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 Medicine's next leap: Delivering gene therapies exactly where they're needed  - A quiet revolution is underway in modern medicine: Drug development is aiming to move from managing disease to correcting it through RNA and gene-editing therapies. But delivering these treatments safely and precisely to ...

 [Blog] Security in the Age of AI: Why Trust Is Moving Closer to Hardware  - In early 2026, a quiet shift became impossible to ignore: artificial intelligence (AI) moved from helping defenders to operating like an attacker at scale. The cybersecurity community took notice when researchers revealed that an advanced AI system, known publicly as Claude Mythos Preview, was able to...

 Terahertz (THz) Technology Market to Reach USD 3.5 Billion by 2031 at 23.0% CAGR Amid Rising 6G Demand | Valuates Reports  - concealed objects, and sensitive surfaces without physical disruption. This makes it valuable in medical screening, industrial quality control, semiconductor evaluation, security scanning, and packaging inspection. Adoption is expanding where stakeholders require imaging systems that can reveal hidden...

 Intel Core Ultra 250K Plus vs AMD Ryzen 5 9600X faceoff — battle for the best $200 CPU  - With similar pricing and target audiences, these two processors offer contrasting strengths across gaming, productivity, and power consumption.

 Commentary: Humanoid robot marathon highlights four industry benchmarks  - Embodied AI is moving out of the lab and into real-world environments at increasing speed. The humanoid robot half-marathon scheduled for April 19 in Beijing Economic-Technological Development Area (E-Town) is framed as a public race, but functions more as an industry stress test, compressing a full stack...

 Intel eases reliance on TSMC with 'Merica-made Core Series 3 processors  - Stripped-down Ultra for laptops and low-power edge boxes

 TSMC Chases Soaring AI Demand  - TSMC slams the gas to expand chip production for AI giants, but shortages loom. The post TSMC Chases Soaring AI Demand appeared first on EE Times .

 XPO  - Conventional wisdom says CPO wins by default as next-gen speeds increase power consumption (SerDes and DSP) and heat dissipation. And CPO overcomes this by replacing the long electrical trace with optics. But what if the current pluggable roadmap can be extended to deal with the power problem? XPO keeps...

 Intel® Xeon® 6 Processors Power Superior Agentic AI Performance Over AMD Turin on Google Cloud  - Why CPU choice determines your AI inference ROI, especially for agentic AI workflows

 Versatile heavy metal ion separation via biological ion-channel-inspired membranes  - Inspired by biological CaV channels that selectively speed up Ca²⁺ transport by using repulsion between single-file ions, here selective adsorbents are converted into selective membranes for the separation of heavy metal ions, including uranium, rare earth metals, copper and gold.

 Elektor to host EEI #59 on DIY synths and the Formant  - Elektor is hosting Elektor Engineering Insights #59 on Wednesday, April 29, with a session titled The Elektor Formant — Hardcore…

 Emulation-based SoC Security Verification (U. of Florida)  - A new technical paper, “Emulation-based System-on-Chip Security Verification: Challenges and Opportunities,” was published by researchers at University of Florida. Abstract “Increasing system-on-chip (SoC) heterogeneity, deep hardware/software integration, and the proliferation of third-party intellectual...

 Chinese LED chipmaker’s purchase of Dutch firm collapses after US opposition  - The failed Lumileds deal highlights the growing hurdles Chinese tech firms face in overseas acquisitions under tightening US policy

 Teradyne snaps up TestInsight to boost ATE for semiconductors  - The deal will help the ATE solution supplier scale its pre-silicon validation and automated pattern generation technologies. The post Teradyne snaps up TestInsight to boost ATE for semiconductors appeared first on EDN .

 EU DARE Project Is Scrambling to Replace Codasip  - EU DARE project explores alternatives after Codasip divestment creates uncertainty around roadmap and architectural direction. The post EU DARE Project Is Scrambling to Replace Codasip appeared first on EE Times .

