Semi. Fabs and Clean Rooms 8¼h ago: Recent X posts highlight ongoing semiconductor fab activity with China's Vital Technology Group bringing its Wuhan compound semiconductor fab online, Tata's Dholera fab entering cleanroom fit-out phase targeting December 2026 trial production, and Tesla/SpaceX Terafab in early construction in Texas. Construction challenges like vibration criteria and cleanroom MEP complexity remain critical, while India's push for 28nm CMOS capacity continues amid US reshoring timelines. Yield discussions focus on contamination control and emerging 2D semiconductor processes.
Teradyne Unveils Magnum E2 for the Next Wave of AI Memory - Teradyne has announced Magnum E2, a memory test system designed to address the increasingly demanding interfaces used in artificial intelligence and high performance computing. The platform targets advanced DRAM and flash technologies, including LPDDR6, DDR6, GDDR7, and NAND flash, while combining engineering...
CTO Talk: Denis Zelenin of Pacific MicroCHIP - In 2026, Pacific MicroCHIP marks 20 years of ASIC design services and turnkey solutions. We spoke with CTO Denis Zelenin about that journey, the company’s growing range of products—from a 56 GS/s ADC to RF spectrometers—and what customers increasingly expect from custom silicon. Tell me a bit about...
China’s chip challenge demands a rethink of Korea’s economic policies - China’s chip challenge demands a rethink of Korea’s economic policies CXMT’s next-generation memory push and a sharp Kospi sell-off expose risks to Korea’s semiconductor-led economic outlook. 10/13/2026 - 11:01 AM Opinion Desk
COMSOL Conference 2026 Centers Users, New Features - COMSOL is in the midst of its end of year series of conferences, having just wrapped up the COMSOL Conference 2026 in Boston. That show was preceded by one in Cambridge, England, and will be followed by conferences in Tokyo; Shenzhen, China; Taipei,...
ENGEL unveils automotive connector production cell at Fakuma - ENGEL is showcasing an integrated injection molding production cell for automotive connectors at Fakuma 2026, combining its all-electric WINTEC e-win 1800 machine with the new viper 6 robot.
The next phase of AI growth starts with infrastructure - Artificial Intelligence The next phase of AI growth starts with infrastructure AI growth is testing power, materials and infrastructure. Smarter storage can help improve efficiency and maximize existing compute.
Aratas America Launches as Independent Company - Aratas America LLC, a manufacturer and provider of advanced electronic technologies, launched as an independent company following the transfer of shares held by OMRON Corporation to The Carlyle Group. The company, formerly OMRON Electronic...
Chip Industry Technical Paper Roundup: Oct. 13 - M3D mem-TFT neuromorphic computing; 2D semiconductor nucleation; ultrathin high-κ dielectrics; hyper-NA EUV litho; bit-flip attack detection in AI accelerators; programmable DRAM controllers; foundry-compatible photonic bends. The post Chip Industry Technical Paper Roundup: Oct. 13 appeared first on...
SEMI and Semiconductor Digest Announce 2026 Best of West Award Finalists - The Best of West Award winner will be announced at SEMICON West 2026 on Thursday, October 15, on the Smart Theater stage located inside the North Expo Hall, Lower Level Hall F. The post SEMI and Semiconductor Digest Announce 2026 Best of West Award Finalists appeared first on Semiconductor Digest .
Applied Materials Bets $5B on a New Model for Chip Innovation - Applied Materials’ $5 billion EPIC Center brings chipmakers, equipment suppliers, and researchers together to accelerate semiconductor R&D and commercialization. The post Applied Materials Bets $5B on a New Model for Chip Innovation appeared first on EE Times .
Chips&Media targets AI memory bottlenecks with new compression IP - Chips&Media has announced a data compression technology aimed at one of the constraints in artificial intelligence hardware: moving data fast enough to keep processors busy. The South Korean semiconductor intellectual property supplier says its new Feature Map Compression IP marks an expansion beyond...
The secret life of ferrite bead: More than just a lump on a wire - A ferrite bead isn’t just a mysterious black cylinder; it can be an engineer's secret weapon for turning pesky high-frequency noise into harmless heat. The post The secret life of ferrite bead: More than just a lump on a wire appeared first on EDN .
