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🔴 AsiaPac 
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 MARKETS DASHBOARD—Beta testing this now. There are a lot of bugs to iron out, so if you see this note, please don't rely on the accuracy of this data.
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 Semiconductors enter 'multi-tasking' era: New device cuts required components by 75% and quadruples processing speed  - Less than two decades after smartphones fit into the palm of our hands, artificial intelligence is now running on devices worn on our wrists. The challenge is that while devices continue to shrink, the amount of data they ...

 Analyzing Rowhammer Vulnerability in Monolithic 3D IWO eDRAM for Edge (ASU, Georgia Tech)  - Researchers from Arizona State University and Georgia Institute of Technology published “Thermal- and Aging-Aware Rowhammer Vulnerability Analysis of Monolithically-Integrated IWO eDRAM for Edge Platforms”. “This work presents the first comprehensive temperature- and aging-aware vulnerability analysis...

 Nanosensor-coated catheters for bladder cancer detection  - A catheter equipped with an annular carbon nanotube sensor array enables real‑time, in situ three‑dimensional chemical imaging of cancer biomarkers, mapping the localization of early-stage tumours.

 MLPerf and the rise of latency-aware LLM benchmarking  - Here is a sneak peek at the evolution of the MLPerf benchmark and how generative AI forced a radical shift in AI hardware evaluation. The post MLPerf and the rise of latency-aware LLM benchmarking appeared first on EDN .

 Huawei chips refine DeepSeek model in major leap for China’s AI self-reliance  - While Chinese chipmakers have found success in supporting AI inference, they are struggling with the far more complex process of training

 [News] HBF Spurs Equipment Race; Hanmi Semiconductor Eyes First TC Bonder Deliveries in 2H26  - Back-end semiconductor equipment suppliers are increasingly focusing on High Bandwidth Flash (HBF), a next-generation memory technology designed for AI inference. According to ZDNet, industry sources said that South Korean and international back-end equipment makers have begun developing thermal com......

 [News] Laser Annealing Adoption May Broaden with Wolfspeed, Samsung SiC Push and 400-Layer NAND Expansion  - Laser annealing adoption appears to be broadening. According to ETNews, the thermal treatment process is expanding beyond its traditional use in silicon (Si) wafers to silicon carbide (SiC), a material widely regarded as a leading candidate for next-generation power semiconductors. The report adds t......

 POET Investor Alert - POET Technologies Inc. Stockholders with Large Losses Should Contact Robbins LLP for Information About the Securities Fraud Class Action Lawsuit  - Interposer™, a novel platform that allows the seamless integration of electronic and photonic devices onto a single chip using advanced wafer-level semiconductor manufacturing techniques."

 Netrasemi Brings Up A2000 AI Chip, Begins Customer Evaluation Phase  - Indian startup Netrasemi launched the A2000 AI chip built on a 12-nm technology node. The post Netrasemi Brings Up A2000 AI Chip, Begins Customer Evaluation Phase appeared first on EE Times .

 IBM Launches Global AI Builders Challenge With IBM Bob for University Students, Expanding Availability of IBM Bob to 20,000 Post-Secondary Institutions Worldwide  - IBM (NYSE: IBM) today announced the AI Builders Challenge, a global challenge with IBM Bob – IBM’s new AI-powered development partner – that will help university students build practical AI and software development skills for the future of work.

 AMD takes a third of server CPU market as shipments grow  - Intel still owns the room, but Epyc keeps nicking the furniture

 ‘Not afraid’: TSMC brushes off mainland chip rivals amid AI boom  - Wei’s comments come as mainland foundries expand mature-node capacity and Huawei pushes alternative chip-scaling ideas under US sanctions

 Detection at the nanoscale: A phosphate-detecting electrochemical sensor  - Graphene, the "wonder material," has shaped much of Suprem Das's research career. From nano-manufacturing to advanced printing for applications such as sensing and energy, Das is committed to finding graphene solutions with ...

 EU Chips Act 2.0 draft drops front-end manufacturing priority  - Boosting semiconductor demand is a key new feature in the new EU Chips Act, which the European Commission outlined on Wednesday.

 NVIDIA Joins the Windows on Arm Ecosystem, Driving Arm-Based AI Notebook Penetration to 34.2% by 2029, Says TrendForce  - TrendForce’s latest research reveals that the current AI notebook market is primarily driven by Intel, AMD, Apple, and Qualcomm. However, as it stands, the industry still lacks products capable of fully demonstrating the value of on-device AI computing at scale and creating compelling upgrade incentives...

