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 🌑 🇨🇭🇫🇷🇮🇱 EMEA 
🇩🇪 ---  ☀️ +

 Semi. Fabs and Clean Rooms
2¾h ago: TSMC Arizona Fab 21 ramping with strong yields on N4/N5 for Apple/AMD/NVIDIA; Phase 2 equipment install Q4 2026. Samsung Taylor 2nm sold out pre-ramp to Tesla/Broadcom/Arm. Terafab (Tesla/SpaceX/xAI + Intel) announced for 1TW AI chips/year. India reaches 5 operational units with Tata Dholera alliances (Fujifilm, L&T, Nexperia). Cleanroom firm Fabtech expanding order book.

 Opinion: Safer AI will require independent testbeds and incident reporting  - Small innovators in humanoids and physical AI should be exempted from many AI regulations.

 Valens Semiconductor to Collaborate with onsemi  - Valens Semiconductor, a provider of high-performance connectivity chipsets, today announced a collaboration with onsemi on a cost-optimized integrated sensor for high-volume 3-megapixel automotive camera applications. The post Valens Semiconductor to Collaborate with onsemi appeared first on Semiconductor...

 Steam Frame Teardown: We’re Fans. Except of the Fan  - Finally, finally, the Steam Frame is here! Five years ago, rumors of an internal Valve project codenamed Deckard rocked the VR enthusiast world. Since then, gamers have salivated over the…

 An Epyc trip to Venice: Everything we do and don't know about AMD's 256-core monster chip  - 16 channels of DDR5, 5 GHz clock speeds, and support for CXL 3.1 memory god boxes? What's not to like?

 Lee touts shipbuilding cooperation with Trump at New York investment event  - Lee touts shipbuilding cooperation with Trump at New York investment event President Lee Jae Myung told Wall Street investors that cooperation with U.S. President Donald Trump on naval shipbuilding could yield "tangible results." 9/23/2026 - 11:59 AM SARAH KIM

 EU Tech Push Boosts Ultrafast Laser Startups  - Data centers and commercial demand complement EU support

 Pacing problem: can AI fears overcome US-China race dynamics and force a slowdown?  - Despite US AI leaders’ warnings over the risks of rapid development, they remain locked in a high-stakes race against each other – and China

 Mental Health  - Four in ten 10 adults in countries like Australia, the U.S. and Canada reported that they had experienced mental health problems, such as stress, anxiety or depression in the 12 […] The post Mental Health appeared first on Electronics Weekly .

 台積電擴大OIP雲端聯盟 攜imec IC-Link降低先進晶片設計門檻  - 先進製程進入2奈米世代,晶片設計所需的運算資源、EDA工具與製程設計套件(PDK)複雜度同步攀升。比利時微電子研究中心imec旗下imec IC-Link 23 宣布,擴大與台積電合作,成為台積電開放創新平台(OIP)雲端聯盟最新成員,並將成為首批透過雲端管理方式提供晶片設計服務、支援多家EDA業者混合式設計流程的服務商之一,協助新創、研究機構及晶片設計業者降低切入先進製程門檻。...

 A JavaScript OS for the ESP32  - Given the incredible power of modern microcontrollers, we’ve seen quite a few attempts to turn them into more general purpose computers over the years. KryonOS from [Haris] is the latest, …read more

 BluGlass Notice of Meeting & Proxy – 2026  - Dear Shareholder Global semiconductor developer, BluGlass Limited (ASX: BLG) (Company) advises that its Annual General Meeting will be held on…

 Qorvo Achieves Key X-Band GaN Milestone in DARPA THREADS Program  - Qorvo® (Nasdaq: QRVO), a leading global provider of connectivity and power solutions, today announced it has achieved more than a 400%[CL1.1] increase in the RF power density at X-band on Gallium Nitride (GaN) transistor through a research and development work funded by the Defense Advanced Research...

 Tim Cook to get Robert Noyce Award  - Today, the SIA announced that Tim Cook has been selected as the 2026 recipient of the chip industry’s highest honour, the Robert N. Noyce Award. The SIA presents the Noyce […] The post Tim Cook to get Robert Noyce Award appeared first on Electronics Weekly .

