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 [News] Intel Reportedly to Adopt Silicon Capacitors in 2027 to Improve EMIB Power Stability for Google’s v8e  - With TSMC’s CoWoS capacity remaining constrained, Intel’s EMIB (Embedded Multi-die Interconnect Bridge) advanced packaging technology is increasingly gaining traction as an alternative, fueling expectations for stronger demand across related components. Notably, ZDNet reports that Intel plans to......

 Chiplets, Ecosystems, and Europe’s Post-Fab Semiconductor Strategy  - “Can Europe realistically compete on leading-edge fabs alone?” Maria Marced said. “No.” The post Chiplets, Ecosystems, and Europe’s Post-Fab Semiconductor Strategy appeared first on EE Times .

 Taming the beast: Memory efficiency in an AI/crypto world  - The careful selection of energy-efficient components like voltage regulators plays a vital role in reducing energy use of a data center. The post Taming the beast: Memory efficiency in an AI/crypto world appeared first on EDN .

 What Soil Sensors Bring to African Agriculture: Tokyo International Conference on African Development 2025 (TICAD9)  - Murata Manufacturing exhibited traffic counters, soil sensors, CO2 sensors, and other products at the TICAD Business Expo and Conference held in conjunction with the 9th Tokyo International Conference on African Development (TICAD9). In this article, we highlight the necessity for the effective use of...

 HUAWEI introduit la loi d'échelle Tau pour les futures puces  - lors du Symposium international 2026 de l'IEEE sur les circuits et les systèmes qui s'est tenu à Shanghai, He Tingbo, Président du département Semiconductor Business de HUAWEI, a présenté la loi d'échelle Tau (τ), qui succède à la loi de Moore pour orienter le développement des semi-conducteurs.Le...

 Photonics-Based Metrology Solution Wins Lam Capital Venture Competition  - The 2026 Lam Capital Venture Competition highlighted breakthrough semiconductor innovations with Lightfinder winning for its chip-scale optical sensing technology designed to enable real-time, in-tool metrology. This event showcased Lam Research's leadership in supporting startups that build the AI backbone...

 [News] US AI Firm Fabric. AI to Demonstrate Micro LED Optical Interconnect Platform by Late 2026  - U.S.-based AI infrastructure company Fabric. AI recently announced plans to demonstrate its flagship Micro LED optical interconnect platform by the end of 2026. Fabric.AI is developing a fabless semiconductor technology stack aimed at next-generation AI data centers. Its core product, Neural I/o�......

 Micron Technology to Report Fiscal Third Quarter Results on June 24, 2026  - BOISE, Idaho, May 27, 2026 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU) announced today that it will hold its fiscal third quarter earnings conference call on Wednesday, June 24, 2026, at 2:30 p.m. Mountain time. The call will be webcast live at  http://investors.micron.com/.

 SECO brings Modular Vision 10.1 MX95 HMI platform to market  - SECO it taking pre-orders for its Modular Vision 10.1 MX95, an industrial HMI platform it unveiled at embedded world 2026. Featuring real-time control, and on-device AI acceleration, the interface is powered by the NXP i.MX 95 applications processor. The company describes it as a scalable, AI-ready, and...

 The World's Premier Chipmaker is Facing its Biggest Crisis Yet  - [Opinion] Chairman and CEO CC Wei needs to make changes to employee relations, fast. His skyrocketing pay package doesn't much help matters.

 Dual-band GNSS antenna from Taoglas for L1/L5  - Taoglas has introduced the GVLB208…

 The impact of nanoplastics on neurons may depend on their size  - Smaller plastic particles have more effects on neurons, the key information processing cells of the brain, new research from the University of Eastern Finland shows. In the study, neuronal cells were exposed to polystyrene ...

 Chemical efflux imaging using an annular nanosensor array for in situ bladder cancer detection  - An annular carbon-nanotube nanosensor array integrated onto a medical-grade catheter enables near-infrared, in situ spatial mapping of bladder cancer-associated protein biomarker release in the bladder with 182-fold higher sensitivity than urine sampling.

 SkyWater Expands Advanced Packaging Capabilities to Support AI and Next-Generation Computing  - As the advanced packaging community gathers for the 76th IEEE Electronic Components and Technology Conference this week, SkyWater Technology is...

