fibre-optic connectivity […] The post Lane Electronics distributing Cinch-Fibreco JCON series beam adapters appeared...
Build infrastructure first for Honam chip fabs - Build infrastructure first for Honam chip fabs The government’s 2029 fab target hinges on building power, water and transport networks before construction begins. 8/12/2026 - 11:01 AM Opinion Desk
Technical Report: HiSilicon T30322 5G RedCap RF Transceiver Floorplan Analysis - The HiSilicon T30322 is Huawei/HiSilicon's 5G RedCap modem platform, developed for 3GPP Release 17 Reduced Capability (RedCap) applications. It targets the growing mid-tier IoT market that sits between LTE Cat-4/Cat-6 and full-featured 5G smartphones, including industrial IoT, wearables, surveillance,...
Record high wafer shipments. Can fabs keep pace? - While fabs continue to expand 300-mm capacity, industry's next challenge is ensuring that materials, packaging, and logistics can keep pace. The post Record high wafer shipments. Can fabs keep pace? appeared first on EDN .
DB HiTek profit jumps 43% as TSMC, Samsung scale back 8-inch capacity - DB HiTek posted a 43% jump in second-quarter operating profit as tighter 8-inch foundry supply and stronger power semiconductor demand kept its fabs running near full capacity, with industry reports saying the company plans another round of price increases in the second half of 2026.
Agentic AI, Multi‑Physics, and Standards Will Redefine Chips Design - Agentic AI, brutal physics bottlenecks, and standards are remaking chip design from silicon to systems. The post Agentic AI, Multi‑Physics, and Standards Will Redefine Chips Design appeared first on EE Times .
Market Data: Image Sensor Market Share 2025 - The image sensor market expanded by over 10% year-over-year in 2025, as demand for advanced imaging sensors remained strong across mobile, automotive, industrial, security, and emerging applications. Growth was driven primarily by premium CMOS image sensor demand for smartphones, increased sensor content...
Presidential office ducks leadership on 52-hour workweek dispute - Presidential office ducks leadership on 52-hour workweek dispute The presidential office is undercutting its semiconductor push by avoiding making a clear decision on 52-hour workweek exemptions for megaprojects. 8/11/2026 - 11:01 AM Opinion Desk
The Interoperability Illusion: The True Test for Smart Utilities and Cities - Wi-SUN Alliance's Phil Beecher makes a pointed distinction: standards compliance and real-world interoperability are not the same thing. The post The Interoperability Illusion: The True Test for Smart Utilities and Cities appeared first on Semiconductor Digest .
삼성전자, 1나노부터 고개구율 EUV 기술 적용 - 삼성전자가 이르면 오는 2030년께 상용화될 1나노미터(nm) 공정부터 노광 기술 혁신에 나선다. 차세대 극자외선(EUV) 기술인 '고개구율(High-NA) EUV'를 1나노에...
Nanya set to become ASML’s newest EUV customer - Taiwanese memory maker Nanya Technology is preparing to join the group of chipmakers using EUV lithography, giving ASML another customer for its flagship exposure systems.
Lee calls for flexible, humble mindset in tax reform and ministerial debate on 'megaprojects' - Lee calls for flexible, humble mindset in tax reform and ministerial debate on 'megaprojects' In a Cabinet meeting, the president said that policies need to be hashed out with consideration for public opinion while addressing a slew of pressing issues. 8/11/2026 - 04:42 AM News Team
Smartphone margin squeeze - Memory will account for 34% of the BoM for an iPhone18, estimates TrendForce, compared to only 10% for last year’s iPhone 17. In H127 it will account for 42% of […] The post Smartphone margin squeeze appeared first on Electronics Weekly .
Amkor Is Said to Explore Stake Sale in $1.5 Billion China Unit - Amkor Technology Inc., a provider of outsourced semiconductor assembly and testing services, is considering options including selling a stake in its China business, according to people with knowledge of the matter.
Tracker: Global Top 200 Smartphone Revenue, Value Share, ASP, and Price Band by Model – Q1 2026 - This highly detailed report shows the top 200 best-selling smartphone models globally in terms of their revenue, value share, wholesale ASP, and price band in the first quarter of 2026. The models included in the report cover 96% of the total smartphone revenue in Q1 2026, including all major vendors....
DAC 2026 Wrap-Up: AI-Powered Engineering Moves from Vision to Workflow Reality - Explore Cadence IP Every year, Design Automation Conference (DAC) brings big announcements, packed demos, and deep technical conversations—and this year at DAC 2026, the inflection point was AI moving from point-task assistance to workflow-level autonomy. Across a week of high-energy …
Conference Report: System Level Thinking Needed in AI Era - Progress on Perf/Watt and Perf/TCO now depends on co-optimizing compute, memory, and interconnect as a system, not as separate scaling problems The post Conference Report: System Level Thinking Needed in AI Era appeared first on Semiconductor Digest .