 Comparison of TSMC CoWoS-S, CoWoS-R, and CoWoS-L  - Chip-on-Wafer-on-Substrate, commonly called CoWoS, is an advanced packaging platform developed by TSMC . It allows processors, chiplets, and high-bandwidth memory stacks to be integrated within a single package. CoWoS has become especially important for artificial-intelligence accelerators and high-performance...

 [News] Korea’s HBM-Related Exports to Malaysia Soar 5.7-Fold in One Year as AI Packaging Demand Rises  - The AI packaging boom is reshaping South Korea’s HBM export flows, with Malaysia taking on a growing role. According to Chosun Biz, South Korea’s HBM-related exports to Malaysia have surged 5.7-fold in just one year. Annual exports stood at only around KRW 130 billion four years ago, but have no......

 Why AI is forcing a rethink of power delivery  - Delivering enough power, quickly and consistently enough, to keep increasingly complex AI systems operating at peak performance, is a challenge, writes Takaki Murata. Some of the biggest constraints on future […] The post Why AI is forcing a rethink of power delivery appeared first on Electronics Weekly...

 [News] Intel Unveils Micro-LED-Based Glass Substrate Packaging Technology Patent  - Intel has recently disclosed a patent originally filed in 2022, revealing an IC packaging architecture that integrates Micro LEDs. The architecture features semiconductor dies embedded directly into a glass substrate, where Through-Glass-Via (TGV) within the substrate deliver power straight to th...

 Vacancy aggregation enhances NV- spin coherence in diamond: a cluster-correlation-expansion study of multi-vacancy spin baths in semiconductors  - Annealing a semiconductor makes its vacancies mobile; they aggregate into multi-vacancy complexes that often carry spin. Such centres are a magnetic-noise source for any spin qubit among them, in silicon and silicon carbide as well as in diamond, and they are accordingly blamed for NV- decoherence in...

 Can Agents Design Better Chips When Operating At A Higher Level Of Abstraction Using HLS (UCLA)  - Researchers at UCLA published a technical paper titled “Can Agents Design Better Chips with a Higher Level Abstraction?” Abstract Excerpt: “Large Language Model (LLM) agents are increasingly being explored for chip design, but most existing approaches operate directly at RTL. We ask whether agents...

 Coherent Showcases Optical Innovations to Scale AI Infrastructure at ECOC 2026  - Coherent showcases its latest optical innovations at ECOC 2026, spanning Scale-Up, Scale-Out, and Scale-Across connectivity to address the bandwidth, power, integration, and thermal challenges of next-generation AI infrastructure.

 AI Power Demands Push GaN into Data Center Design  - Rising AI power demands are pushing data center designers toward GaN-based power conversion for higher efficiency and density. The post AI Power Demands Push GaN into Data Center Design appeared first on EE Times .

 Brent’s Musings: This One Is for All the Marbles  - A childhood box of marbles reveals an unexpected family connection between century-old manufacturing innovation and a lifelong career in semiconductors.

 머스크 '테라팹', 상표권 분쟁... 美 테라프린트 "우리가 먼저"  - 일론 머스크가 미국 내 AI 반도체 대량 생산을 위해 추진하는 대형 프로젝트, '테라팹(TeraFab)'이 예기치 못한 장애물을 만났다. 전력 공급도, 반도체 생산 기술도, 건...

 Apple A20 Pro: The iPhone 18 Pro's TSMC 2nm Processor  - TechInsights performed an exploratory teardown and analysis of the Apple A20 Pro processor extracted from Apple’s newly released iPhone 18 Pro. The Apple A20 Pro application processor is fabricated using TSMC's N2 process—the first 2 nm process from TSMC featuring gate-all-around transistor technology....

 Korea ranks second from bottom of OECD for income redistribution  - Korea ranks second from bottom of OECD for income redistribution The country’s Gini coefficient, measuring income inequality, improved by 17.6 percent, about half the average of member states. 9/19/2026 - 11:20 PM

 Bi-Weekly Portfolio update & Weekly Retrospective #4  - Welcome to my portfolio review &retro section.

