Foxconn and TSMC advanced packaging spur V5 to consider France, US sites - High-end semiconductor inspection equipment leader V5 Technologies has steadily entered the supply chains of foundry and testing giants in recent years. Chairman Quincy Lin said amid a semiconductor expansion wave, V5 expects double-digit revenue growth in 2026 with gross margins holding steady from 2025....
Denso bids for Rohm - Denso, the Japanese auto parts supplier, has made an offer to buy Rohm for around $8.2bn, reported the Nikkei. “We are considering various strategic options including the acquisition of Rohm shares,” said Denso earlier today, adding that it will “promptly disclose any material facts that are decided...
Ceva integrates modem IP for satellite and terrestrial terminals - Launched at MWC in Barcelona, the PentaG-NTN is a 5G-NTN (non-terrestrial network) modem IP subsystem for satellite user terminals supporting LEO and MEO constellations. It enables satellite operators, constellation and terminal developers to accelerate 5G-NTN services using the third-generation PentaG,...
Chip Industry Week In Review - AI integrity attacks; US weighs more AI chip authority; on-chip security controls; new chips at MWC; optical interconnect deals; CPO funding; 18A; diary of advanced lithographer; domain-scoped agentic AI; HBM4; automotive chips; BYD's 9-minute EV charge. The post Chip Industry Week In Review appeared...
Arm and Linaro launch CoreCollective consortium - Arm and Linaro have launched CoreCollective, a new, free-to-join industry consortium intended to reduce duplicated engineering effort and help standardise…
Syntiant to Showcase Always-On AI Voice Solutions at Embedded World 2026 with Seltech - Syntiant, a leading provider of full-stack, low-power embodied AI solutions from sensors to software, today announced it will have a presence at embedded world 2026 (March 10–12) in Nuremberg, Germany in collaboration with its global sales representative, Seltech.
Apple’s spring 2026 soirée: The rest of the story - With smartphone and tablet news already discussed, what else did Apple unveil this week? Read on for all the goodies and their details. The post Apple’s spring 2026 soirée: The rest of the story appeared first on EDN .
MediaTek at Embedded World 2026: Edge Intelligence, Built for Scale - Author: Sameer Sharma, AVP of MediaTek's Internet of Things Business (Americas & Europe) Embedded World 2026 is just around the corner, providing a glimpse into the next wave of embedded innovation. Across the industry, we’re seeing a shift toward more intelligent, connected systems where AI is...
Counting the cost of war on Iran - The Iran War is hitting the electronics industry, writes Paul Dempsey in Washington DC. Analyst IDC says that if it lasts only a few weeks, it will have a “modest” impact, although inflation across key areas is already visible. But if the conflict drags on, it could worsen component crunches and reignite...
MiniMed to begin trading on Nasdaq Global Select Market - Medtronic plc (NYSE: MDT), a global leader in healthcare technology, announced that MiniMed Group, Inc. (Nasdaq: MMED) will begin trading today on the Nasdaq Global Select Market (Nasdaq) under...
AP Memory expands S-SiCap capacity as chipmakers shift toward custom memory - AP Memory expects growth momentum to extend into 2026, with revenue visibility already exceeding the typical six-month outlook seen in previous years. Tight supply in the global memory market has prompted customers to secure supply earlier than usual. Although rising memory wafer costs may pressure margins,...
MiniMed announces pricing of initial public offering - MiniMed Group, Inc. (MiniMed), a subsidiary of Medtronic plc (Medtronic) (NYSE: MDT), today announced the pricing of its initial public offering (IPO) of 28,000,000 shares of its common stock at a...
MediaTek keynote presentation: AI for Life, from Edge to Cloud at MWC 2026 - At MWC 2026, MediaTek President Joe Chen opened our keynote by sharing our vision for AI for Life, from Edge to Cloud, reinforcing our belief that technology improves lives and that innovation must translate into meaningful everyday experiences.🌍
Space-Comms Expo: UK gov promises £500m for national space programmes - The UK government will allocate £500 million to national space programmes to back high-growth technologies, it says. The investment is to help British companies scale and compete on the international stage. The announcement was made at the two-day Space-Comms Expo event in London, by the UK’s Space...
Memory spot prices surge, straining procurement capital and risking industry cycle instability - The global memory market faces a widening supply-demand gap as manufacturers wield strong pricing power and limit spot-market supply, driving rapid spot-price increases that intensify procurement capital pressures across the supply chain. Industry observers warn that if spot prices continue their rapid...
10-Year Roadmap for AI + Hardware (UIUC, UCLA, Stanford et al.) - Researchers from University of Illinois Urbana-Champaign, UCLA, Stanford University, Nvidia, Google, et al. have released “AI+HW 2035: Shaping the Next Decade”. Abstract “Artificial intelligence (AI) and hardware (HW) are advancing at unprecedented rates, yet their trajectories have become inseparably...
Risk assessment in the workplace - The Chief Engineer from a company Dunn contracted for dishonestly presents fake power supply test results as if they were real. The post Risk assessment in the workplace appeared first on EDN .
Experience Innovation at Embedded World 2026 - The automotive industry has shifted its focus from traditional performance metrics to prioritizing safety and comfort. As vehicles evolve into software-defined environments, the interior cabin is emerging as a sanctuary—offering enhanced safety, superior comfort, and immersive high-fidelity entertainment...
Last-level cache has become a critical SoC design element - LLC, positioned between external memory and internal subsystems, stores frequently accessed data close to compute resources. The post Last-level cache has become a critical SoC design element appeared first on EDN .
Building a Heading Sensor Resistant To Magnetic Disturbances - Light aircraft often use a heading indicator as a way to know where they’re going. Retired instrumentation engineer [Don Welch] recreated a heading indicator of his own, using cheap off-the-shelf …read more
[News] Industry Weigh 825–900 μm HBM Thickness for 20-High Stacks, Potentially Slowing Hybrid Bonding - Major semiconductor companies are reportedly considering easing thickness standards for next-generation HBM, as future generations such as HBM4E and HBM5 are expected to adopt 20-layer stacking. According to ZDNet, while the current HBM4 thickness standard is 775 micrometers (μm), industry discussi......
Tesla to reportedly double AI6 chip orders, boosting Samsung Texas plant utilization - The semiconductor industry had widely expected Samsung's Taylor fab to begin large-scale production before the end of 2026. However, the latest industry information obtained by The JoongAng suggests there may be discrepancies between expectations and the actual situation, prompting renewed attention to...
Passive limiter shields electronics from RF threats - Teledyne Microwave UK’s B3LT98026 wideband limiter protects sensitive receiver front ends in defense and military communication systems. The post Passive limiter shields electronics from RF threats appeared first on EDN .
Webinar | Lithium-ion Batteries: Growing Demand, Falling Prices - Join IDTechEx Technology Analyst Daniel Parr on Thursday 12th March for the expert-led webinar, "Lithium-ion Batteries: Growing Demand, Falling Prices". Choose your preferred time zone - the webinar runs three times in one day.