Semi. Fabs and Clean Rooms 2¾h ago: Recent X posts (as of October 7, 2026) highlight ongoing semiconductor fab construction, cleanroom expansions, and capacity updates driven by AI demand. Micron raised FY27 capex to >$50B for cleanroom readiness; Samsung advancing Yongin six-fab complex; Intel/Terafab updates with Musk involvement; Infineon and X-FAB cleanroom projects progressing; TSMC 2nm capacity on track with packaging noted as bottleneck.
Skyworks Completes Combination with Qorvo - Skyworks today announced the successful completion of its combination with Qorvo. The close of the transaction creates a U.S.-based, global leader in high-performance radio frequency (RF), power management, and analog and mixed-signal semiconductor solutions.
Samsung chip employees to receive special stock bonuses in 2027 - Samsung chip employees to receive special stock bonuses in 2027 Samsung Electronics’ semiconductor employees will receive a new performance bonus in company shares next spring, with payouts tied to divisional profits and individual performance. 10/7/2026 - 07:44 AM News Team
[News] Intel CEO Lip-Bu Tan Says It Remains in Musk’s Terafab as TSMC Speculation Grows - Tesla’s Terafab foundry strategy is coming into focus as Intel remains involved in the project while Elon Musk explores potential cooperation with TSMC. According to Reuters, citing Bloomberg, Intel will remain involved in Terafab, CEO Lip-Bu Tan said ahead of an event in Tokyo marking the U.S. ch......
Time and Frequency: The Invisible Critical Infrastructure - From smart grids to AI data centers, today’s systems depend on a shared reference for time. This blog post examines the growing importance of resilient synchronization and the technologies enabling trusted, continuous operation.
High-NA wasn’t quite finished after all - A design decision for high-NA lithography that ASML had to make before EUV had even proved itself has proved troublesome for logic makers.
Interfacial Charge Transfer and Morphology Govern Magnetism in Ultrathin VOx/MoSe2 Heterostructures - Engineering magnetism in two-dimensional semiconductors through interfacial interactions offers an attractive alternative to substitutional doping and provides opportunities for integrating magnetic and optoelectronic functionality within the same heterostructure. Here, we investigate ultrathin VOx films...
Two-exciton bound states in the Merrifield exciton model - Understanding the formation and dynamics of two-exciton bound states (BSs) is crucial for harnessing multi-exciton phenomena and designing next-generation organic semiconductor materials. While various mechanisms such as intermolecular exciton-exciton interactions or multi-level intramolecular configurations...
2026 Investor’s Guide to Africa - The Middle East conflict reinforces the importance of supply security, and African industries are benefitting.
2026-2027 CMR CVD ALD Hi K and Metal Precursors - This Critical Materials Report delivers a cohesive view of the 2026-2027 semiconductor CVD / ALD Hi K and metal precursor materials market, combining demand forecasts, supply dynamics, competitive positioning, and pricing trends. It describes the value chain through profiling key players while identifying...
Beyond the Die: Verifying the Connected Chip - One of the standout presentations at the 2026 TSMC OIP Forum highlighted a collaboration between Siemens EDA, Marvell, and TSMC. I always appreciate EDA presentations that bring together customer and foundry perspectives, and this one did not disappoint. We follow 3D IC technology closely and have published...
Machines that think: energy and the grid - This is the seventh part in a series on how AI is crossing out of software and into the physical world. This time, Jan Bosch reaches the constraint underneath all of it.
Reducing I/O requirements for optical detection - Although this project may be a bit esoteric, the concepts shown to reduce I/O requirements can also be applied to other systems. The post Reducing I/O requirements for optical detection appeared first on EDN .
Technical Report: Telink Semi. TL3228BE A-1 SMIC 40 nm eReRAM Process Analysis - This process report provides a comprehensive analysis of the semiconductor technologies used in the fabrication of the 40 nm eReRAM manufactured by SMIC, focusing on its structures and materials. It includes an overview of key findings, followed by detailed examinations of the FEOL, ReRAM element, and...