 Taiwan's Wah Lee expands into specialty gases as materials costs are passed on quarterly  - Wah Lee Industrial said it has formally moved into investments in standard gases and other supplies needed by wafer fabs, with its Tainan logistics center set to open in the second half of 2026 to support future growth. Chairman Gary Chang also confirmed that the company will pass on higher costs for...

 TAITRA says Computex participating firms exceed US$10 trillion in market value

 Humanoid robot mass production hits a thermal wall

 From boom-bust to structural growth? Memory's US$1 trillion moment puts AI thesis to the test

 Unitree sprints toward IPO as profits crumble under rising costs

 Samsung reportedly to expand Vietnam footprint with new memory chip testing plant

 TSMC CEO promises bonus growth above 30% in 2026 if performance holds

 Dreame's 941-company ecosystem targets growth far beyond robot vacuum cleaners

 Xiaomi saw nearly 60% profit drop amid memory cost 'super cycle'

 OpenAI targets smaller advertisers in push to make ChatGPT ads pay off

 Hiwin opens Italy HQ, bridging Europe to global markets

 Dropbox co-founder Andrew Houston to step down as CEO, Ashraf Alkarmi named successor

 Nvidia CEO says Taiwan needs more electricity, ministry confirms 5.2 GW of gas capacity to be added

 CSP capex surge fuels hot AI server demand and tight supply in 2026

 Qualcomm's ByteDance deal gives smartphone chipmaker entry into AI data center market

 China clears 9 domestic AI chips for state procurement

 WinWay's new Kaohsiung plant to break ground on May 29

 Samsung wage deal pushed through by chip workers, widening bonus divide

 Global DRAM revenue surges toward US$100 billion in 1Q26 on AI-driven demand

 ICP DAS expands semiconductor controller orders and accelerates TPU medical pivot, plans factory expansion

 Daxin Materials advances into Low Dk and Low Df market for booming AI server and LEO satellite applications

 Jensen Huang: Taiwan is center of AI revolution, with US$150 billion in capex powering local ecosystem

 WinWay weighs Texas shift after AI chip testing surge in North America

 Acer sees CPU shortages worse than memory as 2H24 PC market weakens

 Qualcomm and ByteDance's rumored AI ASIC deal signals potential shift in China's data center chip supply

 IREN signs US$1.6bn Dell deal for Blackwell AI systems to expand Texas data center capacity

 Cadenceは EMA Design Automation と FlowCAD を迎え入れます  - 皆様に嬉しいお知らせをお届けします。EMA Design Automation(以下、EMA) と FlowCAD のチームがケイデンスデザインシステムズ(以下…

 Alibaba gets Android 16 running on RISC-V  - Beijing’s sovereign stack ambitions strengthen

 TSMC bonus dispute escalates as chairman Wei cancels trip to address employees  - Taiwan Semiconductor Manufacturing Company (TSMC) is scheduled to hold a company-wide communication meeting on the morning of May 27, during which chairman C.C. Wei is expected to explain in person the latest employee bonus policy, following online backlash over reports that the company will cut employee...

 The 50G PON gateway SoC supports edge AI, Wi-Fi 8  - The home CPE silicon integrates NPU for edge AI while supporting native Wi-Fi 8. The post The 50G PON gateway SoC supports edge AI, Wi-Fi 8 appeared first on EDN .

 The Chip Insider®–Apple, Nvidia, and TSMC: Bifurcation of the Advanced Technology Roadmap for Semiconductors  - Explore how TSMC’s roadmap split is raising new priorities, yet advancing chips along mobile efficiency and AI-HPC performance paths

 Applied Materials Partners with SCREEN To Bring Advanced Wafer Cleaning Technologies to EPIC Center  - Collaborative R&D at Applied’s EPIC Center in Silicon Valley will enable higher yields and faster commercialization of next-generation chips Partnership deepens long-standing joint development relationship to overcome process challenges in leading-edge chipmaking SANTA CLARA, Calif., May 26, 2026

 Sensing Up Close with Wearables and Quantum  - Wearable devices can bridge the gap between the internal and external, by acting as an interface between the body's inner workings and real-time data displayed on a screen. This article covers wearable devices and quantum sensors used in wearables.

 EnSilica attending TSMC 2026 European Technology Symposium in Amsterdam.  - The EnSilica leadership team is looking forward to attending the TSMC 2026 European Technology Symposium in ...