 Texas Instruments board declares second quarter 2026 quarterly dividend  - The board of directors of Texas Instruments Incorporated (Nasdaq: TXN) today declared a quarterly cash dividend of $1.42 per share of common stock, payable May 19, 2026, to stockholders of record...

 Molex buys Teramount  - Molex is to buy Teramount, the Israel-based fibre-to-chip connectivity specialist for Co-Packaged Optics (CPO) and other silicon photonics applications. Teramount’s detachable, passive-alignment fibre-to-chip connectivity products for CPO enable faster data transfer rates for AI, cloud computing and...

 China willing to ‘buy’ or ‘steal’ US tech to get ahead in AI race, Congress told  - US lawmakers, experts accused Beijing of buying ‘what they can’ and stealing ‘what they cannot’ from America to advance their AI technology

 ECTC 2026  - IEEE 76th Electronic Components and Technology Conference 5/26/26 - 5/29/26 JW Marriott Grande Lakes Orlando, FL https://ectc.net/ SkyWater will be...

 IBM's Spyre AI Accelerator Deep Dive  - Enterprise AI Inference, Eight Years in the Making

 BE Semiconductor Industries N.V. Announces 2026 First Quarter Conference Call and Audio Webcast Details  - Duiven, the Netherlands, April 16, 2026 - BE Semiconductor Industries N.V. (“the Company” or "Besi"), (Euronext Amsterdam: BESI; OTC: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, will release its results for the first quarter ended March 31, 2026, on Thursday...

 How controlling light inside a tiny resonator could speed AI chips and secure communications  - A new technology allows light to be "designed" into desired forms, potentially making AI and communication technologies faster and more accurate. A KAIST research team has developed an "integrated photonic resonator"—a core ...

 Newswrap: TSMC Earnings, Nvidia I'm 'No Loser' CEO on Dwarkesh Podcast  - \u201CYou\u2019re not talking to somebody who woke up a loser.\u201D - Jensen Huang

 The Trouble with Transformers  - And the long slouch towards cyberpunk

 Smart Fab Supervision for Workforce Efficiency  - Applications 16 Apr 2026 Smart Fab Supervision for Workforce Efficiency Proliferating fab data creates new operational challenges.

 WEBINAR: Beyond Moore’s Law and The Future of Semiconductor Manufacturing Intelligence  - This is a live panel with industry experts who are on the leading edge of AI in semiconductor manufacturing. This is a must attend event for all levels of semiconductor professionals. I hope to see you there.

 Zirconia thin films unlock new reversible nonpolar-to-polar mechanism  - Researchers from National Taiwan University break traditional frameworks by unveiling a new symmetry-transition mechanism in ZrO2 thin films, achieving ultra-stable antiferroelectric behavior for up to 108 cycles.

 A Quantum Payload Reaches Orbit, Commercial Quantum Communication Is on the Horizon  - A CubeSat no larger than a shoebox entered low Earth orbit aboard SpaceX’s March 30th Transporter-16 mission, carrying a compact quantum…

 Conductive Silicone Market Trends, Size Surges to USD 5.01 Billion by 2033, Propelled by 5.5% CAGR - Verified Market Reports®  - shielding standards are catalyzing adoption across advanced manufacturing ecosystems. Market expansion is underpinned by rising electrification, semiconductor density optimization, and proliferation of flexible electronics. Material innovation spanning silver-filled elastomers, carbon-based conductive...

 半導體風雲/三星帶頭掀關鍵設備風暴 台積如何迎戰  - 台積電在16 的法說會上釋出AI需求強勁訊息,因此將打破以往在製程迭代達到一定上限就不再擴充的慣例,破天荒在台灣、美國及 本三地擴3奈米產能。台積電向法人釋出此訊號,證明AI晶片需求非常強勁,台積電也會積極擴廠,不會給競爭對手任何機會。不過,據調查,台積電已面臨2021...

