Semi. Fabs and Clean Rooms 5½h ago: Recent posts emphasize the extreme precision and long timelines (104 weeks) for new semiconductor fabs, with VDL Groep expanding cleanrooms in Georgia. GlobalFoundries and TSMC announced a $2B deal for silicon interposer capacity in New York ramping 2028. Applied Materials outlined 2030 targets including market share gains and doubled R&D capacity amid ongoing cleanroom bottlenecks.
Chip Stocks Set to Erase $1 Trillion in Value as Rout Deepens - A closely watched gauge of semiconductor stocks is on pace to erase more than $1 trillion in market value as concerns mount over higher interest rates, stretched valuations and the enormous cost of building artificial-intelligence infrastructure.
Analysis: AI Datacenter Networking Vendor Spotlight - Zhongji InnoLight - Zhongji InnoLight’s market dominance in 800G and 1.6T optical transceivers has driven unprecedented financial growth and crowned its 2026 Hong Kong IPO as the year’s largest listing. This Vendor Spotlight provides a comprehensive analysis of InnoLight’s corporate evolution, manufacturing infrastructure,...
Panasonic exhibits at Enlit Europe 2026 - Panasonic’s product solutions empower customers to create and manufacture sustainable, dependable and interconnected products
US CPI Surge Leaves New York Markets Mixed - Semiconductor stocks weakened. Micron Technology fell by 1.10% from the previous trading day, while AMD, Intel, and SanDisk declined by 2.95%, 2.42%, and 2.60%, respectively.
Did Intel’s Cost Cutting Bite Them? - Intel's Foundry arm is picking up the customers SemiAccurate told you about last year, but is this a good thing? Read more ▶ The post Did Intel’s Cost Cutting Bite Them? appeared first on Semiaccurate .
New platform tackles critical material risks in electric motors - As manufacturers face growing uncertainty tied to critical material shortages and global supply chain disruptions, the Department of Energy's (DOE) Oak Ridge National Laboratory (ORNL) researchers have developed a super intelligence ...
TechPoint buys Esprit Electronics for EMS growth - TechPoint has announced it is buying Esprit Electronics, to strengthen its UK manufacturing capability and support its growth ambitions, says the company. “We’re delighted to welcome the Esprit Electronics team […] The post TechPoint buys Esprit Electronics for EMS growth appeared first on Electronics...
Why Heat Is Becoming A Bigger Chip Design Issue - Increasing complexity requires thermal, electrical, and mechanical effects to be analyzed together. The post Why Heat Is Becoming A Bigger Chip Design Issue appeared first on Semiconductor Engineering .
How To Define CPU And Software Stack Performance For Agentic AI - Measuring the performance demands of agentic AI; assessing CPU bottlenecks, SW stack efficiency, and system-level tradeoffs. The post How To Define CPU And Software Stack Performance For Agentic AI appeared first on Semiconductor Engineering .
NXP's P3B1602DP Brings the Industry's First I3C Bus Buffer to Market - As I3C adoption accelerates across next-generation computing and embedded systems, NXP recognized a critical infrastructure gap: designers needed a purpose-built buffer that could preserve I3C performance while supporting voltage translation, larger bus capacitance, and longer PCB traces.
Apple heads Home: Distributed identity validation, and how much does Matter matter? - Apple branding is key to its resurrected smart home “push”. Broader ecosystem compatibility, also feasible, is absent from the messaging. The post Apple heads Home: Distributed identity validation, and how much does Matter matter? appeared first on EDN .
Amperesand Aims to Smooth AI Data Center Power Spikes - See how Amperesand’s solid-state transformers aim to tame AI data center power spikes with batteries, 800 VDC conversion, and microgrid control. The post Amperesand Aims to Smooth AI Data Center Power Spikes appeared first on EE Times .
Agentic AI Automates RTL Waveform Analysis And Debugging (Columbia, Google) - Researchers at Columbia University, Google DeepMind, and Google published a technical paper titled “Back to the Future: Rethinking EDA Infrastructure for Agentic Systems in Chip Design Verification.” Abstract “The unprecedented computational scale of modern artificial intelligence depends on complex,...