Industry minister says Alaska LNG has 'strategic value' as global energy routes shift - Industry minister says Alaska LNG has 'strategic value' as global energy routes shift The latest position follows a tense week after U.S. Donald Trump announced seemingly unilaterally that Seoul will invest at least $50 billion. 10/6/2026 - 06:21 AM News Team
Chip Industry Technical Paper Roundup: Oct. 6 - Low-contact-resistance WSe₂ transistors; backside clock meshes for 2nm GAAFETs; row-parallel processing in DRAM; HBF for high-throughput LLM serving; formal security analysis of CAN XL; abstraction and validation from physical devices to RTL. The post Chip Industry Technical Paper Roundup: Oct. 6 appeared...
Arm vs Qualcomm episode 2 - Yesterday a second trial in the Qualcomm vs Arm legal marathon opened in Delaware. It is before a jury and slated to last five days. The original Qualcomm vs Arm […] The post Arm vs Qualcomm episode 2 appeared first on Electronics Weekly .
Radio-frequency electron cascade in semiconductor quantum dots - Electron cotunneling in semiconductor quantum dots is a higher-order tunneling mechanism that connects initial and final charge states through energetically inaccessible virtual intermediate configurations. In quantum-dot arrays, such processes can produce simultaneous charge motion across multiple tunnel...
Reducing Contact Resistance Pushes 2D Transistors Toward Advanced CMOS (HUST, PolyU, UCSB, NUS) - Researchers at Huazhong University of Science and Technology, Hong Kong Polytechnic University, University of California, Santa Barbara, and National University of Singapore published a technical paper titled “Low contact resistance and high current density in ballistic p-type transistors based on oxygen-doped...
Infineon Completes Acquisition of C2i Semiconductors - Transaction expands Infineon’s innovation footprint in India and further strengthens its global R&D capabilities. The post Infineon Completes Acquisition of C2i Semiconductors appeared first on Semiconductor Digest .
Lee administration hides behind public deliberation - Lee administration hides behind public deliberation Public deliberation is stalling urgent decisions on nuclear power and semiconductor labor rules. 10/5/2026 - 11:01 AM Opinion Desk
An Apple-plus-Google adapter that’s AI in name only (sigh) - Is there actually any AI in the “AI Box”? Doubtful. But it’s durable, along with platform-nimble. And the attractive price is indisputable. The post An Apple-plus-Google adapter that’s AI in name only (sigh) appeared first on EDN .
photonicSENS Earns 2026 Vision Award in Stuttgart - photonicSENS was awarded the 2026 VISION Award at the VISION 2026 conference in Stuttgart. The company is recognized for its plenoptic camera technology which captures a full 2D image and a metric, per-pixel depth map in a single shot from a single sensor, with no projector, no scan axis, and no on-site...
AMD CEO Discusses AI Collaboration with Samsung, SK Hynix - She also held meetings with domestic AI semiconductor and software companies, and attended a gamer event, signaling efforts to expand AMD’s footprint across the semiconductor supply chain in Korea.
Reducing Fab Cycle Time: What MES, Dispatching, Scheduling and APC Each Contribute - Dispatching, finite-capacity scheduling, MES, APC and simulation each attack a different share of the time wafers spend waiting, and all of them depend on accurate WIP and equipment-state data. The post Reducing Fab Cycle Time: What MES, Dispatching, Scheduling and APC Each Contribute appeared first on...
Thermal Complexity Grows With AI Chips And Photonics - Increasing power density makes heat, stress, and aging harder to predict, and more critical to address earlier in the design flow. The post Thermal Complexity Grows With AI Chips And Photonics appeared first on Semiconductor Engineering .
Apple and LG Electronics reportedly team up on branded smart home devices - Apple and LG Electronics are reportedly pairing up to create a line of smart home devices, though the devices will carry the LG brand name. The two companies are expanding their reach into the smart home market as both face headwinds in their home product segments.
Singapore Sees Region Thriving Amid ‘Breakdown’ of World Order - Singapore’s top diplomat touted what he called “a moment of great potential” for Southeast Asia, as economies expand rapidly on surging technology demand even as much of the world faces growing uncertainties.
Global investment banks raise Korea's growth outlook on chip boom - Global investment banks raise Korea's growth outlook on chip boom The median growth forecast by major foreign institutions for 2026 was raised to 3.5 percent in September from 3.3 percent in August. 10/6/2026 - 08:59 PM
ASML’s Chip Technology Move Threatens Besi Shares, BofA Says - BE Semiconductor Industries NV’s share price doesn’t reflect the threat from fellow Dutch company ASML Holding NV in terms of an advanced chip packaging technique, Bank of America analysts said.