Korea likely to continue solid growth driven by robust chip exports - Korea likely to continue solid growth driven by robust chip exports The Bank of Korea raised its growth forecasts as robust semiconductor exports boost incomes and broader domestic demand. 10/11/2026 - 11:06 PM
Startup Funding: Q3 2026 - 80 startups raised $8.5B in Q3, with big hauls by companies tackling data movement and memory. The post Startup Funding: Q3 2026 appeared first on Semiconductor Engineering .
Lee Jae Myung was favored by fate. Why fear life after office? - Lee Jae Myung was favored by fate. Why fear life after office? President Lee should abandon efforts to withdraw charges and govern as a leader who unites Korea. 10/11/2026 - 11:01 AM Opinion Desk
Interview with Eric Hong, VP of Engineering at Mixel, a Silvaco Company - Eric Hong is Vice President of Engineering at Mixel, a Silvaco company, where he leads the development of analog and mixed-signal IP, including high-speed PHY and SerDes solutions. Prior to Mixel, he held engineering leadership and technical roles at Nvidia, eSilicon, Samsung Electro-Mechanics, and Intel,...
Test Pilot Shatters Sound Barrier Despite Broken Ribs - With electricity demand expected to surge due to AI data centers and semiconductor factories, four nuclear reactors that have reached the end of their design lifespan have been blocked twice consecutively
CASPA CEO Summit Preview with President Jimmy Cheng - CASPA’s annual conference celebrates its 35th anniversary with a lineup of more than 35 CEOs from Silicon Valley, including Intel’s Lip-Bu Tan and Cerebras’s Andrew Feldman. The post CASPA CEO Summit Preview with President Jimmy Cheng appeared first on EE Times .
Seagate Named One of America’s Greenest Companies 2027 - Seagate Named One of America’s Greenest Companies 2027 For the second consecutive year, Seagate Technology has been recognized as one of America's Greenest Companies by Newsweek, in partnership with Plant-A Insights Group and sustainability data provider GIST Impact.
Cybersecurity through the attacker’s eyes - As cyberattacks become more sophisticated in the AI era, organizations must rethink security from an attacker’s perspective. Drawing on insights from Red Team testing, this article explores how to visualize risks and improve organizational resilience.
Polar Collaborates with IC-Link by imec to Manufacture 8-inch GaN Technology - BLOOMINGTON, Minn., USA and Leuven, Belgium, October 12, 2026 – Polar Semiconductor, LLC (“Polar”), a U.S.-owned and operated foundry specializing in high-voltage, power, and sensor technologies, and IC-Link by imec, imec’s design and manufacturing service, today…
Unpacking Marvell's Analyst Day, OpenAI Revenue Rumors, and the Heterogeneous Rack - In this episode of The Circuit, Ben Bajarin and Jay Goldberg kick off a packed conference week (Semicon West, Applied Materials' EPIC Center launch, and the sold-out OCP Summit) before diving into Marvell's upbeat Analyst Day in New York. They examine how Marvell has shifted its narrative beyond Amazon...
Apple Fold A Long Time Coming - Back in 1985 Apple patented this design for a folding phone: The hinge was located at the “bite” mark that opened sideways to reveal an earpiece and physical keypad. It […] The post Apple Fold A Long Time Coming appeared first on Electronics Weekly .
Security Becomes a Sign-off Item - Europe’s CRA turns chip security into auditable sign-off, pushing silicon teams to prove resilience before 2027. The post Security Becomes a Sign-off Item appeared first on EE Times .
AMD Unveils CPU-Centric Helion AI Rack for Agentic AI - AMD announced on Oct. 12 at the Open Compute Project (OCP) Global Summit in San Jose, California, that it has unveiled Helion, a computing infrastructure design for artificial intelligence (AI) data centers built around central processing units (CPUs).Unlike its existing Helios platform, which comb...
Engineering salaries deepen Taiwan's doctoral talent shortage - Taiwan's semiconductor and information and communications technology industries are drawing engineering graduates into high-paying jobs, intensifying a shortage of doctoral students and raising concerns about the country's basic research capacity. National Taiwan University (NTU) leadership and Taiwan's...
