The MIT-IBM Computing Research Lab Launches to Shape the Future of AI and Quantum Computing - IBM and the Massachusetts Institute of Technology today announced the launch of the MIT-IBM Computing Research Lab, advancing their long-standing collaboration to shape the next era of computing. The new lab expands its scope to include quantum computing, alongside foundational artificial intelligence...
Spotlight shines on Women Leaders In Electronics Awards 2026 winners - Last night saw the Women Leaders In Electronics Awards 2026, the Electronics Weekly event showcasing and celebrating the achievements of women in the electronics industry. The awards were presented in central London at One Moorgate Place, the Chartered Accountants’ Guildhall. Now in their third year,...
[News] Intel, SoftBank Reportedly to Unveil ZAM-Based HB3DM in June, Bandwidth More Than Double HBM4 - Intel is collaborating with SoftBank’s subsidiary SAIMEMORY to advance a potential alternative to conventional high-bandwidth memory (HBM). According to TechPowerUp, SAIMEMORY plans to present a paper at VLSI Symposium 2026 in June, detailing its newly developed HB3DM memory based on Z-Angle Memor......
New copper nanozyme shows powerful tumor suppression with high precision - Malignant tumor treatment remains a major challenge due to the limited precision and significant side effects. Copper-based single-atom nanozymes have shown promise for tumor microenvironment-responsive precision therapy, ...
Energy-Efficient Liquid Cooling for Advanced Semiconductor Packaging (KAIST) - A new technical paper, “Highly energy-efficient manifold microchannel for cooling electronics with a coefficient of performance over 100,000,” was published by researchers at KAIST. The study presents a CMOS-compatible manifold microchannel cooler that removes over 2,000 W/cm² using single-phase...
Lumai Productizes Lens-Based Optical Computer - New systems are for evaluation, with commercial systems coming by 2029. The post Lumai Productizes Lens-Based Optical Computer appeared first on EE Times .
Transceivers boost in-vehicle audio bandwidth - ADI’s ADAA245x series of A2B 2.0 Automotive Audio Bus transceivers delivers 4x higher bus bandwidth than A2B 1.0 devices. The post Transceivers boost in-vehicle audio bandwidth appeared first on EDN .
Timing module enables vRAN synchronization - Microchip’s MD-990-0011-B M.2 plug-in timing module delivers precise synchronization for data center servers and 5G vRAN. The post Timing module enables vRAN synchronization appeared first on EDN .
Levitated nano-ferromagnet confirms a 160-year-old physical prediction - Ferromagnets, such as iron, cobalt, and nickel, are materials with a strong, spontaneous, and permanent magnetic field. Over 150 years ago, the physicist and mathematician James Clerk Maxwell speculated that under specific ...
WAVE-N Specialized Video Processing NPU for Edge AI Systems - The rapid growth of AI applications in edge devices has created a strong demand for specialized hardware capable of performing high-performance neural network inference under strict power and latency constraints. Traditional CPUs and GPUs often struggle to meet the efficiency requirements of embedded...
Programmable artificial RNA condensates in mammalian cells - Modular RNA nanostar motifs spontaneously assemble into programmable synthetic condensates in the nucleus and cytoplasm, with RNA design controlling localization, sequence-specific target recruitment and orthogonal assembly.
BluGlass Quarter Report – March 2026 - The BluGlass Board and Management are pleased to provide the following update and Appendix 4C Quarterly Report for the three…
Small Modular Reactors (SMRs): A New Generation of Nuclear Power? - Small modular reactors (SMRs) represent a new generation of nuclear power, promising cheaper, safer, and more versatile clean energy. In this article, IDTechEx investigates why SMRs are gaining attention and how the market is divided into two different generations of reactor design.
Blog Review: Apr. 29 - Interface IP in 3D; SOCAMM in data centers; edge intelligence implementations; deposition, etch for 3D; interconnect telemetry; design–manufacturing collaboration. The post Blog Review: Apr. 29 appeared first on Semiconductor Engineering .
Siltronic closes Q1 2026 in line with expectations - Sales decreased by 17.5 percent to EUR 306.5 million compared to a strong previous quarter that benefited from intra-year delivery shifts, EBITDA margin…
Ultra Clean Announces Retirement of the Chief Financial Officer Sheri Savage - leading developer and supplier of critical subsystems, components, parts, and ultra-high purity cleaning and analytical services, primarily for the semiconductor industry. Under its Products division, UCT offers its customers an integrated outsourced solution for major subassemblies, improved design-to-delivery...