 TOPPAN、コンテンツの新たな魅力発信ショップ「TOPPA!!! BASE AKIBA」でプロバスケットボールチーム「宇都宮ブレックス」とコラボ実施  - チーム所属選手やマスコットキャラクターをモチーフにしたドット絵の描き下ろしイラストで、2026 4 25 (土)からオリジナルグッズやデジタルフォトブースなどの提供開始

 In-Space Manufacturing Report 2026 identifies emerging UK strength  - Tracxn, the market intelligence company, has released its In-Space Manufacturing (ISM) Report 2026, on the global ISM startup ecosystem. The UK is identified as a “credible secondary hub”, attracting 10% of all funding. It finds there are around 15 main startups involved with orbital manufacturing...

 Nuvoton releases 4.5W 402nm violet laser, boosting power output by 1.5x  - Replacement of h-line (405nm) mercury lamp light sources targets maskless lithography for advanced packaging

 Supermicro computes edge AI using AMD’s EPYC 4005 processors  - Supermicro has announced a family of compact computers for edge AI built around AMD’s EPYC 4005 series processors. Described as edge-optimised systems, they are designed for AI inferencing and general-purpose workloads in space and power-constrained environments. For example, in retail, manufacturing,...

 \uD83C\uDF6A TWiC: Credo eats Dust, CPU and NAND shortage, Largan \u2192 CPO, Nuvacore  - This week in chips: Photonics = \u2764\uFE0F, shortages abound, and a CPU startup.

 Nuvia Founders Have A New Startup, Nuvacore  - They're Baaaaaaack! By they, SemiAccurate means two of the three co-founders of Nuvia Gerard Williams III and John Bruno. Read more ▶ The post Nuvia Founders Have A New Startup, Nuvacore appeared first on Semiaccurate .

 [Blog] Security in the Age of AI: Why Trust Is Moving Closer to Hardware  - In early 2026, a quiet shift became impossible to ignore: artificial intelligence (AI) moved from helping defenders to operating like an attacker at scale. The cybersecurity community took notice when researchers revealed that an advanced AI system, known publicly as Claude Mythos Preview, was able to...

 BrainChip and Quantum Ventura’s CyberNeuro-RT™ Named 2026 Enterprise AI Product of the Year by TMCnet  - BrainChip and Quantum Ventura’s CyberNeuro-RT™ Named 2026 Enterprise AI Product of the Year by TMCnet LAGUNA HILLS, Calif. – April 16, 2026 – BrainChip Holdings Ltd (ASX: BRN, OTCQX: BRCHF, ADR: BCHPY), the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic...

 Meta’s Broadcom Liaison Enters Next AI Phase  - Meta and Broadcom supercharge AI with custom MTIA chips. The post Meta’s Broadcom Liaison Enters Next AI Phase appeared first on EE Times .

 Oracle Expands AmpereOne M Portfolio With New A4 Instance  - Oracle expands its A4 portfolio with the new A4.Standard.Ax instance, combining AmpereOne M and Oracle Acceleron to power scalable AI inference and cloud workloads.

 US Critical Materials and Columbia University to advance domestic recovery of defense-critical metals from red mud  - Program includes mineralogical characterization, ambient-temperature oxidative leaching, selective separations, co-recovery of titanium dioxide and iron oxide, and techno-economic and life-cycle modelling

 Physics Underpinning Decisions: Simulation‑Trained AI Optimizes Tokens per Watt  - The rapid rise of AI factories is pushing data center infrastructure beyond the limits…

 Reimagining Chip Design - From Spec to Signoff with Cadence AI Super Agents  - At CadenceLIVE Silicon Valley 2026, Cadence took a major step toward fully autonomous…

 How nanomedicine gets inside your cells and treats you from the inside out  - Canadians swallow millions of pills every day to treat common health issues like high blood pressure, high cholesterol and Type II diabetes, but scientists are working at the molecular level to turn patients' cells into pharmacies.

 Tageos lança as primeiras linhas de produtos RFID baseadas em FlexIC do mundo alimentadas pela tecnologia Pragmatic Semiconductor  - 2022.Saiba mais em www.tageos.com.Sobre a Pragmatic Semiconductor A Pragmatic Semiconductor é pioneira na tecnologia flexível de semicondutores em larga escala para conectar de forma sustentável os mundos digitais e físicos.