 Build 2026: Accumulating evidence of Microsoft’s AI independence  - Abundant use of the AI acronym is increasingly evident at various industry events. Strip away the hype layer and look deeper, however, and interesting trends still emerge into view. The post Build 2026: Accumulating evidence of Microsoft’s AI independence appeared first on EDN .

 Dynamic nanogates let longer molecules pass faster through flexible pores  - A research team led by Professor Shuichi Hiraoka at the University of Tokyo and Professor Masanori Tachikawa at Yokohama City University has quantitatively analyzed how molecules pass through dynamic nanoscale pores using ...

 Space report measures impact of academia on the UK space sector  - A report produced for the UK’s Space Partnership by the consultants know.space examines the impact of academia on the UK space sector. Space research For context, the report – Role and Impact of Academia on the UK Space Sector – states there are 112 space research organisations active in the UK....

 Quantum can become semicon 2.0 for the Netherlands  - Quantum technology now offers the chance to build a second pillar under the Dutch economy, this time centered around Delft and Leiden, argues Anton Duisterwinkel.

🔴 EMEA 
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 Intel: Pushing EMIB Forward: Design Methodology Insights with Synopsys Tools  - As advanced packaging becomes a critical enabler for next-generation semiconductor products, Intel continues to drive innovation through its Embedded Multi-die Interconnect Bridge (EMIB) technology. EMIB has emerged as a foundational packaging solution for heterogeneous integration, allowing multiple...

 Geopolitics, AI, and Jensen Huang Fuel Electronics’ Rock-and-Roll Era  - Jensen Huang and AI frenzy steal the show at Computex 2026—dive in to see how Taiwan leads the electronics. The post Geopolitics, AI, and Jensen Huang Fuel Electronics’ Rock-and-Roll Era appeared first on EE Times .

 Business Finland backs Iceye with further €28.3 million grant  - Iceye, the Finnish specialist in satellite-based SAR imagery (Synthetic Aperture Radar), has received a €28.3 million continuation grant from Business Finland. This is Finland’s public innovation agency, and it’s the final tranche of the total investment (€33.8 million). Initial funding of €5.7...

 Chips Act 2.0 Puts Demand at Center of Europe’s Semiconductor Strategy  - Chips Act 2.0 shifts EU focus from factory subsidies to chip design and demand. The post Chips Act 2.0 Puts Demand at Center of Europe’s Semiconductor Strategy appeared first on EE Times .

 Vintage Turntable Gets Brain Transplant and Home Assistant Integration  - When [Marsupial] picked up a vintage Sansusi P-L45 turntable, he figured it would be an easy fix: a few capacitors, a belt or two, and maybe a new cartridge, the …read more

 Trump’s AI order seeks security safeguards without slowing race with China  - Voluntary framework to vet powerful new AI systems up to 30 days before their public release, stopping short of mandating review regulations

 Mitsubishi Electric to Launch Data-provision Service to Accelerate Adoption of Latest Power Semiconductors  - 3-level inverter design and validation data will speed up inverter system development

 NY Creates President & CEO Dave Anderson Featured in Semiconductor Digest Article  - NY Creates President and CEO Dave Anderson shares his perspective on overcoming challenges for the semiconductor industry, the promise of High NA EUV lithography, and the power of collaboration in his recent article in Semiconductor Digest, “Meeting 2nm Node Challenges: Overcoming Scaling Limits Through...

 Webinar | Emerging Materials Redefining the Joint Replacement Market  - Join IDTechEx Technology Analyst Dr Felix Wei on Thursday 11 June for the expert-led webinar, "Emerging Materials Redefining the Hip and Knee Replacement Market". Choose your preferred time zone - the webinar runs three times in one day.

 Terrace Free SOI: maximizing usable wafer area  - Terrace Free SOI is available across Okmetic’s 200 mm SOI wafer portfolio, including Bonded SOI (BSOI), Enhanced SOI (E-SOI®), Power Management SOI and High Resistivity SOI wafers. The solution combines increased active area with an edge design optimized for device manufacturing. More dies per wafer...

 Ultra-Stable Semiconductor Laser  - Simon Ayotte, Principal Scientist – Lasers and Photonics, indie’s Photonics BU The LXM is a compact semiconductor laser module exhibiting world-class linewidth and frequency noise performance, surpassing even high-end fiber lasers, as detailed in the white paper Rethinking Laser Performance: Advancing...

 Melexis introduces the world’s first 2-wire 2-bit Hall switch  - Melexis unveils the MLX92344, a PCB-less 2-wire Hall switch for contactless detection of up to four positions, enabling smaller, safer and more flexible automotive body electronics.