 Single-step 8-9x expansion reveals nanoscale centrioles without electron microscopy  - In a study published in ACS Nano, researchers from National Taiwan University report a new expansion microscopy strategy termed high-fold homogeneous expansion microscopy (hiHomoExM), capable of achieving approximately 8–9× ...

 NASA picks Astrolab for Artemis lunar rover mission  - NASA has selected California-based Astrolab as one of two suppliers for a crewed lunar rover that will support…

 Imec and EVG push hybrid bonding to 200 nanometers  - Imec and EV Group have demonstrated wafer-to-wafer hybrid bonding at a 200-nanometer copper interconnect pad pitch.

 VelocityNET™ Industrial Ethernet Solutions  - Designing for harsh industrial environments demands more than standard Ethernet. This blog post explores industrial Ethernet fundamentals, including TSN and network redundancy, and highlights our VelocityNET™ solutions that help engineers build low-latency, reliable and scalable automation networks....

 [Blog] A New Approach to Platform Management with Compute and FPGA  - ASPEED’s management compute and Lattice’s low power programmability come together in a single device — the configuration modern platforms have been asking for. Server architectures aren’t getting any simpler. AI workloads keep pushing platforms toward disaggregation, modular I/O, and faster iteration...

 ByteDance's chip ambition grows with US$70 billion capex plan  - ByteDance is considering a sharp increase in capital spending this year as the TikTok owner pushes deeper into artificial intelligence infrastructure — a move that could make it one of China's most aggressive investors in data centers, servers, and custom chips.

 Qualcomm wins ASIC customers beyond ByteDance

 Luxshare strengthens antitrust compliance after China imposes fine over Wingtech deal

 China's LLM price war puts DeepSeek, Xiaomi on a collision course with OpenAI

 Synopsys flags mixed regional trends as China growth contrasts with weaker Western demand

 SAS succession complete as founder Mingguang Lu exits board amid diversified growth

 Huawei Tau Law series 3: Global chip experts split over China's post-Moore push

 Synopsys sees agentic AI and Ansys integration expanding long-term growth opportunities

 Nvidia's Rubin CPX plans clouded as Groq gains bigger inference role

 Commentary: China's AI chip certification becomes new market gatekeeper

 SK Hynix turns Big Tech's memory scramble into tougher supply terms

 TECO targets AI data center market with modular, North America and Southeast Asia push

 Solidigm appoints co-CEOs to split operations and growth responsibilities

 Semiconductors and AI are pillars of Taiwan's global prosperity, says Taiwanese president

 Peking University's true-3D EDA tool gives Huawei's LogicFolding chip roadmap critical design link

 Chunghwa Precision completes board reshuffle as it plans rapid capacity expansion for AI chip testing

 Yageo signals possible price hikes as Japanese and Korean passive component makers raise prices

 Synopsys raises fiscal 2026 outlook after strong second-quarter revenue growth

 Formosa Chemicals to showcase low-carbon 5N5 hydrogen and semiconductor materials at COMPUTEX 2026

 Marvell expands silicon photonics, switching, and interconnect roadmap

 Nvidia's move into Beitou-Shilin Tech Park raises AI power demand; Taipower uses dual-track strategy to push substation development

 Huawei's Watch Fit series surpasses 24 million shipments as wearables push global growth

 Marvell eyes XPU and attach wins as pillars of custom silicon growth

 Shiny Chemical sees AI and advanced semiconductor processes drive IPA and PM capacity expansion

 Hotai Motor expects semiconductor and AI demand to lift Taiwan auto market in 2026

 Laster Tech enters the robot joint control supply chain and wins North American auto orders

 Taiwan's GLT diversifies into auto and medical markets, expands Southeast Asia production

 QRT eyes aerospace, defense growth with portable chip radiation tester

 UMC readies price hikes, kicks off 2027 customer talks

 Yageo tops Murata in AI-driven passive component orders

 Samsung foundry targets robotics, auto AI chips with Cadence platform

 China Airlines rides Taiwan's AI boom to record cargo profits

 China tightens travel bans on private-sector AI to stem tech leaks

 FuriosaAi developing inference ICs with Broadcom  - FuriosaAi, the inference chip developer, has joined Broadcom to develop its third-generation AI accelerator. Sampling is scheduled for the first half of 2028. This collaboration evolves Furiosa’s Tensor Contraction Processor (TCP) architecture into a multi-die chiplet system, creating an inference engine...