 TSMC First-Quarter Net Profit Rises 58% on AI Demand, Beats Estimates  - Taiwan Semiconductor Manufacturing Co. (TSMC) posted record quarterly results, benefiting from the expansion of artificial intelligence (AI) demand. The company also signaled continued momentum into the second quarter, while easing concerns over materials supply disruptions linked to geopolitical te

 Gateworks and NXP Powers the Future of the Industrial Edge with M.2 AI Acceleration Card, Sensing and Adaptive Rendering  - Gateworks, an NXP Gold Partner, is a leader in embedded computing solutions for edge AI and industrial connectivity.

 Quantum Breakthrough: Unhackable Keys Sent Over 120 km Using Quantum Dots  - Quantum dot–based time-bin QKD achieves stable, long-distance secure communication with practical performance. Quantum key distribution is the most advanced area of quantum cryptography and offers fundamentally secure communication for the future quantum internet. Solid-state light sources such as semiconductor...

 Oracle Cloud Releases New OCI X12 Standard Acceleron Instance Powered by Intel® Xeon® 6 Processors  - Oracle Cloud Infrastructure (OCI) and Intel are excited to announce the release of OCI X12 Standard Acceleron Compute instances, powered by Intel Xeon 6 processors.

 Virtuoso Studio: Excellent XL- Layout XL Tools for Faster LVS Closure  - Ensure your layout perfectly matches the schematic. Click here to discover how the…

 TSMC Is Building as Fast as It Can \u2014 And It Still Won\u2019t Be Enough  - Original Article By SemiVision Research [Reading time: 14 mins]

 US lawmakers amend new restrictions on Chinese chipmakers — MATCH Act's blanket restrictions removed from select chipmaking tools  - U.S. lawmakers remove countrywide exports ban on cryogenic etching tools from the MATCH Act, yet Chinese companies could barely get them anyway.

 TSMC to Elon Musk: There are no Shortcuts in Building Fabs!  - The opening of the TSMC 2026 earning call series brought no surprises. CC Wei has done more than 30 such calls since taking the CEO position in 2018 and he never fails to disappoint. Once again, CC Wei reported numbers above guidance driven by strong demand and flawless execution. This illustrates the...

 Precision Meets Velocity: How Dextro Is Revolutionizing Fab Maintenance  - In semiconductor manufacturing, precision is everything. As chips become more advanced and fabs operate under unprecedented pressure to meet AI-driven demand, even the smallest maintenance error...

 Molex\u2019s Teramount Deal Signals a Shift Toward Scalable CPO Infrastructure  - Original Article By SemiVision Reserach [Reading time: 7 mins]

 300-unit-per-second roll-to-roll manufacturing of visible metalenses  - This work demonstrates industrial-scale roll-to-roll fabrication of high-efficiency visible metalenses using nanoimprinting and TiO 2 coating, achieving low cost, high throughput and uniform performance, enabling commercialization of metasurfaces.

 Carbon in the Age of AI Chips  - In 2026, the biggest carbon decisions in semiconductor design aren't made at the reporting stage — they're made at the design table. AI accelerators, high-bandwidth memory, and advanced node manufacturing are concentrating embodied emissions faster than most teams can measure. This Earth Day, TechInsights'...

 How to Plan Agentic AI Deployment for Chip Design  - With 50% of advanced silicon already AI-assisted, the industry is shifting from "copilots" to autonomous agents capable of 100x productivity gains. The post How to Plan Agentic AI Deployment for Chip Design appeared first on EE Times .

 Chinese chip tool makers hit record 2025 revenues  - China’s domestic semiconductor equipment suppliers posted record 2025 revenues as local fabs kept expanding capacity and sourcing around tighter export…

 Wideband RF in Electronic Warfare: Balancing Power, Bandwidth and Real-Time Performance  - Wideband electronic warfare pushes the limits of power, linearity and real-time response. This article outlines the design challenges and the engineering strategies that enable consistent, reliable operation across the spectrum.

Semicon News Aggregator Page: The freshest links are havested from the domains below.

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