 Taiwan test interface maker CHPT rides AI chip orders to record May revenue  - Chunghwa Precision Test Tech. (CHPT), a supplier of semiconductor test interfaces, reported revenue in May 2026 that reached another monthly record, supported by sustained orders from major AI chipmakers as global demand for AI applications continued to rise. Overall operations in the second quarter of...

 TSMC shareholders clear record 2025 results, putting AI capacity roadmap in focus

 LG Innotek targets Intel EMIB substrate chain with SK Hynix samples

 Adlink ramps robotics and edge AI expansion as US market drives growth

 Nvidia's Jensen Huang courts Korean giants in robotics expansion

 Chenbro targets server rack global leadership in 3 years

 Samsung's rumored CIS production shift highlights industry debate over fab ownership

 TSMC chairman dismisses rival cluster pushes, says Taiwan's supply chain remains unmatched

 Tripo AI raises nearly US$200 million to expand 3D and world model research

 Ventec wins spillover high-speed CCL orders, revenue rises

 Foxconn, SK Group eye deeper AI infrastructure ties in Asia

 Qualcomm says Snapdragon C fills entry-level AI PC gap, not tied to Apple

 Huawei's MineHarmony OS links 935 mining devices in China's smart mining push

 Exclusive: How China's subsidized SiC boom is driving global prices to the floor

 Huawei's Tau Law shifts AI chip race to glass substrates, advanced packaging

 Ability wins surprise Japanese OEM camera order, to boost fourth-quarter 2026 revenue

 EU launches Technology Sovereignty Package to strengthen chips, AI, and cloud infrastructure

 Kentec challenges traditional data centers with modular AI data center orders

 Applied Materials to add 1,000 Southeast Asia jobs as Singapore role grows

 The 'Wintel' of robotics? Nvidia allies with Unitree to standardize AI humanoid development

 AI sparks tight supply warning for high-end passive components; MLCC rally eyes new super cycle

 TSMC sees no sign of capex slowdown as demand stays strong

 Southern Taiwan Science Park January-April 2026 revenue tops NT$1 trillion on AI boom

 BYD joins race to build humanoid robots

 TSMC chair says CoPoS could scale within years while downplaying risk from Terafab

 Nvidia's RTX Spark reveals Jensen Huang's bigger AI agent fight with Apple and Google

 Apple's MacBook Neo shines amid PC market memory crunch

 HBM4 supply in focus as SK's Chey meets TSMC's Wei

 New 650 V ICeGaN Device for Automotive Applications From CGD Helps Increase EV Range  - CGD's new 650V ICeGaN® device with low on-resistance improving inverter efficiency for reduced thermal management provision and enabling higher frequency switching for system size and weight reduction.

 Honor says ‘learning from best’ after seeing Huawei ruling foldable market  - IDC has released its analysis on the Chinese foldable phone market for the Q1 2026 segment, where Huawei continues to rule, and Honor has ranked in...

 [News] LSTC’s Research Breakthrough Clarifies Sub-2nm Process Variations, Supporting Rapidus’s 1.4nm Ambitions  - As Rapidus advances toward its roadmap of 2nm mass production in 2027 and 1.4nm in 2029, a new technology breakthrough could lend support to its ambitions. According to Hokkaido Shimbun, the Leading-edge Semiconductor Technology Center (LSTC), a consortium formed by national universities in Japan an......

 The AI factory operating system – How Siemens and NVIDIA are creating the infrastructure for intelligent manufacturing  - We can all cite numerous examples of how artificial intelligence is reshaping global manufacturing at warp speed. Today, several types…

 GlobalFoundries joins U.S. Department of Energy’s Genesis Mission as industry partner  - Partnership paves the way to pair AI-enabled semiconductor design with GF’s U.S. manufacturing platform to bridge the gap from research to prototype for next-generation computing […]

 InchFab Sells $10M Mini Fabs to Democratize Chipmaking  - InchFab's mini fabs are cost-competitive with larger 8-inch wafer fabs at the half-micron and larger nodes. The post InchFab Sells $10M Mini Fabs to Democratize Chipmaking appeared first on EE Times .

🔴 Americas 
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 Podcast EP349: llmda.a’s Unique AI Fabric for Embedded Systems Development with Nagesh Gupta  - Daniel is joined by Nagesh Gupta, CEO of llmda.ai . Nagesh has built a career spanning multiple aspects of system design and development at companies including Hewlett-Packard, Cadence, Xilinx, and Lattice Semiconductor. He is also a serial entrepreneur. Nagesh founded Taray, Inc., which developed memory...