 Scientists Create Tiny Chip That Uses Light Instead of Electricity To Process Information  - Researchers have created a compact chip that manipulates light-based quantum information with remarkable precision, advancing the development of next-generation photonic and quantum technologies. What if computers could process information using light instead of electricity? Researchers at Monash University...

 Color-Changing ePaper Concept Car to Make Its Debut at COMPUTEX 2026  - E Ink Demonstrates the Innovative Potential of Colored ePaper Materials for 3D Curved Surfaces and Smart Surfaces

 DIY Cloud vs. Managed Cloud for EDA: The Hidden Tax Engineers Are Paying  - For many semiconductor teams, cloud adoption started with the best of intentions…

 Junctionless Transistors Show a New Path to 3D Chips  - Roll-on nanoscale membranes make circuits that stretch across three layers of silicon

 Huawei 5G tech gets Germany, Spain support amid EU’s ban plan  - Amidst the EU’s planning to ban Chinese 5G network technologies, countries like Germany and Spain are backing Huawei for telecom solutions. This counterattack against the European...

 Synopsys Posts Financial Results for Second Quarter Fiscal Year 2026  - a strong second quarter with solid execution and strength across the business," said Sassine Ghazi, Synopsys president and CEO. "AI is scaling semiconductor demand, architectural diversity and complexity of chips and the systems they power - driving demand across our portfolio. Our momentum, leadership...

 Entry-level MCUs ease system control  - Toshiba is sampling its TXZ+ Entry-Class M4H microcontroller group for small-scale system control of consumer and industrial equipment. The post Entry-level MCUs ease system control appeared first on EDN .

 DNA assembly insights could streamline design and manufacturing of nanostructures for medicine, materials and more  - Researchers at The University of Texas at Austin have uncovered key principles that govern how DNA "origami" structures fold, findings that could make nanoscale materials faster and easier to manufacture. DNA origami is a ...

 AI boosts the cable market  - Cables of all kinds are seeing significant growth for a number of key reasons. From the expansion of AI datacentres requiring high-performance copper and optical cables to renewable energy and…

 Polar Semiconductor and Nexperia Partner on Power MOSFET Manufacturing to Strengthen Global Supply  - Foundry collaboration strengthens supply stability and supports growth in AI server infrastructure, robotics, industrial, and automotive applications Bloomington, Minnesota, USA / Nijmegen, Netherlands; May 27, 2026 - Polar Semiconductor, LLC and Nexperia B.V. today…

 ~0.1% resolution capacitive position sensor  - Simple circuit ratios sensor capacitance to reference capacitor to measure micrometers. The post ~0.1% resolution capacitive position sensor appeared first on EDN .

 A 30% rally in BOE Tech shows how AI buildout can galvanise Chinese LCD maker  - Chinese maker of LCD displays sees a surge in its share price following an attempt to diversify into AI with US manufacturer Corning

 The Impact of Rising Silver Prices on the Conductive Ink Market  - The conductive ink market relies heavily on silver as the conductive element of the ink. With sharply increasing silver prices, alternative inks are coming to the market including low-silver, copper and carbon inks.

 VIS\u2019s AI Moment: Why Mature-Node Specialty Processes Are Becoming Strategic Again  - Original Article By SemiVision Research [Reading time: 25 mins]

 Necessity is the Mother of Invention: Huawei Replaces Moore’s Law With Her’s Law  - We now know what China’s been working on to counter U.S. sanctions on EUV technology. The post Necessity is the Mother of Invention: Huawei Replaces Moore’s Law With Her’s Law appeared first on EE Times .

 Toshiba adds to Smart MCD series for BLDC  - Toshiba is sampling the TB9M040FTG, an addition to its SmartMCD series. The device integrates an MCU with power MOSFETs for three-phase brushless DC (BLDC) motor drive, enabling direct control of small automotive motor systems operating below 40W. As vehicle electrification continues to expand, demand...

 Inside Akeana and Cadence’s Secret Sauce for Faster RISC-V Chip Verification  - The Nightmare of Chip Testing (And How to Fix It) Let's be real: designing ambitious…

 Power Tips #153: How to generate a regulated negative output from a negative input using a boost controller  - How to deal with the reality that a standard buck controller power stage won’t work for negative-input conversion. The post Power Tips #153: How to generate a regulated negative output from a negative input using a boost controller appeared first on EDN .

 Low-power, flexible radio-frequency transistors break 100 GHz barrier  - Over the past decades, electronics engineers worldwide have been trying to develop devices that could enable even faster communications between devices, all while consuming less energy. To meet the demands of the sixth generation ...