Conquering the final frontiers in nanographene synthetic methodologies - Nanographenes are organic semiconductor materials used in smartphones, OLED displays, and solar cells. At the molecular level, they are composed of polycyclic aromatic hydrocarbons (PAHs), which are a network of connected ...
Air Products Reports Fiscal 2026 Second Quarter Results - growth: Selected by Samsung to build, own and operate multiple production facilities and bulk specialty gas supply system for new advanced semiconductor fab in South Korea Space sector growth: Supplied critical liquid hydrogen and helium for NASA's historic Artemis II mission; announced
NoC Coherency Challenges Balloon With AI SoCs And Chiplets - Key Takeaways Data movement, congestion, and energy efficiency are key determiners of whether compute is usable. Different processors bring various coherency challenges. For example, a cache-coherent NoC for CPUs is expensive and harder to verify than an I/O-coherent NoC for an accelerator. Designers...
Lenovo sets US$100 billion revenue target as AI PCs and GPU servers drive growth - Lenovo Group told suppliers at its 2026 Global Supplier Conference on April 29 in Hefei that it expected surging demand for AI PCs and GPU servers to lift revenues and that the company aimed to exceed US$100 billion in annual revenue within two years. Executives said the company forecast record results...
MCUs pair high flash capacity with security - The GD32F5HC series of 32-bit general-purpose MCUs from GigaDevice features a 200-MHz Arm Cortex-M33 core with DSP and FPU capabilities. The post MCUs pair high flash capacity with security appeared first on EDN .
Rectifiers combine low profile and high current - Vishay has released 16 single and dual FRED PT ultrafast rectifiers in low-profile DFN6546A packages with wettable flanks. The post Rectifiers combine low profile and high current appeared first on EDN .
Enabling Next-Generation AI Through Advanced Packaging and 3D Fabric Integration - The rapid rise of artificial intelligence is fundamentally reshaping computing architectures. As AI models scale toward trillions of parameters, traditional approaches to performance improvement are no longer sufficient. Instead, the industry is entering a new era where system-level innovation, advanced...
TSMC SoIC roadmap targets 2029 chip stacking - TSMC is pushing its 3D chip-stacking roadmap towards finer interconnect pitches and tighter integration as advanced packaging becomes a larger…
Littelfuse expands range of high-voltage TVS diodes for automotive - Littelfuse is expanding its TP Series portfolio with devices specifically for automotive high-voltage power electronics applications. Specifically, it has added the TPSMC, TPSMD, and TP5.0SMDJ high-voltage transient voltage suppression (TVS) diode series. Example applications include battery disconnect...
SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026 - Corporation. "Overall, silicon wafer demand has improved, but the recovery is not uniform. Many device companies have noted improvements in the industrial semiconductor segment, and this is creating a more broad-based recovery as wafer inventory is absorbed. Weaker smartphone and PC shipments in the first...
User Experience and Control in Agentic Systems. Innovation in Verification - A switch this month to principles behind building effective agentic systems, going beyond simply a new way to stitch together tools, agents and orchestration, to deeper consideration of user experience and how we most effectively blend agentic with human-in-the-loop. Paul Cunningham (GM, Verification...
Low-power image sensors for battery-powered compact devices - ST’s latest image sensors for always-on vision for compact devices operating on batteries or harvested energy – VD55G4 (monochrome) and VD65G4 (RGB colour) – part of the ST BrightSense portfolio – are available. The sensors combine a detect-and-wake architecture with a global-shutter optical format...
The Atomic Gap That Could Cost the Semiconductor Industry Billions - Promising 2D materials may face an unexpected obstacle at the atomic scale: a tiny gap at their interfaces. For decades, the steady shrinking of electronic components has powered faster, more efficient technology. Engineers now hope to push that trend even further with 2D materials, atomically thin sheets...
Medtronic announces CE Mark for Stealth AXiS™ surgical system - Following recent FDA clearances, Medtronic is accelerating access to integrated planning, navigation, and robotics platform across Europe GALWAY, Ireland, April 28, 2026 /PRNewswire/ -- Medtronic,...
£81m investment for IQE - IQE, the compound semiconductor wafer specialist, has had an £81 million investment from MACOM and other existing shareholders. “This proposed transaction is transformational for IQE. The investment from MACOM and other existing shareholders will provide the balance sheet strength to allow us to capitalise...
OpenAI Prepares AI-First Smartphone for 2028 - OpenAI’s new smartphone reportedly aims to replace apps with AI agents. The post OpenAI Prepares AI-First Smartphone for 2028 appeared first on EE Times .
New 'Roadmap' highlights surface acoustic wave technologies - With the involvement of scientists from the Paul Drude Institute for Solid State Electronics in Berlin and the Universities of Augsburg and Münster, international researchers have presented a new roadmap for surface acoustic ...