10 years of TME Education – a decade of supporting technical education - Learn more about TME Education – an educational project based on practical learning and collaboration with local communities. The post 10 years of TME Education – a decade of supporting technical education appeared first on Electronics Weekly .
Greenconn targets EV charging with high-speed connectors - Greenconn has introduced its GBED204 series of 1.27 mm pitch high-speed board-to-board connectors for electric vehicle (EV) charging systems and automotive electronic modules. The right-angle connectors combine a…
Measure the AC mains frequency with an ordinary counter - Knowing the mains frequency is important in many industries; the speeds of AC motors, for example, are dependent on it. The post Measure the AC mains frequency with an ordinary counter appeared first on EDN .
Samsung, AMD showcase CXL memory sharing for AI servers at OCP Summit - Samsung, AMD showcase CXL memory sharing for AI servers at OCP Summit Samsung Electronics and AMD demonstrated CXL technology that lets AI servers share pooled memory, improving capacity and performance for AI inference workloads at the OCP Global Summit. 10/13/2026 - 02:25 AM LEE JAE-LIM
HV hot-swap controller for digital power-path protection - Infineon has introduced the XDP8HD40S-1, a high-voltage hot-swap controller designed for digital power-path protection and monitoring in next-generation AI server power architectures operating at ±400 Volt and 800 VDC. As […] The post HV hot-swap controller for digital power-path protection appeared...
SK Hynix unveils low-power processor design for SSDs - SK Hynix has unveiled a new processor architecture designed to reduce power consumption and chip area in solid-state drive (SSD) controllers, expanding its efforts to address storage bottlenecks as AI data centers demand faster and more efficient access to data.
AI silicon tapeout: Can it beat a benchmark engineers trust? - Can the engineering data prove the improvement in silicon design rather than relying on one successful run or thousands of tool logs? The post AI silicon tapeout: Can it beat a benchmark engineers trust? appeared first on EDN .
On-Chip Monitors Detect Bit-Flip Attacks in AI Accelerators (UF, UT Dallas, RPI) - Researchers at the University of Florida, University of Texas at Dallas, and Rensselaer Polytechnic Institute published a technical paper titled “BARE-AI: Bit-Flip Attack Resilience in AI Hardware through Built-in Performance Monitors.” Abstract Excerpt: “Deep Neural Networks (DNNs) are integral...
Exclusive: Over 3,000 Hong Kong investors enter Korean market as city ranks second-largest net buyer - Exclusive: Over 3,000 Hong Kong investors enter Korean market as city ranks second-largest net buyer About 3,500 Hong Kong retail investors entered Korea’s stock market through Hana Securities accounts, helping Hong Kong become the second-largest foreign net buyer of Korean equities this year. 10/12/2026...
CTO Interview with Dr. Zakir Syed of ClockEdge - Dr. Zakir Syed is Co-founder and Chief Technology Officer of ClockEdge, where he has played a central role in developing specialized simulation technology for advanced semiconductor clock networks. He brings more than 30 years of experience in electronic design automation and semiconductor verification....
Windows Goes Hybrid, Marvell’s $90B Target, and the AI Routing Race | The Six Five Pod Ep. 323 - On Episode 323 of The Six Five Pod, Patrick Moorhead and Daniel Newman unpack the biggest stories from the week, including Microsoft and NVIDIA’s hybrid intelligence push for Windows, Marvell’s Investor Day, new models from Anthropic, Mistral, and Reflection, the AI labs’ accountability hearings...
20% collapse in Q3 PC units - Q3 PC shipments fell 20.1% YoYin Q3 2026 to 62.7 million units, according IDC, the second consecutive decline and a deeper one than the 3.8% drop in Q2. Shipments also […] The post 20% collapse in Q3 PC units appeared first on Electronics Weekly .
Rapidus Launches CORE Ecosystem to Support 2nm Chip Development and Manufacturing - As part of its first phase, Rapidus announced the formation of Design Solution Associates to help customers support early-stage design for Rapidus’ advanced 2nm semiconductor foundry. The post Rapidus Launches CORE Ecosystem to Support 2nm Chip Development and Manufacturing appeared first on Semiconductor...
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