Strain gauges: Turning stress into signal - These tiny sensors convert deformation into electrical signals with remarkable precision. The post Strain gauges: Turning stress into signal appeared first on EDN .
Physicists Solve Major Challenge in Quantum Synchronization - A theoretical study shows how nonreciprocal quantum synchronization could be achieved in real-world systems. Three theoretical physicists at RIKEN have proposed a new way to achieve one-way quantum synchronization in phonons. The method is designed to remain stable even when real-world obstacles, including...
Lite-On posts 25% year-on-year revenue jump in April on AI power and BBU demand - Lite-On Technology reported April consolidated revenue of NT$16.7 billion (US$530 million), up 1% from March and 25% from a year earlier, marking the company's highest monthly intake in nearly seven and a half years, the firm announced. The company said that strong demand for power management systems...
TSMC and Sony Plan Image Sensor Joint Venture in Japan - Sony Semiconductor Solutions and Taiwan Semiconductor Manufacturing Company have signed a non-binding memorandum of understanding to explore a strategic partnership for the development and manufacturing of next-generation CMOS image sensors. Under the proposed structure, the two companies intend to establish...
King Slide says AI compute demand is not a bubble and expects strong 2Q26 orders - King Slide, a maker of server rails and high-end mechanical components, said on May 7 that AI compute demand is not a bubble and that orders were expected to remain strong in the second quarter of 2026 as global cloud service providers continued rapid capital spending. Executives told an earnings call...
Quanta, Compal notebook shipments sink 30%-plus in April as Q1 pull-forward hangover hits - Quanta Computer and Compal Electronics, two of Taiwan's largest notebook contract manufacturers, posted April shipment declines exceeding 30% as a wave of orders pulled into late March left the following month with little to fill. The drop reflects a familiar quarter-end timing pattern rather than a demand...
Wooptix Targets AI Packaging Bottleneck with Astronomy Tech - A Canary Islands startup brings wavefront imaging to semiconductor metrology, aiming to tackle wafer shape challenges in 3D integration. The post Wooptix Targets AI Packaging Bottleneck with Astronomy Tech appeared first on EE Times .
CEO Interview with Matt Crowley of Scintil Photonics - Matt Crowley is Chief Executive Officer of Scintil Photonics. A physicist by training, Matt built his career transitioning advanced semiconductor technologies from development to volume manufacturing. Before Scintil, he led MEMS technology company Vesper Technologies to high-volume production and through...
Powering Robotics and Drones with MediaTek Genio - AI is rapidly moving into the physical world, giving rise to physical AI. This shift enables systems to perceive, decide, and act in real time, interacting directly with dynamic, unpredictable environments. Robotics and commercial drones are at the forefront of this evolution, driving new levels of......
Edmund Optics adds to motorised stages - Edmund Optics, the optical and imaging components specialist , has expanded its portfolio of motorized stages, bringing together in-stock availability with a broad range of configurable motion solutions for industrial or scientific applications. The offering supports both fully motorized, software-controlled...
Scientists Discover a New Way To Control Metals at the Atomic Scale - The discovery could help make electronics faster and more energy efficient. Researchers at the University of Minnesota Twin Cities have found a new way to change how a metal behaves electronically by controlling atomic-level interactions at the boundary where two materials meet. The study, published in...
ChromeOS performance leadership: The MediaTek Kompanio Ultra 910 Advantage - Signal 65 has investigated, tested, and written a white paper that fully details the performance of the MediaTek Kompanio Ultra 910 in ChromeOS. The paper covers testing every subsystem within the chip, including power efficiency, thermal performance, and AI performance, as well as how the chip...
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