 See Every Watt, Save Every Microamp—Even on Low Voltage Rails  - Modern systems require continuous insight into low voltage power rails, and the PAC1721 and PAC1821 deliver accurate, real time voltage, current and power monitoring with power consumption that scales with sampling speed—providing actionable power intelligence without the efficiency penalty.

 Reduce Memory Redesigns With Shift-Left  - Early schematic analysis prevents late-stage rework. The post Reduce Memory Redesigns With Shift-Left appeared first on Semiconductor Engineering .

 Gigabyte packs 40 Intel Lunar Lake PCs in a pizza box  - Who needs one big CPU when you could have dozens of little ones?

 Nexchip carves out BGBM assets to back Wuhu wafer project, refocuses on 12-inch foundry business  - Nexchip Semiconductor plans to carve out its BGBM business by contributing specialised equipment assets to Anhui Ruijing Semiconductor, a newly established power device wafer-processing venture in Wuhu, Anhui Province, as the Chinese foundry seeks to focus capital and management resources on its core...

 AI servers and MLCC recovery drive growth at Ample Electronic

 Anthropic calls for AI research slowdown as model capabilities accelerate

 Huawei's Tau Law stirs debate over China's post-Moore's Law chip path

 Alibaba opens Qwen to KFC, Luckin Coffee, and airlines in AI agent battle

 Infineon India moves up the value chain as AI data centers boost power-chip demand

 Analysis: How Jensen Huang pays top-dollar talent to keep Nvidia on top

 Sambanova challenges GPU dominance in AI inference at Computex

 FADU wins new contracts as AI workloads reshape data storage

 From 10kW to 1MW per rack in five years: Flex CTO says the hardest leap is still ahead

 Hiwin and Qualcomm bring edge AI to PLP equipment with Load Port tie-up at Computex

 Foxconn posts record May revenue as AI rack demand fuels growth

 NXP chief says factories will lead robot adoption globally

 US officials explore an AI dividend for American households

 Samsung's biggest union loses majority status after bonus talks

 OECD data show China-based semiconductor makers receive outsized industrial support

 Compal's server business surges, non-PC revenue eyes 50% by 2027

 COMPUTEX 2026: Taiwan optics leaders pivot from smartphone bottlenecks to edge AI supply chain

 Foxconn deepens AI push with Intel on inference racks

 HBM is too expensive, DRAM can't scale — Kioxia tells Computex SSDs are the answer for agentic AI

 South Korea finalizes US$520 million on-device AI chip budget amid industry doubts

 India faces PCB supply squeeze as raw material shocks, AI demand, and import dependence drive costs higher

 Nvidia deepens humanoid robotics role with Unitree and Cosmos 3, secures AI chips

 Nvidia's Jensen Huang to meet South Korean business leaders beyond HBM sector

 Infineon sees early quantum computing gains as finance leads adoption

 Meta's delayed Muse Spark API raises questions over AI monetization strategy

 US targets China's PCB grip as AI and defense supply risks mount

 Global semiconductor market to hit US$1.5 trillion in 2026 as memory surges 250%, WSTS forecasts

 GoldKey Technology sees memory crunch lasting into 2028 as AI demand lifts prices

 AI demand strains PCB supply chains, lead times stretch past 20 weeks

 Foxconn says Nvidia's Vera Rubin AI products remain on track for 2026 shipment

 Foxconn, Intel link chips, racks and systems in AI infrastructure push

 South Korea's only SRAM-CIM IP firm Articron targets edge AI

 RTX Spark rekindles memory shortages, TeamGroup shifts to industrial control

 Hiwin targets logistics automation with Dexterity dual-arm robot

 Local Chinese brands challenge dominant brands in AI glasses innovation; limitations hinder mass adoption

 Hanmi Semiconductor eyes record sales in Computex debut as HBM4 demand grows

 AI energy demand drives a shift to vertical power delivery and smaller modules

 Arm says Taiwan powers its rise as agentic AI lifts PC growth

 TSMC CEO says rising profits mean greater social responsibility, clarifies bonus considerations

 TSMC says AI demand is straining the entire supply chain, not just chipmakers

 CXMT's South Korean hiring spree puts Samsung, SK Hynix memory lead on alert

 Commentary: Memory boom driven by DRAM now, but HBM will decide future

 Marvell says SerDes and packaging are key hurdles in switch chip development

 Analysis: Intel turns to Foxconn partnership to strengthen position in evolving AI market

 AI cooling demand is pushing server pumps into sharper focus

 Nvidia CEO and Intel CEO Q&As at Computex  - Jensen Huang and Lip-Bu Tan discuss AI demand and supplies.

