New Smart Material Can Control Heat Like a Computer Chip - Scientists have created a programmable material that gives engineers unprecedented control over heat, with potential applications ranging from energy systems to next-generation photonic memory. Heat normally follows strict rules. A material that efficiently absorbs heat from a particular direction and...
CEO Interview with Mark Ren of Agentrys - Mark Ren has 26 years of EDA and AI R&D experience spanning IBM Research and NVIDIA Research, driving design automation innovations that power modern chip design. He received the IBM Corporate Award for contributions to the design closure for high-performance microprocessors. At NVIDIA, he helped establish...
Students Explore Electronic Engineering with Intel and DCU - In June 2026, the School of Electronic Engineering at DCU, in partnership with Intel and the Higher Education Authority (HEA), hosted a transformative introduction to electronic engineering bootcamps ...
TSMC A16 Backside Power at VLSI 2026 - TSMC’s A16 technology , presented as Paper T1.5 at the June 2026 IEEE/JSAP VLSI Symposium , marks the company’s first angstrom-class CMOS platform combining enhanced nanosheet gate-all-around transistors with backside power delivery. The key integration feature is Super Power Rail , or SPR, which...
Room-temperature, CMOS-compatible Photonic Quantum Processor (NUS et al.) - Researchers from Rotonium, Centre for Quantum Technologies at National University of Singapore, Inveriant, Politecnico di Milano, and CNIT published a technical paper titled “Design and Benchmarking of a Quantum Photonic Chip.” Abstract Excerpt: The paper presents a quantum photonic processor based...
Apple’s $30B Broadcom Deal Signals Expansions in AI, U.S. Supply Chain - Apple’s $30B Broadcom bet drags AI data centers and U.S. chipmaking into its orbit… and may hand Intel a lifeline. The post Apple’s $30B Broadcom Deal Signals Expansions in AI, U.S. Supply Chain appeared first on EE Times .
What Defines "Elite" in the Age of Physical AI? - As AI enters the physical world, intelligence alone is no longer enough. Just as elite athletes rely on instinct and reflexes under pressure, physical AI systems must act safely, reliably and instantly in unpredictable environments.
Environmental groups call for stop to orbital datacentres - A coalition of environmental groups in the US is calling on the country’s Federal Communications Commission (FCC) for a “rigorous review” of space-based datacentre proposals. Highlighting a threat of “irreparable environmental harm to our planet”, they say the FCC must provide both oversight...
Component Price Landscape Q2 2026 - The Q2 2026 update to TechInsights’ semiconductor market forecast calls for topline semiconductor sales to skyrocket by 98% in 2026, another substantial increase from the 67% revenue growth projected in the Q1 version. Driving this growth are the ongoing AI boom, with datacenter demand for key products...
Workwear Brands Enhance Safety with Cut-Resistant, Cooling Tech - Notable examples included fan vests, which circulate air inside clothing to lower perceived temperature, and Peltier workwear, which applies semiconductor -based electronic cooling technology.
Taiwan PCB leaders launch fundraising wave for AI data centers - Taiwan's PCB industry is entering a new expansion cycle as investment in AI data centers and other emerging applications accelerates. Since 2025, several board makers and upstream material suppliers have launched large-scale fundraising plans at home and overseas, including three bellwethers: Zhen Ding...
Technical Report: Samsung Exynos 2500 (3nm) Process Flow (Full) Analysis - This report provides a Synopsys 3D emulation analysis of the process flow and integration used in the manufacture of the Samsung Exynos 2500, built in Samsung's HNS 3nm technology. The emulation includes SPX output files that can be used as input into other Synopsys models
ZEISS Opens Semiconductor Innovation Center in Korea - ZEISS Semiconductor Manufacturing Technology (SMT) has opened a new ZEISS Innovation Center in Yongin, Korea. The post ZEISS Opens Semiconductor Innovation Center in Korea appeared first on Semiconductor Digest .
