Accelerating the shift to next-gen SDVs with zonal MCUs - Zonal MCUs deliver the performance, reliability, and flexibility required for next-gen SDVs. The post Accelerating the shift to next-gen SDVs with zonal MCUs appeared first on EDN .
Precision makes headlines, productivity wins markets - Five immersion scanners this year, twenty next year. Speculation about an imminent wave of Chinese lithography systems is causing turbulence in the stock market. In the industry itself, however, there’s little reason for alarm.
TSMC: JASM utilities back to normal, equipment calibration underway; construction resumes - TSMC on Wednesday issued its third statement since a magnitude 7 earthquake struck Kumamoto, Japan on July 28, saying that utility systems at its JASM wafer fab are operating normally, equipment inspection and calibration are in progress, and construction at the site of its second Kumamoto fab has resumed....
Phantom-powered solid-state linear airflow sensor - Self-heated Darlingtion transistor pair linearly senses airflow using just two wires for both power in and signal out. The post Phantom-powered solid-state linear airflow sensor appeared first on EDN .
Beyond Human Intuition: Algorithms Create Foundry-Ready Photonic Circuits - Photonic microchips can process data at extremely high speeds and are embedded in a wide variety of today’s technologies. Researchers at the Max Planck Institute for the Science of Light (MPL) and Harvard University have now succeeded in developing three functional components for such chips that are...
Quadric Extends Series C to $46 Million as Edge AI Demand Accelerates - Quadric has extended its Series C financing to $46 million through a second close led by the International Finance Corporation, the private-sector investment arm of the World Bank Group. The transaction raises Quadric’s total capital secured to approximately $90 million and strengthens its ability to...
[News] China’s Lens, BOE Advance Glass Substrates as Taiwan’s Supply Chain Prepares for TSMC’s CoPoS - Competition in glass substrate-based advanced packaging is intensifying across the semiconductor industry. According to Central News Agency, China is accelerating investment in glass substrate-based advanced packaging, while Taiwan is stepping up efforts to strengthen its competitiveness by integra......
OpenAI's IPO Filing Meets a Hugging Face Breach as AMD Claims 75% Hyperscaler CPU Share - OpenAI files for a trillion-dollar IPO the same week a pre-release model breaches Hugging Face and 42 state attorneys general open a coordinated investigation. Patrick Moorhead and Daniel Newman also break down AMD's hyperscaler CPU numbers from Advancing AI, the Moonshot distillation accusations, a wave...
EP 185: AMD Advancing AI, Intel Earnings and WFE Demand - In this episode of The Circuit, hosts Ben Bajarin and Jay Goldberg review major updates across the semiconductor industry, beginning with AMD’s Advancing AI Day where they discuss CEO Lisa Su’s performance, the technical details of the Helios rack-scale architecture, and AMD's strategic fit for inference...
Low-temperature technique grows crystal-aligned semiconductor films - Building next-generation semiconductors and low-power electronic devices requires precisely stacking materials with different functions. In this process, it is essential to preserve each material's intrinsic properties, as ...
TSMC raises 2026 capex to as much as $64B - TSMC has increased its 2026 capital expenditure budget to 60-64 billion dollars, up from the previously indicated 52-56 billion dollars, citing stronger-than-expected structural demand for AI and high-performance computing.
Breaking Down Barriers: A Roadmap to Perfect Contacts in 2D Electronics - As two-dimensional (2D) materials emerge as leading candidates for next-generation electronics, a critical challenge remains: the quality of electrical contact with metal electrodes. A new review published in Nano Research systematically explores the dual nature of the Schottky barrier at 2D material–metal...
Physics modelling cracks the code for thermal mechanics - DAC 2026: Among the start-ups at this year’s conference, Vinci was one of the most progressive, with a physics-bsed AI software platform for predictive hardware design. The company introduced its […] The post Physics modelling cracks the code for thermal mechanics appeared first on Electronics Weekly...
Australia capital markets ride AI deal wave as cloud startups target listings - Australia's capital markets have picked up pace on the back of AI-related demand, with listings and equity raisings reaching US$11.4 million in the first half of 2026, up from US$10.6 billion in the first half of 2025, according to Bloomberg . This growth has been driven in part by investors seeking exposure...