嘉和半導體 GaNrich 布局 40V–1200V 全系列 GaN 功率元件，加速全球市場滲透 - 嘉和半導體聚焦氮化鎵（GaN）功率半導體技術，以自主研發、台灣製造為核心，針對目前市場上氮化鎵最成熟之兩大基板材料，建構 GaN on Si 與 GaN on Sapphire 雙晶圓技術平台，產品涵蓋 40V–250V 低中壓及 650V–1200V 高壓 GaN 功率元件，應用橫跨...
AMD Unveils CPU-Centric Helion AI Rack for Agentic AI - AMD announced on Oct. 12 at the Open Compute Project (OCP) Global Summit in San Jose, California, that it has unveiled Helion, a computing infrastructure design for artificial intelligence (AI) data centers built around central processing units (CPUs).Unlike its existing Helios platform, which comb...
5G chips and modules power phones, wearables, IoT, and vehicles - The latest 5G chips and modules target a range of applications, from smartphones and wearables to industrial IoT and connected vehicles. The post 5G chips and modules power phones, wearables, IoT, and vehicles appeared first on EDN .
Chip Industry Technical Paper Roundup: Oct. 13 - M3D mem-TFT neuromorphic computing; 2D semiconductor nucleation; ultrathin high-κ dielectrics; hyper-NA EUV litho; bit-flip attack detection in AI accelerators; programmable DRAM controllers; foundry-compatible photonic bends. The post Chip Industry Technical Paper Roundup: Oct. 13 appeared first on...
[OCP in Focus] Lisa Su Calls 2026 “Year of Inference” as AMD Lifts 2030 CPU TAM Forecast to $200B+ - AMD CEO Lisa Su expressed strong confidence in the CPU market’s growth prospects during her keynote at the OCP Global Summit 2026 on October 12. Here are the key takeaways from her remarks, as captured by TrendForce on-site. CPU TAM Forecast Raised to Over US$200B by 2030 AMD CEO Lisa Su expects......
AI silicon tapeout: Can it beat a benchmark engineers trust? - Can the engineering data prove the improvement in silicon design rather than relying on one successful run or thousands of tool logs? The post AI silicon tapeout: Can it beat a benchmark engineers trust? appeared first on EDN .
SUSS Introduces GreenTec Wafer-Cleaning Platform at SEMICON West - SUSS MicroTec SE, a supplier of equipment and process solutions for the semiconductor industry, today announces its entry into the wafer-level cleaning market with the launch of the new GreenTec Solutions product line and the introduction of its first system, the GT200. The post SUSS Introduces GreenTec...
Applied Materials Bets $5B on a New Model for Chip Innovation - Applied Materials’ $5 billion EPIC Center brings chipmakers, equipment suppliers, and researchers together to accelerate semiconductor R&D and commercialization. The post Applied Materials Bets $5B on a New Model for Chip Innovation appeared first on EE Times .
Unpacking Marvell's Analyst Day, OpenAI Revenue Rumors, and the Heterogeneous Rack - In this episode of The Circuit, Ben Bajarin and Jay Goldberg kick off a packed conference week (Semicon West, Applied Materials' EPIC Center launch, and the sold-out OCP Summit) before diving into Marvell's upbeat Analyst Day in New York. They examine how Marvell has shifted its narrative beyond Amazon...
Ofcom and JOINER to study satellite spectrum coexistence - Ofcom and the JOINER Platform – a research network initiative – have agreed to collaborate to provide technical evidence for Ofcom’s consideration of future spectrum policies The goal is to […] The post Ofcom and JOINER to study satellite spectrum coexistence appeared first on Electronics Weekly...
Beyond Lithography: 3D Scaling Puts New Demands on Materials - ASM International shows how building increasingly complex 3D devices requires advances in materials and processes. The post Beyond Lithography: 3D Scaling Puts New Demands on Materials appeared first on EE Times .
CTO Interview with Sirish Munipalli of Moores Lab AI - Sirish Munipalli is Co-Founder and CTO of Moores Lab AI, where he leads the development of agentic AI for chip design verification, including SpecAgent(tm), the company’s specification and modeling platform. He has spent about 15 years designing and verifying complex silicon: FPGA prototyping at Intel,...