Photonic Integrated Laser Frequency Remains Stable without Active Control - Precision applications like optical metrology, quantum sensing, and atomic clocks require a laser source with an exceptionally stable optical frequency. Often, this stability comes from bulky lasers housed in controlled laboratory environments....
Microchip, Navitas 800V DC-to-6V DC reference design for AI datacentres - Microchip Technology and Navitas Semiconductor have partnered to collaborate on an 800V DC-to-6V DC reference design for AI datacentre rack power applications. It combines Microchip’s digital power control and security […] The post Microchip, Navitas 800V DC-to-6V DC reference design for AI datacentres...
Podcast EP371: How Vinci is Revolutionizing Hardware Design with John Bruggeman - Daniel is joined by John Bruggeman, Chief Marketing Officer at Vinci, where he leads the company’s market narrative and strategic positioning. His work focuses on translating complex technical advances into clear category definition, industry relevance, and market adoption.
High-end packaging: a market set to nearly quintuple by 2031 - Advanced packaging has become the place where AI system performance is won or lost. High-end performance packaging revenue is forecast to grow to more than $51 billion in 2031, a 27% CAGR during 2025-2031, with package unit volume expanding at a 33% CAGR and wafer demand at 30%. The gap between those...
Has the Memory Cycle Broken? Plus: Nvidia & Broadcom’s $40B+ Financing Playbook - In this episode of The Circuit, Ben Bajarin and Jay Goldberg unpack the shifting structural economics of the semiconductor and AI landscape. Following Micron’s latest earnings, they kick off with a deep-dive debate on whether the memory market has permanently raised its floor to $600B–$800B, or if...
FuzeHub Blog: How Upstate New York is Reinventing Semiconductor Manufacturing - Photo courtesy of FuzeHub For decades, America’s semiconductor supply chain has depended heavily on overseas manufacturing. Now that’s changing thanks to a reshoring effort where New York State is playing a leading role. As Upstate New York becomes an epicenter of advanced microelectronics, the region...
From Blueprint to Production: How Rambus Brings Commercial-Grade Caliptra Security to AI SoCs - Semiconductor designers today face a critical hurdle: how to smoothly transition from an open-source hardware blueprint to a commercially hardened, production-ready silicon implementation. As semiconductors play an increasingly essential role in powering the AI era, safeguarding these hardware foundations...
Quad beamformer simplifies X-band radar design - Qorvo’s QPX0252 four-channel beamformer IC operates from 7.9 GHz to 12 GHz for use in X-band phased-array radar systems. The post Quad beamformer simplifies X-band radar design appeared first on EDN .
Insight: EU Battery Passport - Rules Nearly Set for February 18, 2027, but Industry Disclosure Lags - The EU Digital Battery Passport deadline is fixed and close, and the core rules are largely in place. Public evidence of industry deployment is far thinner. This Insight maps publicly announced activity across automakers, battery makers, Tier-1s, and chipmakers, and explains why battery-health data and...
Get Mannerisms, Gadget Master, the Daily and the Weekly, in newsletter form - Let our content come straight to you! Easily digestible newsletter emails straight to your inbox. And all the newsletters are mobile optimised. The post Get Mannerisms, Gadget Master, the Daily and the Weekly, in newsletter form appeared first on Electronics Weekly .
An unbuttoned circuit for setting digital pots - This Design Idea enables you to program digital potentiometers with inexpensive rotary incremental encoders. The post An unbuttoned circuit for setting digital pots appeared first on EDN .
Elon Musk Rules Out Potential TSMC Role in Terafab Operations - Elon Musk said his business empire will build and operate Terafab independently, quashing speculation about industry leader Taiwan Semiconductor Manufacturing Co. swooping in to run his ambitious chipmaking venture.
New wireless system could power medical implants as they stretch - Over the past few decades, electronics engineers have developed increasingly sophisticated implantable medical devices. Reliably powering some of these devices, however, can be challenging, particularly when they are based ...
Corporations' excess funds hit record $50.1 billion in Q2 on robust chip exports - Corporations' excess funds hit record $50.1 billion in Q2 on robust chip exports Net financial funds, or the value of financial assets minus financial liabilities, held by nonfinancial corporations totaled 67.1 trillion won ($50.1 billion) at the end of June, sharply up from 20.8 trillion won three months...