[News] Chinese Advanced Packaging Firms Kicks-Start a New Round of Capacity Expansion - China is witnessing a fresh wave of investment in advanced semiconductor packaging, with a series of expansion projects targeting AI computing, automotive-grade chips, and next-generation memory technologies. According to incomplete statistics, nearly ten major advanced packaging projects have be...
Microchip Acquires Edge AI Chip Startup Hailo - Return to playbook for the acquisition-driven embedded giant. The post Microchip Acquires Edge AI Chip Startup Hailo appeared first on EE Times .
Nanoreactor Mimics Living Cells To Supercharge Artificial Photosynthesis - A biomimetic nanoreactor combines cellular design principles to produce hydrogen peroxide efficiently under visible light. Inside a hollow nanoscale structure, researchers have recreated two strategies that living cells use to control chemical reactions. The resulting CdS@polydopamine nanoreactor offers...
Why analog anti-tamper security IP is crucial in the PQC era - While PQC secures cryptographic algorithms, analog anti-tamper IP protects the physical implementation of those algorithms. The post Why analog anti-tamper security IP is crucial in the PQC era appeared first on EDN .
Insight: GenAI Assistants and the Premium Car Buyer: Why Spend Outpaces Preference - Premium vehicle owners are adopting Generative AI assistants at more than double the rate of Non-Premium owners, and they are more willing to pay for the privilege at every price point tested. Yet when forced to weigh AI against nine other in-vehicle technologies, Premium owners' preference for it, while...
Chip Industry Technical Paper Roundup: July 28 - HW methods to throttle AI; M3D DRAM; interconnect signal-integrity analysis; 3D mask effects in high/hyper-NA EUV litho; compute-in-interconnect and memory; NbAs nanowire interconnects; and 3D conformal thin-film patterning. The post Chip Industry Technical Paper Roundup: July 28 appeared first on Semiconductor...
Schurter buys majority stake in Biaodi - Schurter has bought a majority stake in Biaodi, the Wuhan, China-based of developer of high‑voltage circuit protection products for electric vehicles and new energy applications. “Biaodi fills key gaps in […] The post Schurter buys majority stake in Biaodi appeared first on Electronics Weekly ....
Cadence’s Agentic AI Design Vision Takes Center Stage at DAC - Explore Cadence IP here AI infrastructure demands are changing what semiconductor design must solve. The challenge is no longer only about creating faster silicon; it is about designing complete systems where silicon, advanced packaging, PCB, power delivery, thermal behavior, and …
Global Thinking - BEFORE long, every British manufacturer of electronic products will be faced with a key decision: to extend his horizon to global limits or accept the probability of being dangerously crowded […] The post Global Thinking appeared first on Electronics Weekly .
The security imperative for software-defined vehicles - The automotive industry has undergone a major transformation, shifting from traditional hardware-centric vehicles to software-defined vehicles (SDVs). Unlike conventional cars, Continue Reading The post The security imperative for software-defined vehicles appeared first on EDN .
The American Dream - 69% of those interviewed by Gallup in the beginning of the year say that they will achieve it in their lifetime. This is in contrast, though, to 54% saying that […] The post The American Dream appeared first on Electronics Weekly .
Insight: Navitas and Magnachip Partner to Scale Ultra-High-Voltage SiC - Navitas Semiconductor and Magnachip Semiconductor have announced a strategic partnership to accelerate the adoption of high-voltage (HV) and ultra-high-voltage (UHV) silicon carbide (SiC) power technologies. Under the agreement, Magnachip will license Navitas’ GeneSiC™ Trench-Assisted Planar (TAP)...
Physical AI Isn’t Just Bigger AI; It’s a Systems Architecture Challenge - Physical AI wins by fusing sensors, edge compute, and feedback loops. Learn why systems, not TOPS, matter. The post Physical AI Isn’t Just Bigger AI; It’s a Systems Architecture Challenge appeared first on EE Times .
Synopsys unveils autonomous workflows agents - One the first anniversary of its acquisition of Ansys, Synopsys demos autonomous design verification agents for EDA and CAE (computer aided engineering) design. The agents have been developed with Nvidia, […] The post Synopsys unveils autonomous workflows agents appeared first on Electronics Weekly...