Characterization of HBM Power Consumption (ETH Zurich, NYU) - Researchers at ETH Zürich and New York University published a technical paper titled “Understanding the Power Consumption of Modern High Bandwidth Memory: Experimental Analysis and Modeling Using Real HBM2 DRAM Chips.” Abstract Excerpt: “We perform the first comprehensive experimental characterization...
Extending the Mission Envelope of High-Performance Plastic MCUs - The new SAMV71Q21RT extends the mission envelope of high-performance radiation-tolerant MCUs with 50 krad(Si) TID capability and an enhanced Plastic Class 1 quality grade equivalent to QML Class P. Built from the proven SAMV71 architecture, it gives space designers greater flexibility to balance radiation...
10 years of TME Education – a decade of supporting technical education - Learn more about TME Education – an educational project based on practical learning and collaboration with local communities. The post 10 years of TME Education – a decade of supporting technical education appeared first on Electronics Weekly .
BOK's Shin highlights need to curb inflation amid chip boom, Middle East conflict - BOK's Shin highlights need to curb inflation amid chip boom, Middle East conflict Bank of Korea Gov. Shin Hyun-song cited the need to “get inflation down,” and added that getting monetary policy right was “absolutely key” ahead of next week’s rate meeting. 10/14/2026 - 08:06 AM
IMF cuts Korea's debt-to-GDP forecast through 2031 - IMF cuts Korea's debt-to-GDP forecast through 2031 The International Monetary Fund lowered its forecast for Korea’s government debt-to-GDP ratio through 2031, citing strong economic growth and improving tax revenue prospects. 10/14/2026 - 12:21 AM
Blog Review: Oct. 14 - Engineers' role in autonomous workflows; UALink over UCIe; GDDR7; on-device speech filtering. The post Blog Review: Oct. 14 appeared first on Semiconductor Engineering .
SK hynix sees 20-fold AI infrastructure growth - SK hynix sees 20-fold AI infrastructure growth The chipmaker forecasts a 20-fold increase in AI infrastructure performance by 2030 as inference demand drives new memory needs. 10/14/2026 - 02:56 AM
Does It Run… Duke Nukem 3D? - When id Software released DOOM back in 1993 it helped define the genre, but it was hardly the only hit first-person shooter of that decade. There was also 3D Realms’ 1996 Duke …read more
Nikon Unveils Digital Lithography System for Advanced Semiconductor Packaging - Nikon Corporation will release the DSP-110 digital lithography system for semiconductor advanced packaging in April 2027. The post Nikon Unveils Digital Lithography System for Advanced Semiconductor Packaging appeared first on Semiconductor Digest .
中 CXMT 쇼크?...4F스퀘어 D램 연내 상용 파급력은 - 중국 최대 D램 제조업체인 창신메모리테크놀로지(CXMT)가 예상을 뛰어넘는 기술 개발 속도로 업계의 주목을 받고 있다. 최근엔 올 연말까지 '4F스퀘어 D램' 기반의 서버용 D...
Global Smartphone Revenues, ASPs & Price-Tier Forecasts: 2008 to 2031 - TechInsights forecasts global smartphone wholesale revenue to rise 13.7% in 2026 to US$447 billion, despite a 9.1% fall in sell-through volumes. Higher memory costs and a richer model mix will lift the global ASP from US$335 to US$419. Volumes dip again in 2027 before returning to growth, while revenue...
10 years of TME Education – a decade of supporting technical education - Learn more about TME Education – an educational project based on practical learning and collaboration with local communities. The post 10 years of TME Education – a decade of supporting technical education appeared first on Electronics Weekly .
Seagate Named One of America’s Greenest Companies 2027 - Seagate Named One of America’s Greenest Companies 2027 For the second consecutive year, Seagate Technology has been recognized as one of America's Greenest Companies by Newsweek, in partnership with Plant-A Insights Group and sustainability data provider GIST Impact.
