In-depth: Alibaba builds three-layer AI empire across chips, memory and models - Competition in China's AI industry is moving beyond large language models into chips, memory and computing infrastructure. CXMT's planned IPO on Shanghai's STAR Market has put renewed attention on Alibaba, the Chinese DRAM maker's largest industry investor.
Formal Foundations for Known Good Reliable Die Screening in Chiplet-Based AI Systems-on-Chip - The rapid growth of chiplet-based artificial intelligence systems-on-chip (SoCs) has exposed a fundamental gap in semiconductor test methodology. Existing Known Good Die (KGD) screening guarantees pre-assembly functional correctness, yet it offers no probabilistic assurance of post-assembly reliability...
From Rhetoric to Metrics: Raghib Hussain’s First Year as Altera CEO - Altera has taped out six chips in nine months, three ahead of schedule, as new CEO focuses on execution. The post From Rhetoric to Metrics: Raghib Hussain’s First Year as Altera CEO appeared first on EE Times .
RISC-V Advantage in Accelerator Control Highlights System Verification Challenges - When considering best-fit applications for RISC-V, the appeal of extending the instruction set and competitive pricing for storage and edge applications has been pretty clear. But I have always struggled to understand the appeal in head-on competition with Arm in premium applications such as servers and...
Samsung Fold8 Unveils 4:3 Screen, Slimmer Design Ahead of Apple - ◇High-end phone around 3 million Korean won due to semiconductor price surge The Galaxy Z Fold8 Ultra maintains the same weight as its predecessor, 215g, while achieving the thinnest unfolded thickness
Caltech’s New Device Steers Light With Light at Mind-Bending Speed - A light-controlled meta-surface redirected another beam at femtosecond speeds without relying on slower electronic relaxation. A pulse of light crosses the width of a human hair in roughly 74 femtoseconds (74 quadrillionths of a second). Caltech researchers have now redirected a beam in that same fleeting...
[News] AI Data Center Demand Revives HDD; Japanese Component Makers TDK, Resonac Expand Capacity - Hard disk drives (HDDs) are regaining attention as AI data center operators seek cost-effective, high-capacity storage to support rapidly growing data volumes. According to The Elec, although HDDs gradually lost ground to solid-state drives (SSDs), they are now poised for a rebound. The report says ......
US-China AI rivalry, part 1: September talks to confront frontier models, IP theft, open-source risks - The US and China are preparing to hold their first official artificial intelligence (AI) dialogue under President Donald Trump, a notable diplomatic milestone after years of escalating technology tensions. Yet the significance of the meeting lies less in whether it produces tangible agreements than in...
Multiscale ensemble Monte Carlo of transport and gas sensing in monolayer MoS _2 _2 - Two-dimensional semiconductors , such as monolayer MoS _2 _2 , combine a technologically useful band gap with an all-surface geometry, making them attractive both as field-effect-transistor channels and as chemically sensitive devices. Predictive device design requires a transport model that is (i) physically...
Missing sense: Why physical AI can see everything and feel nothing - The future of physical AI will be determined by whether machines can interact with the real world with the same confidence that humans do. The post Missing sense: Why physical AI can see everything and feel nothing appeared first on EDN .
xMEMS Launches the World’s Smallest Active Micro Fan to Break the Thermal Wall in Smart Glasses - XMC-1200, the industry’s solid-state µCooling chip enables targeted cooling for AR/XR light engines, processors, and other components in smart glasses. The post xMEMS Launches the World’s Smallest Active Micro Fan to Break the Thermal Wall in Smart Glasses appeared first on Semiconductor Digest ....
DFI 6.0 Key Highlights of the Latest DFI Specification - Explore Cadence IP here The DDR PHY Interface (DFI) protocol specifies the signals, timing parameters, and configurable options necessary for the transfer of command information and data across the DFI, facilitating communication between the DDR memory controller (MC) and the …
[News] GaAs and InP Substrate Project Approved in Chinese Zhejiang Province - A high-end compound semiconductor substrate project with a total investment of RMB 2 billion (approximately USD 280 million) has been officially approved and will be established in Quzhou, Zhejiang Province, according to the Zhejiang Provincial Online Investment Project Approval and Supervision Plat......
FPGA SDK enables sparse AI models - Version 3.0 of Microchip’s VectorBlox Accelerator SDK simplifies FPGA-based AI implementation by supporting sparse neural networks. The post FPGA SDK enables sparse AI models appeared first on EDN .