Lattice Wins BIG 2026 AI Excellence Award - Lattice Semiconductor, the low power programmable leader, today announced it was named a 2026 AI Excellence Award winner by Business Intelligence Group.
Micron Announces Participation in Investor Event - BOISE, Idaho, April 29, 2026 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU) announced today that company executives will participate at the J.P. Morgan Global Technology, Media and Communications Conference in Boston, Massachusetts on Wednesday, May 20, at 6:40 a.m. Mountain time.
From Apprenticeship to Advancement: Quazi Ummehany’s Continued Growth at NY Creates - By the National Institute for Industry and Career Advancement (NIICA) and NY Creates Breaking into a high-tech field like semiconductor manufacturing often requires experience that can be difficult to get without already being in the industry. When Quazi Ummehany began her Registered Apprenticeship (RA),...
Rohm shrinks NFC charging for wearables - Rohm’s ML7670/ML7671 wireless chipset provides NFC charging for compact wearables such as smart rings and fitness trackers. The post Rohm shrinks NFC charging for wearables appeared first on EDN .
User Experience and Control in Agentic Systems. Innovation in Verification - A switch this month to principles behind building effective agentic systems, going beyond simply a new way to stitch together tools, agents and orchestration, to deeper consideration of user experience and how we most effectively blend agentic with human-in-the-loop. Paul Cunningham (GM, Verification...
NXP benefits from AI data center boom, too - Helped by the rapid buildout of AI infrastructure as well as accelerating recovery in core business segments, NXP posted a strong start to the year.
SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026 - Corporation. "Overall, silicon wafer demand has improved, but the recovery is not uniform. Many device companies have noted improvements in the industrial semiconductor segment, and this is creating a more broad-based recovery as wafer inventory is absorbed. Weaker smartphone and PC shipments in the first...
ΔVbe + DMM = Celsius, Kelvin, Fahrenheit, and Rankine thermometer - Combining an accurate temperature sensor with a standard digital multimeter can make an inexpensive, accurate, and useful thermometer. The post ΔVbe + DMM = Celsius, Kelvin, Fahrenheit, and Rankine thermometer appeared first on EDN .
BYD Blade Gen 2 - Improved Packing and Cell-to-Pack Ratio - As improvements to cell-level energy density have become slower to realize, automotive OEMs are increasingly turning to pack design as an avenue to increase vehicle range. This includes cell-to-pack and cell-to-body technologies, which require design changes at the cell level. BYD's recent Blade Gen 2...
FCC expands ban on non-US networking devices, raising supply chain pressure - The US Federal Communications Commission (FCC) has further clarified restrictions on non-US network equipment by officially including mobile hotspots, portable Wi-Fi devices, and home customer-premises equipment (CPE) using LTE/5G connections in its sales ban. This move signals that the US is extending...
Wipeout Clone Runs Native on ESP32-S3 - Psygnosis’s 1995 game Wipeout is remembered for two things: being one of the greatest games of all time, and taking advantage of the then-new PlayStation’s capacity for 3D graphics. The ESP32-S3 …read more
How Long Will CAN Stick Around As Rival Networks Speed Up? - Key Takeaways Automotive Ethernet is rapidly becoming the backbone of software-defined vehicles for higher bandwidth, scalability, and advanced features like TSN and security that legacy protocols cannot match. CAN, LIN, and other legacy networks will not disappear quickly because they are deeply embedded,...
Water Quality Association 2026 - Brewer Science is exhibiting at WQA Booth 228 in Miami Beach, Florida from April 29 – 30, 2026. The post Water Quality Association 2026 appeared first on Brewer Science .
Alumina Nanowires Improve Thermal Management in Advanced Packaging (Georgia Tech et al.) - A new technical paper, “Epoxy Composites Reinforced with Long Al2O3 Nanowires for Enhanced Thermal Management in Advanced Semiconductor Packaging,” was published by researchers at the Georgia Institute of Technology and National Cheng Kung University. Abstract “The rapid increase in heat flux in...
R&D Director Heikki Holmberg speaking at Incize RF Workshop - Our R&D Director, Dr. Heikki Holmberg, presenting at the RF workshop hosted by Incize on 24 April. The event provided a valuable platform for technical exchange across the RF ecosystem, bringing together industry experts to discuss enabling next-generation RF performance. During the workshop, Holmberg...
New CPU Memory Module - Benefits and questions surrounding a next-gen low-power standard for high-performance compute. The post New CPU Memory Module appeared first on Semiconductor Engineering .