 Tech The Money: Nvidia is the Most Pilled of the AI-Pilled  - It's not even close. And that surprised me.

 🌘 Americas 
🇺🇸  ---  🌑

7d Micron Technolo…

 Technical Report: Nordic nRF54LM20B Multiprotocol BT 6.0 LE SoC w/ Integrated NPU Floorplan Analysis  - This report presents a Basic Floorplan Analysis of the Nordic Semiconductor nRF54LM20B die found inside the Nordic Semiconductor nRF54LM20B system-on-chip (SoC) component.

 Thoughts return to forbidden RAM upgrades as Raspberry Pi OS gets fresh lick of paint  - New dock and app launcher arrive while soaring memory prices revive scrutiny of a two-year-old firmware restriction

 Embedded AI takes centre stage at EWNA 2026  - Elektor is reporting from embedded world North America 2026 in Anaheim, California, where companies are demonstrating technologies spanning FPGA-based edge…

 Lee urges Wall Street to invest in South Korea, touts US–Korea industrial push  - The president said, “I propose that you join the path of a major leap forward in advanced industries that Korea will lead,” adding, “We will expand semiconductor production bases to double memory production

 Tiny OLED pixels can be manufactured like microchips using chemical-resistant polymers  - Screens are becoming smaller and sharper. This can be seen, for example, in augmented reality glasses and the electronic viewfinders of cameras, some of which have a screen diagonal of less than 1 centimeter (0.4 inches).

 China’s storage makers aim to climb value chain with advanced packaging bets  - Biwin Storage Technology invests US$672 million in latest example of a storage firm looking to upgrade its business model

 The Brightest Star of the Constellation  - Is Samsung Electronics Heading for a Break-up?\ \\

 Lawrence Semiconductor Appoints General Manager, COO: People in the News: 9/23/26  - Open Light, a photonic chip designer and manufacturer, appointed Kevin Soukup as COO and Kirk Ouellette as chief strategy officer and interim chief revenue officer. Soukup most recently served as senior vice president and general manager at GlobalFoundries. Before that, Soukup held executive roles across...

 Samsung LPDDR6 validated by Qualcomm for next-gen Snapdragon platform  - AI workloads are pushing cloud, edge, and mobile devices toward tighter power budgets and heavier data traffic, making memory efficiency a growing global issue. Samsung is positioning its new LPDDR6 as a response, with higher bandwidth, lower power use, and improved reliability for next-generation on-device...

 Qualcomm and Google eye Agentic AI, expand partnership to GoogleBook, automotives

 Biwin Storage commits US$672M to double down on 2.5D packaging, compute-memory integration

 LG Electronics, Microsoft enter partnership on AI data centers, physical AI

 With Xi's Washington visit incoming, trade data show how the tariff war has reshaped US-China tech flows

 YMTC wins German injunctions against Micron in latest round of NAND patent battle

 Engineering over panic: Jensen Huang's pragmatic vision for the future of AI

 US, China diverge on AI guardrails ahead of Trump-Xi summit

 SKC raises Absolics stake to 82% as glass substrates remain in testing

 CME Group's GPU futures debut stalls as CFTC flags concerns

 Meta's Muse gains users as human support raises privacy questions

 Qualcomm launches dual Snapdragon flagship platforms for Xiaomi, Honor

 Nexperia China turns 12-inch wafers into the backbone of its chip supply-chain reset

 Acer defends Europe's biggest PC market with top-two gaming rank in Germany

 Nvidia's 800V power shift hands Taiwan's capacitor makers a new AI segment

 GLT pivots into life sciences with US-patented precast gels

 DeepSeek, Moonshot, the hidden cost of routing China's AI through Claude

 Hygon takes China's CPU ambitions beyond servers and into physical AI

 Gigabyte's Giga Computing sets up AI factory in Taiwan to accelerate rack validation

 Hermes-Epitek eyes CPO test revenue in 2027

 ZDT prices US$800M ECB to expand AI server PCB push

 Taiwan uses AI to close drone thermal imaging gap

 Europe industrial controls rebound lifts Higgstec's 1H26 growth

 ASRock's center of gravity moves from motherboards to AI servers

 Anthropic and OpenAI both cut frontier model prices, ten days after calling for a slowdown