Excelitas to Consolidate Four U.S. Luxium Brands - Excelitas’ subsidiary Luxim Solutions, which it acquired in October 2025, made a legal entity change to four of its entities. Effective January 2027, Luxium Solutions, Reflectivity Holdings, PLX, and Inrad Optics will merge with and into Excelitas Technologies, with Excelitas Technologies Corp. remaining...
Cybersecurity through the attacker’s eyes - As cyberattacks become more sophisticated in the AI era, organizations must rethink security from an attacker’s perspective. Drawing on insights from Red Team testing, this article explores how to visualize risks and improve organizational resilience.
Tata Chair Defends Nation-Building Bets Over Short-Term Returns - Tata Sons Pvt. Chairman Natarajan Chandrasekaran said the group will keep building what India and the world need, including semiconductor chips, even if these projects are slow to deliver amid a tussle with owners who are pressing for quicker returns.
On-Chip Monitors Detect Bit-Flip Attacks in AI Accelerators (UF, UT Dallas, RPI) - Researchers at the University of Florida, University of Texas at Dallas, and Rensselaer Polytechnic Institute published a technical paper titled “BARE-AI: Bit-Flip Attack Resilience in AI Hardware through Built-in Performance Monitors.” Abstract Excerpt: “Deep Neural Networks (DNNs) are integral...
Exclusive: Over 3,000 Hong Kong investors enter Korean market as city ranks second-largest net buyer - Exclusive: Over 3,000 Hong Kong investors enter Korean market as city ranks second-largest net buyer About 3,500 Hong Kong retail investors entered Korea’s stock market through Hana Securities accounts, helping Hong Kong become the second-largest foreign net buyer of Korean equities this year. 10/12/2026...
CTO Interview with Dr. Zakir Syed of ClockEdge - Dr. Zakir Syed is Co-founder and Chief Technology Officer of ClockEdge, where he has played a central role in developing specialized simulation technology for advanced semiconductor clock networks. He brings more than 30 years of experience in electronic design automation and semiconductor verification....
Dell's Tailwinds - Why I drive my agents run from a Dell XPS, and fine-tuned models for Enterprise AI
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ChipAgents, NVIDIA Launch Benchmark for Autonomous Chip Design - ChipAgents, the agentic AI platform for semiconductor engineering, today introduced Build-A-Chip-Bench, a benchmark built in collaboration with NVIDIA designed to test whether AI agents can carry an end-to-end digital chip-design task from specification through physical implementation and verified GDS;...
Updated rack enclosures offer flexible design options - METCASE has redesigned its COMBIMET 19-in. rack-mount enclosures to provide greater rigidity and more usable panel space. The post Updated rack enclosures offer flexible design options appeared first on EDN .
Coherent Phonon Generation from Prethermal Carrier Populations in a Semiconductor - Ultrafast laser excitation of carriers in semiconductors often results in the creation of fully symmetric coherent optical phonons, typically understood in terms of a thermalized transient carrier population. We test this understanding with systematic measurements and first-principles calculations of...
Ultrafast oxide-ion conductors offer route to low-temperature fuel cells - Solid-oxide fuel cells (SOFCs), which convert chemical energy directly into electrical power, are promising energy-conversion technologies because they can operate on various fuels, including hydrogen, natural gas and biogas.
ASML’s Guidance Key to Instill Confidence in Fragile Chip Trade - ASML Holding NV’s guidance for building out capacity has become a crucial new part of the Dutch company’s earnings days, and will be even more so this time as investors seek signs of reassurance in the sector’s faltering rally.
Simplify Electronic-Photonic Design Workflows: eBook - The natural evolution of EDA, extending proven design methodologies to include photonic devices, circuits, and systems. The post Simplify Electronic-Photonic Design Workflows: eBook appeared first on Semiconductor Engineering .
Generative AI On A General-Purpose Neural Processor (GPNPU) - A single processor architecture that unifies scalar, vector, and matrix execution in one ISA and one C++ programming model. The post Generative AI On A General-Purpose Neural Processor (GPNPU) appeared first on Semiconductor Engineering .
