AMD CEO meets with TSMC CEO in Taiwan as it expands US chip output - Advanced Micro Devices (AMD) CEO Lisa Su stated that the company plans to invest more than US$10 billion in Taiwan's industrial ecosystem to accelerate the development of artificial intelligence (AI) infrastructure. The announcement was made during her visit to Taiwan, where she also disclosed the latest...
Europe is Getting Serious About ASIC Innovation - I was born in the UK (then still a part of Europe), so always eager to see them succeed. But I must admit that past behavior has reinforced the view that the EU’s only active “contribution” to progress is regulation. However this seems to be changing in multiple interesting ways. On a grand scale,...
More EcoFlow woes: So it goes - Portable power station design apparently isn’t easy. So suggests this engineer’s most recent two case studies, not to mention the long-term history. The post More EcoFlow woes: So it goes appeared first on EDN .
Semtech connects with Z-Wave Alliance - Semtech, the mixed-signal and IoT specialist, is joining the Z-Wave Alliance as a new member and will serve on the standard body’s Board of Directors. The Alliance is the SDO (standards developing organisation) for smart home and IoT wireless comms using Z-Wave. The protocol is used primarily for elements...
Large-scale, SRAM-based LLM Inference Deployment (Groq) - A new technical paper, “SHIP: SRAM-Based Huge Inference Pipelines for Fast LLM Serving,” was published by researchers at Nvidia, with work done while at Groq. Abstract “The proliferation of large language models (LLMs) demands inference systems with both low latency and high efficiency at scale....
Mask Technology Faces A New Set Of Challenges - Key Takeaways: Mask inspection and repair remain the critical bottleneck, even as multi-beam writers have reduced mask-writing constraints. Curvilinear masks are becoming viable for critical layers, but qualification, metrology, and inspection standards still lag production needs. Scaling curvilinear...
Motor MCU integrates driver and control functions - Toshiba is sampling the TB9M040FTG motor control device, which integrates an MCU and motor driver for controlling small automotive motors. The post Motor MCU integrates driver and control functions appeared first on EDN .
Alibaba unveils new AI chip as Nvidia access remains stalled - Tech giant Alibaba released on Wednesday a new artificial intelligence chip it said performed three times as well as its predecessor, showcasing growing domestic chipmaker prowess as US titan Nvidia struggles for access to ...
Google Re-Enters the Smart Eyewear Market - This week, the long-anticipated announcement of Google smart eyewear came. It revealed intelligent eyewear with frames designed by Gentle Monster and Warby Parker, announced to be launched sometime in the autumn of 2026.
How data movement defines performance for AI silicon - When data movement is delayed, even the fastest compute engines are left waiting, reducing throughput, increasing latency, and wasting power. The post How data movement defines performance for AI silicon appeared first on EDN .
Riverside Research Announces Strategic Partnership with Plexus Corp. - regulatory environments. From life-saving medical devices and mission-critical aerospace and defense products to industrial automation systems and semiconductor capital equipment, our innovative solutions across the lifecycle of a product converge where advanced technology and human impact intersect....
ASIC Design Services for Startups | From Idea to Silicon - Launching a hardware startup is difficult. Launching a semiconductor startup is even more complex. Unlike software, where products can be tested, fixed and released quickly, an ASIC project requires careful planning, strong technical execution and the right partners from the very beginning. One mistake...
OpenAI moves up IPO timeline to get ahead of Anthropic - OpenAI is preparing to file for an initial public offering (IPO) in the coming weeks, a move that could sharpen its competitive edge in the AI race. While company executives had previously targeted a listing in the fourth quarter of this year or later, the accelerated filing is expected to substantially...
Scaling the Next Generation of Multi-Die Systems - This year’s EE Times Chiplets event will address challenges in the design flow and chiplet technologies to enable straightforward scaling. The post Scaling the Next Generation of Multi-Die Systems appeared first on EE Times .
Light-Matter Particles Could Revolutionize AI Computing - Penn scientists may have found a way to power future AI with exotic light-matter particles instead of electrons. Eighty years after the debut of ENIAC, the world’s first general-purpose electronic computer, researchers at the University of Pennsylvania are exploring a radically different future for...
Shock Block SB4000 30A in-line safety breaker sealed to IP69K/NEMA 4X - Littelfuse is introducing a compact 30A ground fault circuit interrupter (GFCI), the Shock Block SB4000. The standard enclosure is IP 69K/NEMA 4X and outdoor rated making it suitable for industrial environments. The models equipped with connections for a neutral wire have built-in grounded-neutral protection...
Quantum Gathering Momentum Amid Concerns for the Grid - I posted recently on an eye-catching advance in quantum computing, around neutral atom systems which might accelerate the transition to production-grade fault-tolerant quantum computing (QC). There are some further updates on this front, also I listened in on a panel considering quantum-based hacking...
Driving Innovation Across Smartphones, Data Centers, and More - Over the last 20 years, MediaTek has grown into a key player in modern computing. Today, the focus shifts toward AI, connecting devices from edge to cloud and enabling smarter experiences across industries. Learn more from MediaTek's Rahul Sandil on the company's philosophy behind its...
Enabling Conversational AI at the Edge - Voice is the interface, was the defining message of the voice community in 2025, and it continues to resonate today. Language is one of the first communication skills humans learn and remains the most natural way we interact throughout our lives.
AI is transforming 2nm packaging advances through global collaboration - AI is transforming the next-generation advanced foundry for 2nm chips, thus reshaping the semiconductor industry, writes Rozalia Beica. The semiconductor industry is entering a historic inflection point, one driven by unprecedented demand, geopolitical shifts and the rise of AI. As nations re-evaluate...