 Acbel targets Europe's fast-charging market with new high-power DC modules

 Malaysia reviews data centre benefits after 40-plus 2026 applications

 Taiwan courts Indian IIT chief in bid to boost chip talent ties

 Taiwan's August export orders top US$100 billion as overseas production edges up

 Trump rejects global AI controls, urges US to press ahead with "superintelligence"

 MediaTek, Qualcomm target Googlebook with Arm push

 Commentary: Zhengfei Ren rumors expose a deeper chill across China's tech sector

 Einride builds its next autonomous truck on Nvidia Hyperion as the gap between fleet, driverless fleet stays wide

 India's Dixon looks beyond smartphones to crack global EMS top 10

 Building A Connected, Contextual Data Backbone For AI-Driven Semiconductor Design  - Why design teams must organize before they optimize and how to utilize a purpose-built foundation for AI-ready data management across the chip design lifecycle. The post Building A Connected, Contextual Data Backbone For AI-Driven Semiconductor Design appeared first on Semiconductor Engineering .

 [Insights] Memory Spot Price Update: DRAM Spot Prices Hold Cautious Tone; DDR4 2Gx8 Drops 3.6%  - According to TrendForce’s latest memory spot price trend report, DRAM spot buying remained cautious this week, with prices diverging by product. DDR4 2Gx8 branded chip prices continued to correct without attracting clear buying interest, while DDR5 price trends varied by specification. In NAND, we......

 Autonomous Quantum Transport Measurements of 2D Semiconductors by an AI Agent  - Artificial-intelligence (AI) agents are beginning to enter experimental laboratories, automating experiments and accelerating scientific discovery. Herein, we introduce an AI-driven workflow in which an AI agent performs multi-step, multi-day quantum transport measurements end-to-end. Specifically, given...

 ASM Launches Breakthrough Flowable Carbon Technology for the Next Era of Semiconductor Scaling  - ASM, a materials discovery company and global leader in semiconductor wafer processing equipment, building on its leadership in atomic layer deposition and epitaxy, launches its XP8 Vertos Flowable Carbon, the market's first plasma-enhanced chemical vapor deposition (PECVD) flowable carbon film. The post...

 Apple A20 Pro: Inside the iPhone 18 Pro’s TSMC 2nm Processor  - TechInsights analyzes Apple’s A20 Pro processor, revealing TSMC N2 gate-all-around technology, expanded AI and graphics processing, and a new side-by-side memory packaging architecture.

 Chip Industry Technical Paper Roundup: Sept. 22  - AI thermal modeling for 2.5D/3D ICs; chiplet and AI accelerator co-design; BEOL thermal conductivity; agentic DRC repair; RL for dense-layout routing; LLM orchestration for digital EDA; chiplet interconnects for neuromorphic computing. The post Chip Industry Technical Paper Roundup: Sept. 22 appeared...

 Beyond Capacity Expansion: TSMC Builds an Advanced Packaging Validation Hub in Kaohsiung  - Original Article By SemiVision Research [Reading time: 7 mins]

 Canadian Startup Sees Success in Space Qualification  - Novigrad is forging a pathway for faster, more accessible radiation testing as a growing wave of space missions drives demand for reliable, resilient electronics. The post Canadian Startup Sees Success in Space Qualification appeared first on EE Times .

 Frequency division by any number, with a 50% duty cycle output  - Using the concept and leveraging the example circuits in this Design Idea, you can divide any frequency by any number divisible by 2. The post Frequency division by any number, with a 50% duty cycle output appeared first on EDN .

 Strong Performance You Can Feel: New E-Bike Drive Systems Impress at Bike Festa Brixen  - The magnesium motor with 120 Nm and the aluminum version with 110 Nm deliver powerful assistance, dynamic acceleration, and outstanding riding comfort.

