Demystifying Custom Silicon in the Data Center - Exploring heterogeneous compute in the data center—how custom ASIC designs help create XPUs to accelerate modern AI workloads. Data Center Insights by Jerry Chang, Sr. Director, Head of Marketing, Americas and Europe.
BE Semiconductor Industries N.V. Announces Results of 2026 Annual General Meeting of Shareholders - Duiven, the Netherlands, April 23, 2026 - BE Semiconductor Industries N.V. (the "Company" or "Besi") (Euronext Amsterdam: BESI; OTC: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, today announced the results of its Annual General Meeting of Shareholders (“AGM”)....
ESP32Synth : an Audio Synthesis Library for the ESP32 - With MCUs becoming increasingly more powerful it was only a matter of time before they would enable some more serious audio-processing tasks. [Danilo Gabriel]’s ESP32Synth library is a good example here, …read more
Core Series 3 scales AI to entry PCs, edge - Intel has introduced its Core Series 3 mobile processors targeting budget laptops and essential edge devices. The post Core Series 3 scales AI to entry PCs, edge appeared first on EDN .
What’s next for Silicon Labs, the IoT and AI - On a visit to Austin, Texas, Caroline Hayes visited Silicon Labs and spoke to Ross Sabolcik, lead of the company’s industrial and commercial IoT business unit about meeting evolving customer requirements for connectivity, ecosystem support and introducing AI. The acquisition by TI is subject to shareholder...
Applied Materials to Report Fiscal Second Quarter 2026 Results on May 14, 2026 - SANTA CLARA, Calif., April 23, 2026 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced that it will hold its fiscal second quarter 2026 earnings conference call on Thursday, May 14, 2026, at 4:30 p.m. ET / 1:30 p.m. PT. The call will be webcast live at: https://ir.appliedmaterials.com.
Why 6.4 Gbps DDR5 Designs Fail and How to Avoid It - In the world of high-speed SoC design, “almost working” is really just a polite way of saying “an expensive paperweight.” As we push beyond the 6.4 Gbps threshold with DDR5, the margin for error has essentially disappeared. For engineering leads and decision-makers, the goal is no longer just...
Can Edge AI Keep Up? - Key Takeaways: Model development is outpacing silicon design cycles, so edge AI architectures must prioritize adaptability. The required cadence for model updates is highly application-dependent and is closely tied to product lifetime and operational risk. Adaptability can conflict with power, performance,...
Where Sensor Fusion Begins: How NAFE Advances Smarter, More Reliable Robotics - Across the industry, robotics is evolving from AI embodied robots—where AI is simply added to a pre defined mechanical form—to AI defined bodies, where the robot’s morphology, actuation and sensing are shaped around the AI’s capabilities and requirements.
TSMC Technology Symposium 2026 Overview - Yes, it is that time of year again, the 2026 TSMC Technology Symposium kick-off event in Silicon Valley. TSMC has never been in a better position to forecast the future of semiconductor technology and the industry itself. TSMC closely collaborates with the top semiconductor companies around the world...
Coherent Corp. Announces Timing of FY2026 Third Quarter Earnings Release - Coherent Corp. announced today that it will release its financial results for the quarter ended March 31, 2026, on Wednesday, May 6, after the New York Stock Exchange closes. The release will be followed by a live audio webcast at 4:30 p.m. ET to discuss the results.
SK hynix Pledges to Expand Scope of Supplier Collaboration in AI Era - SK hynix said it shared its strategy for responding to the artificial intelligence (AI) era with partner companies at the annual general meeting of its supplier council.Chief Executive Officer Kwak Noh-jung said at the meeting held on April 20 at Grand Walkerhill Seoul in Seoul's Gwangjin district t
Japan earthquake intensifies Kioxia supply concerns as SanDisk, Phison halt NAND pricing - A strong earthquake struck Japan's Tohoku region on the evening of April 20, 2026, near a critical semiconductor hub, raising global memory supply chain alarms. The quake's epicenter was close to Kioxia's NAND flash factories in Kitakami, Iwate Prefecture, prompting major NAND suppliers SanDisk and Phison...
Bits&Chips talks to Imec’s Eric Beyne - Eric Beyne is a senior fellow at Imec, where he’s responsible for 3D system integration. As an introduction to his keynote talk at the Benelux Heterogeneous Integration Conference, on 22 May in Veldhoven, Bits&Chips spoke with him about advanced packaging and current 3D trends in the semiconductor industry....