AMD’s Su to Meet Samsung’s Chip Head as Memory Crunch Persists - Advanced Micro Devices Inc.’s chief executive officer plans to meet with the head of Samsung Electronics Co.’s semiconductor business on Wednesday, the latest in-person catchup between two of the AI industry’s key figures.
The Chip Insider®– State of the Semiconductor Union - Inside G. Dan Hutcheson’s latest analysis, the seven layers of the Semiconductor Demand Stack reveal an industry at remarkable highs, as AI demand, semiconductor growth, economic conditions, and geopolitical risks shape the outlook for the cycle ahead.
Top Ten SiC Producers - Thanks to Mordor Intelligence for this one – the top ten SiC producers: Infineon ST Wolfspeed onsemi ROHM Mitsubishi Electric: Fuji Electric Microchip Toshiba Semikron Danfoss The post Top Ten SiC Producers appeared first on Electronics Weekly .
Please Join Us in Welcoming Abrer Moshin Samin to the FSI Team! - We’re excited to welcome Mia Przelomski to the team as our new Communications Assistant! Mia is a senior at the University of Florida, pursuing a bachelor’s degree in Statistics with a minor in Communication Studies. She brings experience in content creation, graphic design, and sports communications,...
Monolithic 3D Memristor-TFT Stack For Programmable Neuromorphic Computing (SNU, Yonsei) - Researchers at Seoul National University and Yonsei University published a technical paper titled “Monolithic three-dimensionally integrated memristor-thin-film transistor for electrically programmable multimode reservoir computing.” Abstract Excerpt: “Reservoir computing offers an efficient framework...
Qnity Develops 330°C Sealing Material for High-Temperature Chipmaking Processes - New Kalrez 7080 sealing solution strengthens an integrated portfolio of technologies designed to improve yield, reliability, and tool performance. The post Qnity Develops 330°C Sealing Material for High-Temperature Chipmaking Processes appeared first on Semiconductor Digest .
Welcome Ron Piccolo, Ph.D. to Our Stakeholder Advisory Board - FSI Stakeholder Advisory Board Update – October 2026 We are thrilled to welcome Ron Piccolo, Ph.D. to The Florida Semiconductor Institute Stakeholder Advisory Board. Dr. Ron Piccolo brings extensive experience across technology, higher education, and workforce development. He currently serves as President...
CXL-Connected MRAM Address AI Storage Latency - Everspin’s demo shows how a 4-GB pool of persistent MRAM can serve as a new tier of storage between DRAM and NAND flash. The post CXL-Connected MRAM Address AI Storage Latency appeared first on EE Times .
[News] Seagate, Toshiba Reportedly Vie for TDK’s HDD Head Unit, a Key Independent Supply Source - As Toshiba moves to double HDD capacity by fiscal 2027 to capture booming AI data-center demand, it could be making another push to secure its supply chain. According to Bloomberg, the Japanese storage giant is battling Seagate for TDK’s magnetic-head business, a critical component for ramping HDD......
Continuity testing in semiconductor ATE: Fundamentals and test methods - Continuity testing is the first test performed in any semiconductor test flow, verifying that a device under test (DUT) is properly connected to automatic test equipment (ATE). The post Continuity testing in semiconductor ATE: Fundamentals and test methods appeared first on EDN .
[News] Qualcomm, Apple, MediaTek Battle It Out on TSMC 2nm: Inside Their Flagship AI Strategies - The flagship mobile chip race is entering the 2nm era, with on-device AI emerging as a key battleground. According to ijiwei, Qualcomm, Apple, and MediaTek all unveiled TSMC-made 2nm processors in September 2026, marking the industry’s shift to GAA nanosheet transistors. While all three are puttin......
From Simulation to Deployment: Why Physical AI Matters - Artificial intelligence is moving beyond the screen. The attached presentation describes a shift from systems that generate text, images, and code to systems that can perceive their surroundings and take action. These systems could guide robots, vehicles, factory equipment, medical devices, and critical...
Rocket Factory Augsburg appoint new CEO - Alexander Dahm has been named as the new CEO of Rocket Factory Augsburg (RFA), the Bavarian space rocket startup hoping to launch from the SaxaVord spaceport in the Shetland Islands. […] The post Rocket Factory Augsburg appoint new CEO appeared first on Electronics Weekly .
The bloodline is secured. Female, as you requested. -Reverend Mother Mohiam