Interview with Eric Hong, VP of Engineering at Mixel, a Silvaco Company - Eric Hong is Vice President of Engineering at Mixel, a Silvaco company, where he leads the development of analog and mixed-signal IP, including high-speed PHY and SerDes solutions. Prior to Mixel, he held engineering leadership and technical roles at Nvidia, eSilicon, Samsung Electro-Mechanics, and Intel,...
2026-2027 CMR Sputtering Targets - This Critical Materials Report delivers a cohesive view of the 2026-2027 semiconductor sputtering targets materials market, combining demand forecasts, supply dynamics, competitive positioning, and pricing trends. It describes the value chain through profiling key players while identifying critical dependencies,...
Interview with Eric Hong, VP of Engineering at Mixel, a Silvaco Company - Eric Hong is Vice President of Engineering at Mixel, a Silvaco company, where he leads the development of analog and mixed-signal IP, including high-speed PHY and SerDes solutions. Prior to Mixel, he held engineering leadership and technical roles at Nvidia, eSilicon, Samsung Electro-Mechanics, and Intel,...
CTO Talk: Denis Zelenin of Pacific MicroCHIP - In 2026, Pacific MicroCHIP marks 20 years of ASIC design services and turnkey solutions. We spoke with CTO Denis Zelenin about that journey, the company’s growing range of products—from a 56 GS/s ADC to RF spectrometers—and what customers increasingly expect from custom silicon. Tell me a bit about...
China’s chip challenge demands a rethink of Korea’s economic policies - China’s chip challenge demands a rethink of Korea’s economic policies CXMT’s next-generation memory push and a sharp Kospi sell-off expose risks to Korea’s semiconductor-led economic outlook. 10/13/2026 - 11:01 AM Opinion Desk
COMSOL Conference 2026 Centers Users, New Features - COMSOL is in the midst of its end of year series of conferences, having just wrapped up the COMSOL Conference 2026 in Boston. That show was preceded by one in Cambridge, England, and will be followed by conferences in Tokyo; Shenzhen, China; Taipei,...
The next phase of AI growth starts with infrastructure - Artificial Intelligence The next phase of AI growth starts with infrastructure AI growth is testing power, materials and infrastructure. Smarter storage can help improve efficiency and maximize existing compute.
Show Daily 2026 — Day One - View or Download the SEMICON West Show Daily — Day One! The post Show Daily 2026 — Day One appeared first on Semiconductor Digest .
Machines that think: AI in the lab - This is the eighth part in a series on how AI is crossing out of software and into the physical world. This time, Jan Bosch looks at AI-driven discovery.
Samsung, AMD showcase CXL memory sharing for AI servers at OCP Summit - Samsung, AMD showcase CXL memory sharing for AI servers at OCP Summit Samsung Electronics and AMD demonstrated CXL technology that lets AI servers share pooled memory, improving capacity and performance for AI inference workloads at the OCP Global Summit. 10/13/2026 - 02:25 AM LEE JAE-LIM
HV hot-swap controller for digital power-path protection - Infineon has introduced the XDP8HD40S-1, a high-voltage hot-swap controller designed for digital power-path protection and monitoring in next-generation AI server power architectures operating at ±400 Volt and 800 VDC. As […] The post HV hot-swap controller for digital power-path protection appeared...
Polar Collaborates with IC-Link by imec to Manufacture 8-inch GaN Technology - BLOOMINGTON, Minn., USA and Leuven, Belgium, October 12, 2026 – Polar Semiconductor, LLC (“Polar”), a U.S.-owned and operated foundry specializing in high-voltage, power, and sensor technologies, and IC-Link by imec, imec’s design and manufacturing service, today…
Chips&Media targets AI memory bottlenecks with new compression IP - Chips&Media has announced a data compression technology aimed at one of the constraints in artificial intelligence hardware: moving data fast enough to keep processors busy. The South Korean semiconductor intellectual property supplier says its new Feature Map Compression IP marks an expansion beyond...
The secret life of ferrite bead: More than just a lump on a wire - A ferrite bead isn’t just a mysterious black cylinder; it can be an engineer's secret weapon for turning pesky high-frequency noise into harmless heat. The post The secret life of ferrite bead: More than just a lump on a wire appeared first on EDN .
You are not prepared for what is to come. -Alia Atreides