Liteon startup platform sharpens edge AI ecosystem focus for 2026 growth reset - Liteon's startup platform LITEON+ held its 2026 Demo Day, marking its third year, with a focus on key technologies including edge AI, AI chips, thermal sensing, power conversion, and agentic AI. The event showcased the latest collaboration outcomes between Liteon and global startup partners in advancing...
Smart factory: The rise of PoE in industrial environments - Power over Ethernet (PoE) meets industrial IoT demands by leveraging the unique ability to deliver power and data over a single cable. The post Smart factory: The rise of PoE in industrial environments appeared first on EDN .
TSMC's Margins in Uncharted Territory - 66.2% in the weakest quarter of the year. The biggest sequential jump on record. And 10 points above the long-term target they just raised.
Design Faster, Waste Less: The Sustainability Advantage of Simulation - Learn how simulation-driven design helps engineers build more efficient, sustainable electronics. By enabling deep virtual exploration before hardware is built, QSPICE® reduces prototype cycles, conserves materials and accelerates development—helping organizations improve performance, meet sustainability...
From air to tea: New sensor reveals invisible pollution in minutes - Fine particulate matter in the air or nanoparticles in water—a remarkable new technology developed at TU Wien makes it possible to detect tiny amounts of a wide range of substances in a very short time.
System-in-Package Challenges - Engineering considerations in multi-chiplet designs. The post System-in-Package Challenges appeared first on Semiconductor Engineering .
Join Our Expert Webinar on Humanoid Robots in Industry - Join IDTechEx Technology Analyst Shihao Fu on Thursday 30th April for the expert-led webinar, "Humanoid Robots in Industry: Market Readiness, ROI, and 10-Year Outlook". Choose your preferred time zone - the webinar runs three times in one day.
Hitachi plants Eindhoven flag to speed up metrology innovation - After more than a decade of collaboration with Dutch partners, Hitachi High-Tech has established a presence in Eindhoven. The move is aimed at enabling faster iteration cycles and tighter integration as semiconductor metrology grows more complex.
How MediaTek is Leading the Next Generation of AI Chromebooks - Powered by the Kompanio Ultra processor, devices like the Acer Chromebook Plus 714 and Lenovo Chromebook Plus deliver on-device AI with intelligent productivity features, and more.Explore how MediaTek's on-device AI capabilities are accelerating across Chromebooks and Android for Desktop.
Printable meta-assemblies enable synergetic colouration - A printable meta-assembly comprising polystyrene embedded in a polydimethylsiloxane matrix used in roll-to-roll additive nanoprinting is described for the fabrication of highly tunable optical architectures that can span seven orders of magnitude in length.
Celebrating Women’s History Month and HSC 65th in March - As March comes to a close, Hemlock Semiconductor reflects on a month of community impact, growth and celebration. In honor of Women’s History Month and International Women’s Day, we highlighted the incredible contributions of women across our company, showcasing the talent, leadership and innovation...
TSMC Unfolds Map for Process, Packaging Tech - TSMC unveils chip tech roadmap, slashing AI power use and boosting density. The post TSMC Unfolds Map for Process, Packaging Tech appeared first on EE Times .
Atmos Space Cargo raises €25.7m Series A for reusable spacecraft - Atmos Space Cargo has closed a €25.7 million Series A financing round. It says the investment will support an initial three-vehicle PHOENIX 2 fleet. The financing will also help the launch of ATMOS WORKS for governmental and defence customers, and development of PHOENIX 3, the company’s next-generation...
From Chang'an to the World: Xi'an Activates New Industrial Momentum through "Air Silk Road" - billion) by 2027 and an internationally competitive large aircraft cluster.As a national hub for electronic information, Xi'an has fostered a semiconductor - and photonics-driven ecosystem. By end-2025, the sector had 233 enterprises above designated size, accounting for 15% of total industrial output...
Toshiba photocoupler for MOSFETS in SSRs - Toshiba has launched the TLX9920, a photovoltaic-output photocoupler designed to provide an isolated gate drive voltage for power MOSFETs, particularly high-side and back-to-back configurations used in solid-state relays (SSRs). Applications include automotive battery management systems (BMS), onboard...