The ESP32 Gets a Web Browser - At the Hackaday Europe conference in Italy earlier in the year, we were shown a rather interesting device. The work of [Alun Morris], it was an ESP32-powered Cheap Black Display …read more
Nanoseconds Matter: The Critical Role of Timing in High Frequency Trading - Behind every fast trade is a hidden layer of precise timing. Explore how accurate synchronization supports today’s electronic and high‑frequency trading systems, helping events to be recorded correctly, systems to stay aligned and performance goals to be met.
From Co-Packaged Optics to Nanolasers: Photonics Moves Inward - CEA-Leti, Scintil Photonics, and NcodiN show how optical interconnects are moving from data center racks toward co-packaged optics and chiplet-level communication. The post From Co-Packaged Optics to Nanolasers: Photonics Moves Inward appeared first on EE Times .
Blog Review: July 29 - Rethinking AI compute; DFI 6; 3D-IC reliability; local AI in browser; surface prep and cleaning. The post Blog Review: July 29 appeared first on Semiconductor Engineering .
To Blink or Not to Blink? A New Criterion to Quantify Luminescence Blinking - Colloidal semiconductor quantum dots are promising materials for numerous applications due to their tunable emission and high quantum yields. However, emission instability in the form of luminescence blinking remains a significant obstacle to their practical implementation. While recent advances in synthesis...
Semiconductor Supply Chain Assessment of July 28 Kumamoto Earthquake - There is still no confirmed material semiconductor-supply interruption. The operational disclosures (summarized below) are reassuring for Marumae and Senju Metal, while HORIBA has confirmed no major damage but has not committed to a restart date. JASM, Sony, and Fujifilm remain the principal unresolved...
Top Ten Techno Songs - 1. The Bells – Jeff Mills 2. Energy Flash – Joey Beltram 3. Age of Love – Age of Love (Charlotte de Witte & Enrico Sangiuliano Remix) 4. Spastik – […] The post Top Ten Techno Songs appeared first on Electronics Weekly .
Smart Surfaces for Ultra-Fast Networks: José-Luis González Jiménez Honored at EuMW - A research engineer at CEA-Leti since 2011, José Luis González Jiménez develops innovative 6G technologies based on silicon integrated circuits and systems, sub-terahertz waves and reconfigurable intelligent surfaces. Recognized at the European Microwave Week (EuMW), his work paves the way for ultra-fast,...
Interview with Simon Davidmann, AI + EDA Researcher and Former CEO of Imperas - Simon Davidmann is a renowned EDA industry pioneer and serial technology entrepreneur with more than 40 years of experience in simulation and verification. After Synopsys acquired Imperas, which he founded in 2005, he was Synopsys Vice President responsible for Processor Modeling and Simulation. He left...
Swallowing A Good Yarn - For decades the techies of Silicon Valley have known that Washington will swallow a good yarn. After all, not many people understand what the techies are up to at the […] The post Swallowing A Good Yarn appeared first on Electronics Weekly .
Rapid scale-up in data center: The case for distributed optical circuit switching - Distributed optical circuit switching (dOCS) gives data center operators a rapid scale-up option while the rest of optical roadmap matures. The post Rapid scale-up in data center: The case for distributed optical circuit switching appeared first on EDN .
Critical Subsystems Graphics and Performance Indicators - This report comprehensively analyzes semiconductor supply chain from manufacturing to end devices. Quarterly data covers equipment trends, sales, and growth, while annual data focuses on supply chain performance, market revenue, and diffusion rates by industry (SEMI, FPD, PV). TechInsights contributes...
Toward More Compact GaN CMOS Devices for Power Electronics - As part of the Carnot ePMOS project, a CEA-Leti research team conducted an in-depth study of a key building block of GaN CMOS technology: PMOS transistors. Combining numerical simulations with experimental work, the project delivered significant results that pave the way for reducing the size of GaN CMOS...
[News] Q2 Memory Earnings Preview: What to Watch From Samsung, SK hynix, and Kioxia - As AI continues to drive memory demand, the earnings of the world's leading memory makers are drawing close industry attention. According to TechNews, the three major memory manufacturers—SK hynix, Samsung Electronics, and Japan's Kioxia—are all set to report their latest quarterly earnings this......