 MicroIP and BrainChip Announce Strategic Ecosystem Partnership to Deliver Advanced Edge AI Hardware and Software  - MicroIP and BrainChip Announce Strategic Ecosystem Partnership to Deliver Advanced Edge AI Hardware and Software LAGUNA HILLS, Calif. and HSINCHU CITY, TAIWAN – June 2, 2026 – BrainChip Inc., a leading provider of ultra-low-power, neuromorphic AI semiconductor intellectual property, today announced...

 Nanoparticles inspired by lung fluid improve therapies targeting respiratory system  - The CIC biomaGUNE Center for Cooperative Research in Biomaterials has developed pulmonary surfactant nanoparticles (the blend of lipids and proteins that line the alveoli and enables breathing), which are encapsulated in ...

 GSA European Executive Forum  - GSA European Executive Forum Quantum Computing is moving from promise to deployment reality with semiconductors as the enabler of scale. This event brings together senior executives to engage these shifts with clarity and candor and to ask what leadership looks like in the decade ahead. Join us in Munich...

 How tuning atomic order and surface chemistry can shape MXenes  - Scientists at the U.S. Department of Energy's (DOE) Argonne National Laboratory are helping show what it means to design a material almost atom-by-atom. In two publications, scientists show they can carefully choose the types ...

 Photronics to Participate in Upcoming Investor Conferences  - BROOKFIELD, Conn., June 03, 2026 (GLOBE NEWSWIRE) — Photronics, Inc. (Nasdaq:PLAB), a worldwide leader in photomask technologies and solutions, today announced it will participate in the following upcoming investor conferences:...

 AI job cuts lift April US layoff plans 38%  - AI job cuts became the largest stated reason for US layoff announcements in April, as employers announced 83,387 planned cuts,…

 Tessalia plans $250m packaging plant in France  - Earlier this week Tessalia Technology. a packaging jv between Foxconn, Radiall, and Thales, laid the foundation stone of an advanced semiconductor packaging facility in Le Barp, Nouvelle-Aquitaine. Patrice Caine, Chairman and CEO of Thales, said Tessalia represents a push for control over the company’s...

 Memory card interfaces keep pace with the internal bus evolution race: Part 1  - Clock speeds get faster. Per-cycle (and per-clock edge) address and data dollops get larger. And protocols get more efficient. But here we’re talking about external, not internal, buses. The post Memory card interfaces keep pace with the internal bus evolution race: Part 1 appeared first on EDN .

 TWSE and Industry Partners Highlight Taiwan's Central Role in the Global AI and Semiconductor Race at COMPUTEX 2026  - featured companies spanning semiconductor, AI infrastructure and those who are critical to the global supply chain, illustrating how access to long-term capital enables sustained innovation and international competitiveness.The first session focused on Taiwan's semiconductor ecosystem, with participation...

 [News] Broadcom Stops Short of Raising FY2027 US$100B AI Chip Sales Target Despite Google, Meta Commitments  - Broadcom holds its Q2 earnings call. According to Bloomberg, the company delivered a softer-than-expected outlook for AI chip revenue, suggesting that its expansion in the rapidly growing AI market may be progressing more slowly than anticipated. The company forecasts AI semiconductor revenue of US$......

 Mitsubishi Electric to Ship 5th-generation SiC-MOSFET Bare Die Samples  - Industry-leading low on-resistance, approx. 25% less than existing products, enhances xEV power efficiency

 Wiwynn and Shinwa Controls Announce Strategic Collaboration to Deliver Advanced Next-Generation Data Center Cooling Solutions  - high-precision thermal control and advanced infrastructure systems with proven high field reliability which have been matured for decades in the stringent semiconductor fab industry. Building upon three years of intensive joint engineering, validation, and product co-development, the partnership delivers...

 Broadcom advances OpenAI custom chip program, expands Anthropic AI compute initiative  - Broadcom said its AI semiconductor business remained in an "insatiable" demand environment on its second quarter of fiscal 2026 earnings call on June 3, as it outlined progress with its six core customers, including Google, OpenAI, Meta, Anthropic, and Apollo-backed programs. Chief Executive Hock Tan...

 MIT Engineers Solve a Major Lidar Problem That Has Stumped Researchers for Years  - A new MIT-designed lidar chip uses specially engineered antennas to reduce interference and widen the sensor’s field of view. From self-driving cars navigating busy streets to drones surveying disaster zones, lidar has become one of the most important technologies for helping machines perceive the world...

 An Update on IP Lifecycle Management (IPLM)  - IPLM is not always prominent, nevertheless it is a very necessary aspect of semiconductor (and systems) design. Modern designs build on a wide range of IPs and subsystems, each evolving through multiple variants and versions, each with different PPA characteristics and recommended use-cases, many from...

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