 DRAM Module Revenue Surges 59% YoY in 2025 as Crowding-Out Effect Constrains Chip Supply and Drives Prices Higher, Says TrendForce  - According to TrendForce statistics, the global DRAM module market generated $21.2 billion in revenue in 2025, up a strong 59% YoY. Rising prices and concentrated shipments from DRAM module makers in the second half of the year helped drive growth. This marked a significant acceleration from the 7% growth...

 How AI Is Accelerating PCB Design and Prototyping  - AI tools compress PCB design timelines from months to hours, enabling faster iteration cycles and letting engineers focus on innovation. The post How AI Is Accelerating PCB Design and Prototyping appeared first on EE Times .

 TechNexion Expands Edge AI Vision Solutions with the Ara240 Discrete Neural Processing Unit  - TechNexion’s TELOS-AI4000, powered by NXP Ara240 DNPU, enables scalable edge AI vision for real-time industrial applications.

 ECOC 2026: Important Product Announcements Around Optical Scale-Up  - Teradyne, ams OSRAM, Lumentum. Qualcomm. Coherent.

 Insight: OMNIVISION's OAX7700 Tackles EV Sentry Mode's Power Drain—and Sets Up an ICE Opportunity  - OMNIVISION's OAX7700 promises to cut the power cost of always-on vehicle security features such as Tesla's Sentry Mode by moving detection to a low-power companion chip at the network edge, letting a vehicle's central compute stay asleep until a genuine event triggers it. In this Insight, TechInsights...

 Computation and Data Movement for Inference  - Mapping MoE models onto inference hardware: structure, flow, and efficient serving…

 The Lifelines of Power: Sea, Oil, Space  - Original Article By SemiVision Research [Reading time: 11mins]

 China’s DRAM Specialist CXMT Eyes NAND Flash Entry  - China’s twin memory stars, CXMT and YMTC, move into each other’s turf to capitalize on AI-driven storage shortages. The post China’s DRAM Specialist CXMT Eyes NAND Flash Entry appeared first on EE Times .

 Anthropic’s AI Slowdown, OpenAI’s $1.2T Valuation & Salesforce’s AI Bet  - Anthropic's "Pace the Frontier" essay set off a week in which nearly every major AI leader, and two heads of state, weighed in on whether the frontier should slow down. Patrick Moorhead and Daniel Newman read the incident as something larger than a safety debate. Whoever sets the pace of the frontier...

 Qualcomm’s Adreno X2 GPU ...  - Integrated GPUs have become a crucial component in recent laptop chips, thanks to a push for better graphics performance in ultraportable devices. ...

 Magnachip Announces Strategic Investment by Navitas Semiconductor  - Magnachip Semiconductor Corporation, a designer and manufacturer of analog and mixed-signal power semiconductor platform solutions, today announced that Navitas Semiconductor Corporation has agreed to make a $5 million strategic equity investment in Magnachip. The post Magnachip Announces Strategic Investment...

 Chip rebound deepens Korea’s trade dependence  - Chip rebound deepens Korea’s trade dependence Korea’s trade exposure rose in 2024 as a strong semiconductor recovery boosted exports and reshaped industrial transactions, Bank of Korea data showed. 9/21/2026 - 01:29 AM

 [Market Memo] Calm Before the IPO Storm  - Pirates don’t agree to truces.

 Inside the Tiny Unfixable Eye: iPhone 18 Pro and Pro Max Teardown  - The iPhone 18 Pro’s little mechanical pupil is irresistible. A bunch of moving parts make for a good excuse to put our brand new camera under the microscope. We weren’t…

 🌑 🇹🇼🇰🇷🇨🇳 AsiaPac 
🇦🇺 ---  ☀️ +

 Reference design cuts complexity in USB-C adapters  - Eggtronic has announced a 140-W USB-C Power Delivery (PD) 3.1 AC/DC reference design for notebook adapters and other USB-C powered devices. The post Reference design cuts complexity in USB-C adapters appeared first on EDN .

 陸廠擴產 難解記憶體荒  - 陸系兩大記憶體廠全面擴產,長鑫存儲(CXMT)DRAM 產能預計由目前約32萬片,一路拉升至2027 的42萬片;長江存儲(YMTC)武漢第三廠在2026 底啟動、2027 逐步爬坡,成為市場供給最大變數。 不過,法人認為,陸廠新增產能仍難扭轉全球供不應求格局,主因AI帶動的存儲市場需求過於龐大。...