Chip Industry Week In Review - Marvell's plasmonics buy; Onto's process control stake; TSMC A14/13 and EDA flows; Apple shuffle; LPDDR6; SOCAMM2 chipset; MATCH Act progress; EV resist crunch; India 3D packaging fab; digital test card for HPC; telemetry platform for power management; edge AI MCU for voice; new Google TPUs. The post...
Cisco switch aims to network quantum computers - Cisco has come up with the Cisco Universal Quantum Switch, which claims to accept and translate between all major encoding modalities without destroying the quantum information in the process. M The switch routes quantum information while preserving it at room temperature, on existing telecom fibre, with...
[Blog] Designing Edge AI Under Real-World Constraints - As demand for artificial intelligence at the edge continues to grow, it has become increasingly difficult for designers and developers to support. Constrained edge systems often lack the power, processing, and space required to run these high-performance workloads effectively. In a recent webinar hosted...
Want to Build Chips 10X faster and at 50% Lower Cost (Without Changing Existing Tools or Workflows)? - I have some news that will make chip and chiplet designers (we’re talking ASIC, ASSP, SoC, and multi-die systems) squeal in delight. However, before we leap headfirst into the fray with gusto and abandon (and, it goes without saying, but I’ll say it anyway, aplomb), I just got off a call with my old...
Three Pillars Shaping Blue Hydrogen's Future - Blue hydrogen, produced from natural gas using reforming processes with carbon capture, offers a lower-carbon alternative to grey hydrogen and serves as a transitional solution toward a hydrogen-based economy. Successfully scaling blue hydrogen requires the alignment of three key pillars: regulatory support,...
Apple reshapes AI strategy by doubling down on Siri and privacy - As OpenAI and xAI pivot toward enterprise markets inspired by Anthropic, and as OpenClaw sparks new visions for agent-based AI, Apple has finally set a clear AI focus for its 2026 Worldwide Developers Conference (WWDC). The company announced the event will focus on AI advancements and new software and...
[News] Intel Tapped as Tesla Wins First 14A Customer Spot in Terafab Push - Just ahead of Intel’s April 23 earnings call, the chipmaker is poised to secure its first 14A customer. Reuters, citing Elon Musk, reports that Tesla plans to use Intel’s next-generation 14A process for chips in its Terafab AI complex in Austin. While earlier market speculation pointed to pos...
IBM reports steady AI-driven growth despite facing software momentum questions - Analysts said IBM continues to show stable underlying revenue growth supported by artificial intelligence adoption and hybrid cloud demand. Its unchanged full-year outlook and softer software performance, however, may limit near-term upside expectations.
Samsung Foundry and Cadence: Accelerating Chiplet Solutions for Physical AI - Artificial Intelligence (AI) is rapidly expanding beyond digital environments and into the physical world. AI-driven systems that give machines the ability to perceive, comprehend, learn from, and respond to real-time environments are quickly moving from imagination to reality. Training and …
TI reports first quarter 2026 financial results and shareholder returns - or communications, or recalls by our customers for a product containing one of our parts;Financial difficulties of our distributors or semiconductor distributors' promotion of competing product lines to our detriment; or disputes with current or former distributors;Our ability to maintain
IBM Introduces Industry Solutions for AI Powered Experience Orchestration with Adobe - This is where IBM Consulting and Adobe are deepening our collaboration. Together, we’re pairing Adobe’s Customer Experience Orchestration capabilities, like Adobe Real-Time CDP, with IBM’s agentic AI expertise, orchestration tools like Adobe Experience Platform Agent Orchestrator and IBM watsonx...
How to Overcome the Advanced Node Physical Verification Bottleneck - It is well-known that advanced semiconductor process technology presents substantial challenges across the full design flow and global supply chain. In this piece, we will focus on a particularly difficult problem – physical verification. This design step is the final gate to manufacturing. Producing...
DIY Smart Button Gets Surprisingly Complicated - There’s a reason that the standards specifications for various wireless communications protocols are extremely long and detailed. [Made by Dennis] found this out first hand when he decided to build …read more
Blog Review: Apr. 22 - Coverage closure; EM sim for AMS; CXL 4; root of trust for ATMs. The post Blog Review: Apr. 22 appeared first on Semiconductor Engineering .
Scientists Finally Crack Decades-Old Mystery of “Breathing” Lasers - A new model reveals that two very different laser pulse behaviors are fundamentally connected. An international team of researchers, including a scientist from Aston University, has uncovered how “breather” laser pulses function. They created a single mathematical model that, for the first time, explains...
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