 You Say “Ultra-Low-Power Connected Edge AI,” I Say “Nordic Semiconductor”  - There are many ways to slice and dice embedded engineering space (where, as everyone should know by now, no one can hear you scream). Take microcontrollers, for example. If I were to raise the topic of MCUs in a room full of embedded engineers, it wouldn’t take long before names like STMicroelectronics,...

 SEMI Foundation News Release: SEMI Foundation and the U.S. National Science Foundation Launch First Four Regional Nodes of the National Network for Microelectronics Education (NNME)  - View the original SEMI Foundation News Release here. National Workforce Infrastructure Initiative Activates More Than 325 Organizations Across the United States to Accelerate America’s Microelectronics Talent Pipeline MILPITAS, Calif., May 26, 2026 — The SEMI Foundation, serving as the Hub Operator...

 Royal Mint partners for UK e-waste recovery via prisoner workshops  - The Royal Mint’s Reformation Metals department is partnering with Recycling Lives Services, which enables supervised prison-industry workshops, to support e-waste recovery. The initiative aims to create employment and skills development opportunities for prisoners in supervised work programmes. e-waste...

 Researchers upcycle pomegranate peel into high-performance water purifier  - Pomegranate peel discarded by food vendors could soon help clean up contaminated water, thanks to research from the Department of Chemistry at the Faculty of Science. Led by Professor Sam Li, the research team developed a ...

 Join Our Webinar on Emerging Carbon Dioxide Utilization  - Join IDTechEx Senior Technology Analyst Eve Pope on Thursday 4 June for the expert-led webinar, "Emerging Carbon Dioxide Utilization: Chemicals, Fuels, Concrete, and the CCUS Business Case". Choose your preferred time zone - the webinar runs three times in one day.

 4th CISCE Showcases Innovation Driving Global Supply Chains  - The Digital Technology, will feature a dedicated AI zone for the first time. Developed in collaboration with leading global semiconductor companies, the section is structured around the AI industry chain — spanning data and sensing, computing power and algorithms, and real-world applications

 Navigating the AI Wave in Education with Help from Google and MediaTek  - With the rapid rise of AI, both students and teachers are experiencing a major technological shift. Educators like Ms. Fang, from Sheng-Li Junior High School, emphasize that the goal of modern education is to build digital resilience and the ability to adapt to rapid changes in information...

 MediaTek to Empower the Agentic AI Era with Edge-to-Cloud Tech at Computex 2026  - TAIPEI, Taiwan - May 28, 2026 – MediaTek will showcase its next-generation edge-to-cloud technologies and solutions for the Agentic AI era at Computex 2026. Themed "AI Without Limits," booth highlights include the award-winning Wi-Fi 8 product series; edge computing platforms empowering Agentic AI across...

 Challenging Conventional LDO Design: ROHM’s NanoCap™ Eliminates the Need for Large Output Capacitors  - As automotive electronic systems and industrial equipment continue to evolve, insufficient on-board capacitance and mounting space constraints have emerged as serious challenges. In LDO (Low Dropout) regulator design,...

 Power Moves Into the Package. Empower, PowerLattice, and the IVR Socket  - Why did ADI agree to pay $1.5B for Empower Semi? Because XPUs are about to draw 3,000+ amps at 0.7V. Transients and I\u00B2R both blow up. Move the regulator into the substrate. ADI, MPWR, VICR, IFNNY, AMK

 Synopsys Appoints Jesse Cohn to Board of Directors  - Synopsys, Inc.(NASDAQ: SNPS) today announced it has entered into a cooperation agreement with Elliott Investment Management L.P. (together with certain affiliates, "Elliott"), including the...

 NY Creates and its Albany NanoTech Complex Featured in Advanced Manufacturing Article  - NY Creates, and its Albany NanoTech Complex, was featured in an article by Advanced Manufacturing. NY Creates Communications Director, Steve Ference, spoke with Advanced Manufacturing: “Ference describes the site’s mission as threefold: ‘We engage in and support world-class semiconductor-based r&d...

 Engineering the Next Era of Semiconductor Innovation  - The semiconductor industry is entering a transformative new phase, driven by the convergence of artificial intelligence, cloud computing, and increasingly complex chip architectures. That message took center stage during the keynote talks at the Siemens EDA User2User 2026 North America conference. Executives...