Comparing Intel EMIB and Intel Foveros - Intel EMIB and Intel Foveros are advanced semiconductor-packaging technologies designed to combine multiple silicon dies, or chiplets, within one processor package. Both support heterogeneous integration: manufacturers can build different functions using the process technology best suited to each one,...
Intel may be heading back to memory - Intel CEO Lip-Bu Tan (pictured) is teasing a return for Intel to the memory market. ”I used to be, ‘do not invest in memory because it is a kind of […] The post Intel may be heading back to memory appeared first on Electronics Weekly .
An energy storage device designed to be recycled - Smartwatches, phones and even some drones rely on lightweight, rechargeable energy storage systems. Once those devices wear out, many end up as electronic waste. Now, researchers reporting in ACS Energy Letters have developed ...
Astrolight, ATMOS Space Cargo sign MoU for in-flight laser comms - Astrolight and ATMOS Space Cargo have signed an MoU (memorandum of understanding) to jointly demonstrate what they describe as the first in-flight optical communications link between a re-entry spacecraft and […] The post Astrolight, ATMOS Space Cargo sign MoU for in-flight laser comms appeared first...
Narrative: Global Smartphone Vendor and OS Market Share by Region – Q2 2026 - Global smartphone shipments fell 7.4% year-on-year in Q2 2026, more than three times the rate of decline recorded in Q1. The Q1 story was an entry-level squeeze. Q2 is broader: OPPO, a mid-tier vendor, swung to a double-digit YoY decline, and Honor’s Q1 claim that geographic diversification had insulated...
What Are DDR5 DIMM Chipsets? The Complete Guide To RCDs, PMICs, SPD Hubs and More - How DDR5 DIMM chipsets work, why they matter, how they build upon DDR5 technology, and how emerging module architectures are extending memory bandwidth. The post What Are DDR5 DIMM Chipsets? The Complete Guide To RCDs, PMICs, SPD Hubs and More appeared first on Semiconductor Engineering .
Global semiconductor market doubles in H1 2026 - The global semiconductor market generated 702 billion US dollars in revenue during the first half of 2026, more than doubling compared with the same period a year earlier, according to the latest figures from the World Semiconductor Trade Statistics organization.
Agentrys Launches Agentic Design Automation at DAC 2026 - There were many new agentic design flows introduced at DAC this year. Some from mainstream providers and others from new startups. The increased level of activity around this technology was good to see. Most of the approaches presented at the conference were targeting specific parts of the flow. Verification...
AI Hardware’s Next Frontier Is Integration - The LID World Summit 2026 showed why AI progress now depends on system-level advances in memory, packaging, photonics, and power. The post AI Hardware’s Next Frontier Is Integration appeared first on EE Times .
From Silicon To Systems: Redefining Competitive Advantage, Part 1 - Semiconductors are evolving from a product industry into an ecosystem industry. The post From Silicon To Systems: Redefining Competitive Advantage, Part 1 appeared first on Semiconductor Engineering .
Europe Needs Government Support For Data Processing - The need for Government support in Europe for automatic data processing was stressed by Mr. B. A. Maynard, of Cooper Brothers, when he spoke on Monday about the DEEC report […] The post Europe Needs Government Support For Data Processing appeared first on Electronics Weekly .
Synopsys and Intel Foundry Enable System-Level Design on Intel 14A - Synopsys and Intel Foundry are expanding their collaboration to accelerate customer adoption of Intel 14A, connecting advanced process technology with production-ready electronic design automation, silicon intellectual property, multiphysics analysis, and multi-die integration. Announced at the 2026 DAC...
Baillie Gifford’s McPadden Backs TSMC, SK Hynix Over China Chips - Baillie Gifford & Co.’s Paulina McPadden said companies like Taiwan Semiconductor Manufacturing Co. and SK Hynix Inc. hold near-monopoly positions in advanced chip manufacturing that China will struggle to match, even as Beijing mobilizes its stock and bond market to fund its AI ambitions.
Six Five Pod Ep. 314: TerraFab, Memory's Comeback, and the Custom Silicon Debate - Patrick Moorhead and Daniel Newman cover Tesla and SpaceX's $16.8 billion TerraFab chip factory, Samsung's zHBM debut at FMS 2026, a week of frontier model launches, and a simulated debate for “The Flip” over whether custom silicon will capture the majority of AI workload dollars by 2028. The episode...