 SEMICON West’s “Bridging design and Manufacturing with AI” Design Session Explores AI as Practical Lever Across Entire Lifecycle  - 2026 is “Bridging Design and Manufacturing with AI” during a day-long session Tuesday, October 13, from 10:30 a.m. to 4:30 p.m. at San Francisco’s Moscone Center, North Hall, Lower Level, Room 20.

 Europe's fastest supercomputer is finally getting its domestic silicon infusion  - Bull, the system builder behind JUPITER, takes delivery of SiPearl's long-awaited Rhea1 CPUs

 China Sets Four Red Lines: Taiwan, Rights, System, Development  - Amid U.S. tightening of AI and semiconductor restrictions, Beijing appears to prioritize protecting its frontline AI talent over showcasing them on the diplomatic stage.

 SOSA-aligned TVPX210 3U OpenVPX carrier board offers modular I/O  - Tews Iechnologies has announced its TVPX210, a 3U OpenVPX carrier board aligning with the SOSA technical standard. It’s for system designers to integrate high-performance modular I/O into next-generation defence and […] The post SOSA-aligned TVPX210 3U OpenVPX carrier board offers modular I/O appeared...

 With PEN nearing end-of-life, capacitors built on it must change  - Capacitor manufacturers face a choice between dropping in a lookalike or rebuilding capacitor around what modern systems now demand. The post With PEN nearing end-of-life, capacitors built on it must change appeared first on EDN .

 SEMICON INDIA 2026: India Starts Packaging Chips as Ecosystem Takes Shape  - India moves five chip packaging plants into production as $13.5 billion ISM 2.0 expands manufacturing, design, and engineering capabilities. The post SEMICON INDIA 2026: India Starts Packaging Chips as Ecosystem Takes Shape appeared first on EE Times .

 IC-Link joins TSMC cloud alliance for advanced-node chip design  - Imec’s (P)IC design and manufacturing service, IC-Link, has expanded its collaboration with TSMC to give chip developers easier access to advanced-node design infrastructure.

 Kospi climbs 1.21% as rally continues before Chuseok break  - Kospi climbs 1.21% as rally continues before Chuseok break The main bourse gained 63.01 points to close at 7,080.92 on a day of light trading as investors took a breather. 9/23/2026 - 03:42 AM

 Chip Turf War in China  - A Chinese semiconductor industry Turf War is brewing as DRAM specialist CXMT looks to get into NAND – the province of Yangtze Memory (YMTC) – while YMTC is making moves […] The post Chip Turf War in China appeared first on Electronics Weekly .

 From RAIN to AI data downpour, Impinj focuses on Physical Intelligence  - Long-time RFID leader Impinj created a new company logo and platform around Physical Intelligence to stress the link between billions of physical items and AI.

 China’s AI self-reliance presents opportunities but valuations, geopolitics are risks: BofA  - The nation’s tech firms are catching up with overseas rivals while a wave of high-profile listings has broadened investment opportunities

 AI雙引擎點火 嘉晶營運加速  - 嘉晶(3016)董事長徐建華表示,AI伺服器帶動電源管理與高速光通訊需求同步升溫,該公司鎖定AI Power與AI Optical Connectivity兩大成長引擎,8吋矽磊晶產能已滿載,鍺矽(Ge/Si)光偵測器(PD)磊晶也供不應求。 嘉晶22 舉行法說會,該公司預估,2026...

 Beyond the Accelerator: Why Silicon Challengers Must Transition to Full-System Infrastructure  - The recent AI Infra Summit was exceptionally jam-packed, filled to the brim with compelling talks, overlapping tracks, and emerging technologies. Amid the noise of the event, there were many excellent presentations detailing the physical realities of scaling hardware. But one presentation in particular...

 Designing Multi-kW Power Delivery In 3D Heterogeneously Integrated Systems (U. of Minnesota)  - Researchers at the University of Minnesota published a technical paper titled “Toward Multi-kW Power Delivery Methodologies for Advanced 3D Heterogeneous Integration.” Abstract Excerpt: “Computationally powerful systems require significant power for computation: reliable and robust power delivery...