 Leixlip students explore Intel forest to celebrate National Biodiversity Week  - To coincide with the national celebration of National Biodiversity Week, Intel invited 5th-class stu...

 Elmos: Annual General Meeting approves dividend of 1.50 Euro per share  - Large majority for all agenda items - Guido Meyer (60) and Tobias Weyer (42) elected to the Supervisory Board

 Monolithic three-dimensional integration of silicon transistors  - Uniformly doped, ultrathin single-crystalline silicon nanomembranes can be vertically stacked at low temperature using a roll-transfer-printing process that is scalable to wafer scale and tolerant to substrate topology and surface roughness for constructing high-performance monolithic three-dimensional...

 Nexans pilots DC microgrid for electrified buildings  - Nexans has commissioned the first phase of a direct current (DC) microgrid pilot at its AmpaCity research and development centre in Lyon, France. The demonstrator…

 Keysight adds PCIe 7.0 receiver validation at 128 GT/s  - Keysight Technologies is extending extends its PCIe 7.0 portfolio with a PCIe 7.0 Receiver (RX) Test application, N5991PB7A, for end-to-end transmitter and receiver validation. The goal is to enable faster, automated, end-to-end validation. Specifically, N5991PB7A addresses the challenge of validating...

 Huawei's Tau Scaling Is Really a Hybrid Bonding Bet  - Tau Scaling is just extreme co-design and a hybrid bonding bet. The same \u201Cworkaround\u201D on a leading-edge node only widens the lead for those with EUV.

 Value of South Korean chip giant SK hynix tops $1 tn  - The market value of South Korean memory chip maker SK hynix soared past $1 trillion on Wednesday thanks to frenzied global demand for the computing hardware that powers artificial intelligence tools.

 Curvilinear Masks Push The Limits Of Inspection And Metrology  - Key Takeaways: Curvilinear masks require native data flows across design, mask data prep, writing, inspection, and metrology. Inspection is shifting from finding all defects to identifying which mask variations actually print on wafer. High-NA EUV will intensify inspection challenges, particularly for...

 Taking Custom Logic Further With the Latest CLB Enhancements  - A brief look at the CLB peripheral on the new PIC18F-Q35 microcontroller and how it expands on the CLB from its previous iteration.

 Implementing feature rich applications on entry-level MCUs  - Here is an MCU benchmark, or point of reference, that can be used to figure out if an application is feasible and cost-effective. The post Implementing feature rich applications on entry-level MCUs appeared first on EDN .

 Andy Ault, Hemlock Semiconductor’s SVP of Manufacturing, to Retire  - Ault served for nearly two decades at the company, focusing on safe and efficient production HEMLOCK, Mich. — Hemlock Semiconductor, the nation’s leading producer of hyper-pure polysilicon for the semiconductor and solar industries, today announced that Senior Vice President of Manufacturing Andy...

 From Shrinking Transistors to Compressing Time: Deciphering Huawei’s τ Law  - Huawei's answer to Moore's Law without EUV promises 14A performance by 2031. The post From Shrinking Transistors to Compressing Time: Deciphering Huawei’s τ Law appeared first on EE Times .

 Trusted Convergence Governance: Preserving Admissibility Integrity Across Heterogeneous Semiconductor Systems  - As semiconductor systems evolve toward heterogeneous integration, chiplets, 2.5D and 3D packaging, distributed observability, runtime adaptation, Fleet Learning, and lifecycle convergence governance, the industry is entering a fundamentally new operational reality.

 Huawei’s new chip scaling law aims to sidestep ASML chokepoint but hurdles remain: analysts  - If proven, the innovation marks a significant milestone for Huawei, which has been cut off from advanced semiconductor technology since 2019

 Huawei's chip law looks less like Moore and more like marketing  - Chinese tech biz shows off clever workaround for its process node gap, but it isn't catching up with Intel and TSMC

 France and US funnel billions in quantum race  - France and the US have unveiled major new investments in quantum technology, underlining how quantum computing is becoming the next geopolitical technology battleground after AI and semiconductors.

 IBM and Abertis are Driving the Future of Mobility with a Global Technology Modernization Agreement  - IBM has announced a new five-year global agreement with Abertis, a leading infrastructure and mobility management group, to modernize Abertis's technological infrastructure. The collaboration includes migrating to SAP S/4HANA, and aims to improve system scalability, reliability and user experience across...

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