Semi. Fabs and Clean Rooms 7¼h ago: Recent X posts highlight ongoing fab construction and cleanroom expansions in India and Asia, with Tata, CG Power, and others advancing OSAT and commercial fabs. SK Hynix faces cleanroom constraints for HBM, while Amkor expands packaging space. Yield improvements at Intel and capacity updates from TSMC and Samsung underscore AI-driven demand and regional buildouts.
SK hynix's Solidigm eyes $150B IPO as early as 2027, Reuters report suggests - SK hynix's Solidigm eyes $150B IPO as early as 2027, Reuters report suggests The report suggests that Solidigm, a U.S.-based subsidiary of SK hynix, heard pitches from major investment banks seeking to lead the initial public offering (IPO). 9/25/2026 - 08:49 PM SARAH CHEA
From 5G uplink testing to 6G research: AI DPoD in the lab - AI-based digital post-distortion gains attention as uplink modulation performance and efficiency requirements grow on the path to 6G. The post From 5G uplink testing to 6G research: AI DPoD in the lab appeared first on EDN .
5G to 6G: AI moves into the network - 6G standardization is advancing through the 3GPP, with releases studying AI, sensing, and new architecture on the road to commercial rollout. The post 5G to 6G: AI moves into the network appeared first on EDN .
AI drives high-end packaging market past $51B by 2031 - High-end performance packaging revenue is set to exceed 51 billion dollars by 2031, driven by accelerating demand for AI accelerators, high-bandwidth memory and co-packaged optics (CPO), according to Yole Group.
TSMC N2 Process and Future Nanosheet Transistor - On September 18, 2026, the iPhone 18 Pro was released, featuring the A20 Pro application processor and marking the first product to utilize the new TSMC N2 process.
S2C Prodigy Complete Prototyping Solutions—and Why They Matter - Modern system-on-chip (SoC) and application-specific integrated circuit (ASIC) designs are extraordinarily complex. They may combine processors, accelerators, memory controllers, high-speed interfaces, security functions, and millions—or even billions—of logic gates. Verifying these systems entirely...
Delos Data Targets Heterogeneous AI with Data Interface - Delos’s Apollo chiplet is designed to bridge different endpoint semantics and interconnects, creating a low-latency domain spanning GPUs, accelerators, CPUs and memory The post Delos Data Targets Heterogeneous AI with Data Interface appeared first on EE Times .
Insight: Software Efficiency Becomes Hardware Upgrade Lever as Memory Costs Rise - Memory price inflation is forcing PC and tablet vendors to rethink more than hardware configurations. Microsoft and Google are attacking memory consumption at the operating system and application levels, creating an opportunity to stretch increasingly expensive DRAM further. This move has implications...
LEDs for under-cabinet illumination upgrades - Long life? Power efficient? Color temperature flexibility? Drop-in replacement? Yes please, I'll take one of these! The post LEDs for under-cabinet illumination upgrades appeared first on EDN .
Ramona Optics Raises $25M to Commercialize AI Microscopy Tech - Ramona Optics, a biotech company developing massively parallel computational imaging, has closed a $25 million Series A financing round. Funding will be directed toward scaling commercial operations, advancing Ramona’s proprietary multi-camera array microscopy (MCAM) technology, expanding on-platform...
CEO Interview with Sunghyun Park of Rebellions - Dr. Sunghyun Park earned his B.S. from KAIST and his Ph.D. from MIT’s CSAIL (Computer Science and Artificial Intelligence Laboratory). He built his career across Intel, Samsung Research, and SpaceX as a semiconductor design engineer, before serving as Vice President at Morgan Stanley in New York —...
Most Read – Prototyping Tesla’s A15, LPDDR5X DRAM, Silicon photonics PICs - The most popular ones on the site cover record revenue in the server market, Samsung running prototypes of Tesla’s 2nm A15 chip, and OpenLight sampling the first 3.2T DR8 silicon photonic power ICs. The post Most Read – Prototyping Tesla’s A15, LPDDR5X DRAM, Silicon photonics PICs appeared first...
UK blocked from pre-release access to US AI frontier models - Despite Prime Minister Andy Burnham telling the UN that the UK and US are working hand in glove on AI safety the US has told OpenAI and Anthropic not to […] The post UK blocked from pre-release access to US AI frontier models appeared first on Electronics Weekly .
Intel Panther Lake Teardown - Looking inside Intel 18A and Intel’s Panther Lake. A free SemiAnalysis STEEL teardown.…
Hire ASIC Design Engineers - Finding experienced ASIC design engineers can be difficult when your project requires a specific combination of RTL expertise, SoC integration, low-power design, timing closure, verification awareness and real silicon tape-out experience. AnySilicon helps semiconductor companies, startups and engineering...
US and Chinese accounts of Xi's Washington visit agree on the framework, not the fine print - Chinese President Xi Jinping's September 23-25 state visit to Washington ended without a joint statement, leaving the White House fact sheet and Beijing's official readouts as the only formal record of what was agreed. Read side by side, the two accounts converge on the architecture of the relationship...
Mobilint Delays Second-Generation AI Chip Production by Six Months - Mobilint's mass-production schedule for its second-generation neural processing unit (NPU), Regulus, has been delayed by six months. Originally targeted for the end of this year, production is now expected to begin no earlier than June next year following problems during work with Asicland to optimi
Chip Industry Week In Review - AI agents move deeper into chip design; China doubles down on AI compute and memory; chip supply chains tighten for equipment and critical materials; TSMC partners accelerate; ICs head to space; optics advances, neural super resolution, auto PQC; Purdue-UIUC workforce training. The post Chip Industry...
Moving to a Microchip MCU: Tools and Resources for Migration - Migrating to a new MCU can impact hardware, firmware and development timelines. This blog post highlights practical tools from Microchip—including device cross-referencing, migration guidance and MPLAB® AI Coding Assistant—to help engineers accelerate evaluation and integration.
20 Years of NXP: The People, Values and Culture Behind the Journey - We spoke with Lars Reger, Executive Vice President and Chief Technology Officer, about his perspective on NXP’s evolution over the past two decades, the technologies that have defined our success and why he believes the next chapter of innovation will unfold at the intelligent edge.
Korean, Mexican leaders agree to launch dialogue on supply chains, deepen AI and defense ties - Korean, Mexican leaders agree to launch dialogue on supply chains, deepen AI and defense ties Korea's President Lee Jae Myung and Mexico's President Claudia Sheinbaum agreed to strengthen supply chains, trade, AI, aerospace and defense cooperation during their bilateral summit in Mexico City. 9/24/2026...
Move Over, HAL. New AI Thinks Like a Chip Designer - It just struck me that—although we don’t yet have things like Jetson-style flying cars—some of the technologies we do have go way beyond what was considered to be in the realm of science fiction when I was a young sprout. Actually, as an aside, just thinking about
Fable: The Great Man Who Was Denied A Chair - One of the greatest physicists and mathematicians who ever lived was rejected when he applied for the Chair of Natural Philosophy at Edinburgh University. A local newspaper, the Edinburgh Courant, […] The post Fable: The Great Man Who Was Denied A Chair appeared first on Electronics Weekly .
From Custom Silicon to AI Systems: Why Cross-Layer Engineering Matters - The central argument of Ankur Gupta’s AI Infra Summit keynote is simple but consequential: the next leap in AI infrastructure will not come from improving chips, servers, cooling systems, or data centers independently. It will come from optimizing the connections among them. Siemens frames this as a...