60 FPS NES Emulator on ESP32 - At least in theory, video games are more resistant to becoming lost media thanks to their digital nature — they’re easy to copy and emulators have saved many titles that …read more
From Highways To Health Care: Portability Proves Key To Physical AI - Success at the edge takes advantage of common threads — lithography, imaging, chiplets, and AI. The post From Highways To Health Care: Portability Proves Key To Physical AI appeared first on Semiconductor Engineering .
Physically motivated iso-orbital indicator for meta-GGA exchange functionals - …the modified indicators suppress spurious oscillations in the semilocal exchange potential and restore correct electron localization in atomic tails. For a ten-member cubic semiconductor benchmark, the band gap mean absolute error is reduced by 41.1 % for r ^2 ^2 SCAN@PGS and 48.8 % for MS2@PGS, while...
HW-based Methods to Dynamically Throttle AI Performance (Princeton University) - Researchers from Princeton University published a technical paper titled “Hardware Mechanisms to Dynamically Throttle AI Performance.” Abstract Excerpt: “In this paper, we introduce a set of microarchitecture knobs which dynamically control the available hardware resources to limit AI performance...
Chip Industry Technical Paper Roundup: July 21 - Near-memory HBM for LLM inference; processing-in-memory for 3D DRAM; SDV hardware abstraction; 3nm GAAFET SRAM self-heating and rad-hard; monolithic CMOS-photonic integration; quantum photonic chips; AI-driven thermal modeling for 3D photonic circuits. The post Chip Industry Technical Paper Roundup: July...
OnePlus and Realme Exit - Casualties of the Memory Crisis - OnePlus is walking away from Europe and North America’s smartphone market. Realme is pulling back from its own home market of China. Parent company Oppo (BBK) calls this a “proactive global strategy adjustment”. In practice, it is the sharpest visible casualty yet of a memory supply crisis that...
2026-2027 CMR Silicon Wafers - A comprehensive supply chain and market analysis of the silicon wafers market for 2026-2027 including market status and outlook, market trends, and the market landscape.
Agentrys Weighs in on LLM Benchmarking for Chip Design at DAC 2026 - Si2 is conducting quite a few sessions at DAC this year covering everything from power model standards to agentic AI. There is one session that is a bit different, focusing on LLM benchmarking. Since AI is popping up everywhere, the ability to accurately assess and measure the quality of new models becomes...
Wafer Demand Q2 2026 Update - Global wafer demand is projected to grow 12% in 2026, driven primarily by the ongoing AI boom and the resulting surge in data center buildouts. DRAM demand is the standout growth driver, more than doubling by 2031 on the back of capacity build-outs and HBM-related demand, while NAND demand stays comparatively...
Samsung will show you the fold. We'll show you what's inside the hinge. - TechInsights goes hands-on with the Galaxy Z Fold 8 lineup — reading the announcement the way component buyers, hardware teams, and procurement leads actually need to: through cost, supply, and competitive pressure.
CEA-Leti Looks Beyond SRAM and DRAM as AI Reshapes the Memory Roadmap - CEA-Leti’s François Andrieu describes more embedded, persistent, and low-energy memories that will meet the growing demands of AI. The post CEA-Leti Looks Beyond SRAM and DRAM as AI Reshapes the Memory Roadmap appeared first on EE Times .
Enterprise AI: Reshaping AI processor architectures - Enterprise AI fundamentally changes the computing requirements, exposing the architectural limits of GPUs and opening the door for real-time, memory-centric, low-latency reasoning. The post Enterprise AI: Reshaping AI processor architectures appeared first on EDN .
Shelly Presence Gen4 (S4SN-0U61X) Deep Dive Teardown - The Shelly Presence Gen4 is a smart sensor purchased from the European market. The Shelly Presence Gen4 is an mmWave radar-based presence sensor that covers an area of up to 42 square meters. It can detect up to 6 people at the same time and supports up to 10 customizable zones per device. A Deep Dive...
It’s RAINing RFID - I must admit that I was tempted to title this column “ It’s RAINing RFID! Hallelujah! ” But then I thought you’d probably spend the rest of the day with the Weather Girls song rattling around in your head, so I decided against it. You’re welcome.
Siemens EDA acquires SoC toolmaker Precision Innovations - The acquisition aims to bring AI-driven chip planning to a much broader set of SoC design engineering teams. The post Siemens EDA acquires SoC toolmaker Precision Innovations appeared first on EDN .
Carbon Nanotube Firm Strengthens Executive Team to Build CNT Ecosystem - Canatu stacks its C-suite to push CNTs into chips, cars, and diagnostics—watch how its new CEO plans to turn nanotube hype into yield. The post Carbon Nanotube Firm Strengthens Executive Team to Build CNT Ecosystem appeared first on EE Times .
