REVEAL Project - The strategy adopted for protecting pancreatic islets from immune rejection is to microencapsulate them in soft, porous, biocompatible microcapsules. CEA-Leti was project coordinator and leader for microcapsule production, characterisation, dissemination and planned usage.
Silly simple supply sequencing - A simple analog-based supply sequencing solution using an SPDT switch for ON/OFF control and RC time constants, as well as Schmidt triggers. The post Silly simple supply sequencing appeared first on EDN .
Six critical trends reshaping 3D IC design in 2026 - Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling. The post Six critical trends reshaping 3D IC design in 2026 appeared first on EDN .
I Doff My Cap to the New Hailo RPi AI HAT+ 2 - As usual, my head is aswirl (like “awash,” but a tad less rambunctious) with cogitations and ruminations about all the once-impossible things I’ve been exposed to recently. I feel like the White Queen in Through the Looking-Glass by Lewis Carroll, who famously said, “Why, sometimes I’ve believed...
One-on-One With proteanTecs CEO Shai Cohen - Inside the whirlwind changes across the chip industry. The post One-on-One With proteanTecs CEO Shai Cohen appeared first on Semiconductor Engineering .
HBF challenges HBM - High Bandwidth Flash (HBF) using stacked DRAM and NAND die in the same package is seen as a challenger to HBM particularly for inference. Used with the Blackwell B200, HBF delivered a performance per watt improvement of 2.69× over HBM, says Hynix. HBF is seen as well-suited for inference because of the...
TDK expands NTC thermistor series for automotive power modules - TDK is expanding its NTCSP series of NTC thermistor components with two new options. For temperature detection and temperature compensation, they are primarily aimed at automotive power modules. For example, applications such anti‑lock braking systems (ABS), transmissions, and engines. As mentioned,...
[News] Breaking HBM Barriers: Samsung’s zHBM vs. Intel’s Z-Angle Memory - As conventional HBM designs continue to face thermal and stacking limits, major semiconductor players are exploring innovative memory architectures. In early February, Intel, in collaboration with SoftBank’s subsidiary SAIMEMORY, showcased a prototype of Z-Angle Memory (ZAM). Meanwhile, ZDNet repo......
Using integration and differentiation in an oscilloscope - A few practical examples of applying an oscilloscope’s integration and differentiation math to common electrical measurements. The post Using integration and differentiation in an oscilloscope appeared first on EDN .
Detecting Architectural Vulnerabilities in Closed-Source RISC-V CPUs (CISPA) - The paper “RISCover: Automatic Discovery of User-exploitable Architectural Security Vulnerabilities in Closed-Source RISC-V CPUs” was published by researchers at CISPA Helmholtz Center for Information Security. Abstract “The open and extensible RISC-V instruction set has enabled many new CPU vendors...
The Ever-Innovative Market of Green Energy - From atomic nuclei and the sun to hydrogen and recycled fuels, energy sources today originate from a vast array of sustainable sources. This article covers some of the largest up and coming energy sources that contribute to clean energy efforts worldwide.
Applied Materials to Participate in Upcoming Investor Conferences - SANTA CLARA, Calif., Feb. 17, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced that members of its management team will participate in fireside chats at upcoming investor conferences. Dr. Prabu Raja, President, Semiconductor Products Group, will participate at the Morgan Stanley
Crunch-time for social media’s addictive practices - Social media is facing a crunch as the lawsuit alleging Meta pursued addictive practices to hook young people got underway in a Los Angeles court yesterday. The plaintiff, referred to as Kaley, says Meta’s platform was deliberately designed to be addictive through features like infinite scroll, autoplay,...
The Chip Insider®–TSMC's N2 Production Launch - Discover how TSMC’s N2 uses GAA and sets up the jump to A16, staying strong against Intel 18A while Samsung takes bigger risks to catch up.
BE Semiconductor Industries N.V. Announces Q4-25 and Full Year 2025 Results - Q4-25 Revenue of € 166.4 Million and Net Income of € 42.8 Million Up 25.4% and 69.2%, Respectively, vs Q3-25. Orders of € 250.4 Million Up 43.3% vs. Q3-25 and 105.4% vs. Q4-24. FY-25 Revenue of € 591.3 Million and Net Income of € 131.6 Million. Orders of € 685.0 Million Up 16.8% vs. FY-24....
AI in 2026: Enabling smarter, more responsive systems at the edge - After years of rapid advancement in cloud‑centric AI training and inference, the industry is reaching an edge AI tipping point. The post AI in 2026: Enabling smarter, more responsive systems at the edge appeared first on EDN .
Nanoengineers realize an on-chip excitonic hyperlens - When light passes through materials, it typically changes direction and bends in predictable ways. This change in direction, known as refraction, is caused by a change in the speed of light as it enters a new medium. In some ...