 Wave Plates Substantially Improve Ability to Filter Strong Light  - Although tiny manufacturing imperfections in optical components typically go unnoticed during standard use, they can alter light in significant ways. Miniscule optical imperfections not only affect light polarization — they can also alter the spatial shape of a light beam. In a study led by Technische...

 This week’s outside five sigma (#117)  - Intel 4 Interconnect Cross Section and Metal Selection

 Smart Photonics and Globalfoundries launch joint photonics foundry service  - Eindhoven-based Smart Photonics and Globalfoundries have launched an integrated-photonics foundry service that combines both their material platforms.

 Kospi extend gains as AI optimism lifts chip shares  - Kospi extend gains as AI optimism lifts chip shares The Kospi rose for a third session as Samsung Electronics advanced on renewed AI enthusiasm, while the won strengthened against the dollar. 9/22/2026 - 05:13 AM

 Alibaba touts 'most powerful AI chip in China' for data center buildout  - Conglomerate targets 20 GW of capacity by 2032 as tech safety debate unfolds

 Korea picks Texas gas plant as first project in $200 billion U.S. investment package  - Korea picks Texas gas plant as first project in $200 billion U.S. investment package A $22.3 billion Texas gas power plant is the first project in Korea's $200 billion U.S. investment package, while nuclear reactor and Alaska LNG plans remain under review. 9/21/2026 - 11:01 PM SARAH CHEA

 UK’s SARAH helping US Mercury space effort  - BRITISH electronic equipment is playing a vital part in America’s man – in – space programme, project Mercury. So, 65 years ago, started a story in Electronics Weekly’s edition of […] The post UK’s SARAH helping US Mercury space effort appeared first on Electronics Weekly .

 Perpetual underdog AMD nips at Nvidia's heels as it joins the $1T club  - Fueled by the AI boom, the House of Zen's rise isn't just Instinct - Lisa Su is riding high on some Epyc design chops too

 Coherent Launches PhotonLink™ Integrated Optics Platform for AI Infrastructu  - Coherent launches PhotonLink™, an integrated optics platform that combines critical photonics technologies with end-to-end assembly, test, and manufacturing capabilities to deliver complete optical solutions for next-generation AI infrastructure.

 MEMS Sensor Developer sensiBel to Adopt X-Celeprint’s Micro-Transfer Printing Process  - senisiBel, a developer of optical MEMS sensing technology, has established a strategic manufacturing partnership with X-Celeprint, a provider of micro-transfer printing (MTP) industrial solutions. Through this partnership, sensiBel will use MTP to...

 [News] TSMC Plans Mini-Loop at Kaohsiung to Speed CoWoS Tool Validation; Reportedly Eyes AUO Site for CoPoS  - As AI demand drives growth in advanced packaging, TSMC is strengthening equipment and materials validation across its supply chain. According to Commercial Times, construction of Kaohsiung’s Baipu Industrial Park began on September 21, with TSMC expected to anchor the cluster. The company plans to......

 Exports up 78% in first 20 days of September on robust chip shipments  - Exports up 78% in first 20 days of September on robust chip shipments Korea's exports surged 78 percent in the first 20 days of September, led by a 259 percent jump in semiconductor shipments. 9/20/2026 - 09:58 PM

 How 60 GHz Radar Improves Low-Power Presence Sensing In IoT Devices  - Track occupancy and motion continuously without keeping the full sensing and processing chain active. The post How 60 GHz Radar Improves Low-Power Presence Sensing In IoT Devices appeared first on Semiconductor Engineering .

 Conversation with Ayar Labs CEO Mark Wade on Silicon Photonics, Co-Packaged Optics, and Next-Gen AI Infrastructure  - In this episode of The Circuit, hosts Ben Bajarin n and Jay Goldberg speak with Mark Wade, CEO of IR Labs, and Jesse Leiter, VP of Capital Strategy and Investor Relations. The conversation focuses on the necessity of solving the interconnect bottleneck in large-scale AI data centers by transitioning to...