ASML CEO: first high-NA products expected within months - ASML expects the first products made using high-NA EUV lithography systems to appear within months, CEO Christophe Fouquet said on Tuesday at Imec’s ITF conference in Antwerp.
Alibaba's T-Head doubles down on AI infrastructure with Zhenwu M890 - Alibaba Cloud has unveiled the Zhenwu M890, a new proprietary AI training and inference chip developed by its semiconductor subsidiary T-Head Semiconductor, as the Chinese cloud group accelerates its push into full-stack AI infrastructure for the agentic AI era.
ADI buys Empower Semi for $1.5bn - ADI is to buy pricately held Empower Semiconductor for $1.5 billion. “AI infrastructure is fundamentally reshaping how power must be delivered, with energy now the most persistent constraint to scaling next-generation systems,” says ADI CEO Vincent Roche. He added that Empower helps customers redesign...
The 8-bit Web Server - Even [maurycyz] doesn’t think it is a good idea, but it is possible to use an AVR 8-bit CPU to serve web pages. Of course, it is a vastly simplified …read more
Google I/O 2026: Agentic AI gets serious - This week’s latest iteration of Google’s yearly developer event reiterated the company’s significant AI commitment. What’s different from messaging and examples past? Maturity. The post Google I/O 2026: Agentic AI gets serious appeared first on EDN .
AMD Plans $10B Investment in Taiwan to Boost AI Infrastructure - AMD to invest more than $10 billion in Taiwan ecosystem, ramping HPC chips on TSMC’s 2-nm process amid AI buildout. The post AMD Plans $10B Investment in Taiwan to Boost AI Infrastructure appeared first on EE Times .
Advancing Heterogeneous Integration Through Industry Roadmap Improvements - More detailed roadmaps are needed to guide how the industry stacks, connects, powers, and cools tomorrow's chips. The post Advancing Heterogeneous Integration Through Industry Roadmap Improvements appeared first on Semiconductor Engineering .
Putting frontier AI to work to strengthen defenses - As AI accelerates cyberattacks, the biggest risk for enterprises is no longer whether vulnerabilities will be found, but how quickly organizations can respond. Frontier models are shrinking...
Four-Tier Memory Hierarchy for LLM Reasoning (USC, UW) - A new technical paper, “Not All Thoughts Need HBM: Semantics-Aware Memory Hierarchy for LLM Reasoning,” was published by researchers at USC and University of Wisconsin-Madison. Abstract “Reasoning LLMs produce thousands of chain-of-thought tokens whose KV cache must reside in scarce GPU HBM. The...
Spintronic memory switches in 40 ps - A University of Tokyo-led research team has demonstrated a non-volatile spintronic memory switching device that can rewrite a magnetic state…
Chiral carbon nanotube films deliver giant light-conversion effect - A sheet of twisted carbon nanotubes has revealed a hidden talent scientists suspected for decades but had never managed to measure. Researchers at Rice University have created large, highly ordered films of chiral carbon ...
Corporate - The first post in a series of three posts from teachers trained through the Morocco DigiSchool program. Learn how the program is benefiting students and educators, while supporting Morocco's broader education transformation goals.
When Arm Meets RISC-V: SiPearl, Semidynamics to Co-Develop Sovereign AI Platform - SiPearl and Semidynamics have announced a partnership to build one of the first European sovereign rack-scale AI platforms. The post When Arm Meets RISC-V: SiPearl, Semidynamics to Co-Develop Sovereign AI Platform appeared first on EE Times .
Applied Materials Announces Broadcom as EPIC Innovation Partner - Companies to collaborate on R&D to accelerate introduction of advanced packaging technologies for next-generation AI chips and systems Partnership will leverage Applied’s global network of innovation centers, including new EPIC Center in Silicon Valley SANTA CLARA, Calif., May 20, 2026 (GLOBE
Blog Review: May 20 - Importing functions in PSS; rethinking server architecture; HBM challenges; heterogeneous integration roadmaps; sparse linear algebra. The post Blog Review: May 20 appeared first on Semiconductor Engineering .
As Hormuz crisis hits South Korea, Arctic route gains strategic weight - South Korea depends on the Middle East for 70% of its crude oil, and relies heavily on oil refining, petrochemicals, and power generation in its industrial sector. As a result, Iran's blockade of the Strait of Hormuz has led to wide-ranging pressures on South Korea's economic security.
Scientists Just Used Sunlight To Pull Off a Quantum Physics Feat Once Thought Impossible - Scientists have shown that sunlight alone can generate quantum-correlated photons capable of producing “ghost images,” a feat once thought to require stable lasers. Quantum optics experiments typically rely on carefully controlled lasers to create correlated or entangled photon pairs. These photon...
[Blog] Trust Is No Longer Assumed: Why SPDM Is Redefining Secure Infrastructure - Every major shift in datacenter architecture moves certain security capabilities from nice-to-have to non-negotiable. As systems become more disaggregated, platforms more modular, and firmware delivery increasingly network-based, traditional trust assumptions no longer hold. Hardware is sourced across...
Closing the Silicon Realization Gap: From Static DFM to Governance for Lifecycle (GFL) - The semiconductor industry has achieved extraordinary mastery in silicon signoff. Modern EDA environments can now optimize timing closure, physical verification, IR/EM behavior, routing density, thermal interaction, and increasingly even design-space exploration through AI-assisted implementation flows....
