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 RVA23 Ends Speculation’s Monopoly in RISC-V CPUs  - RVA23 marks a turning point in how mainstream CPUs are expected to scale performance. By making the RISC-V Vector Extension (RVV) mandatory, it elevates structured, explicit parallelism to the same architectural status as scalar execution. Vectors are no longer optional accelerators bolted onto speculation-heavy...

 [Insights] Memory Spot Price Update: DRAM Spots Top Contracts, Sentiment Cautious Ahead of Q2 Negotiations  - According to TrendForce's latest memory spot price trend report, regarding DRAM, as current spot prices remain higher than contract prices, and negotiations for 2Q26 pricing have not yet started, an overall wait-and-see atmosphere prevails. Meanwhile, NAND spot prices maintain an upward trend, climb......

 NVIDIA and Coherent back optics push with $2B deal  - NVIDIA and Coherent have struck a major strategic partnership aimed at pushing advanced optics technology into the…

 CEO Talk: Uttam Singhal of SignOff Semiconductors  - This interview features: Uttam Singhal, CEO, SignOff Semiconductors Pvt. Ltd. Tell me a bit about your background? How did you first get started with your company? I have spent over 25 years in the semiconductor industry, beginning my career in full-custom analog and memory design before transitioning...

 RFID Tags for Medical Devices: A Barcode Alternative to Enhance Reliability and Traceability  - Miniature RFID tags by Murata enable seamless system integration with durable, reprogrammable identification — delivering reliable tracking, authentication & traceability beyond the limits of traditional barcodes.

 Broadcom Makes Lasers?  - Broadcom's InP fab, EMLs at 1.6T, full-stack CPO play, and comparing against Lumentum and Coherent

 Go beyond disconnected CAD. Unify your design and engineering.  - Solve product development challenges and drive innovation with a seamless digital thread. Today’s products are more complex than ever—mechanical, electrical, and software components…

 LG Electronics and Qualcomm to Develop Next-Generation Telematics, Join Global 6G Coalition  - BARCELONA — LG Electronics said on Monday that it would develop next-generation telematics technology with Qualcomm, combining sixth-generation wireless communications, or 6G, with artificial intelligence to prepare for the era of software-defined and AI-defined vehicles.The announcement was made at...

 LAB14 joins the MIT.nano Consortium  - The advanced manufacturing group becomes a member and will contribute equipment to MIT.nano.

 Mad Max Meets Furiosa AI  - I recall seeing the very first Mad Max movie in 1979. In this torrid tale, a dystopian near-future Australia is facing a breakdown of civil order. Max (no relation) is a police officer who turns into a vigilante, which isn’t surprising when you see what he sees and experiences. All I can say is that...

 Humanoid Robots to Reach Nearly US$30 Billion by 2036  - According to the new IDTechEx report "Humanoid Robots 2026-2036: Technologies, Markets and Opportunities", the humanoid robot industry is entering an early commercialization phase, with adoption expected to scale first in industrial environments before expanding into broader commercial and consumer markets....

 Will Apple’s budget-priced iPhone 17e make a splash in China’s tough smartphone market?  - Presales for the new entry-level iPhone start on Wednesday, with a wide release set for March 11

 Plant pulse sensors: From soil probes to tree tattoos  - Botanical sensors are turning greenery into living data networks while monitoring plant health and optimizing yields. The post Plant pulse sensors: From soil probes to tree tattoos appeared first on EDN .

 Electroninks to Present Industry-Leading Silver Metal Complex Product Suite Platform for EMI Shielding at IMAPS DPC 2026  - AUSTIN, TX, UNITED STATES, February 26, 2026 /EINPresswire.com/ — Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, will showcase a breakthrough in advanced packaging materials at this year’s IMAPS Device Packaging Conference (DPC), presenting...

 Chip Industry Technical Paper Roundup: Mar. 3  - GNN acceleration; IGZO near-infrared sensing; LiDAR super-resolution for autonomous driving; cobalt ALD/MLD thin films; ultrafast laser nonlinear effects; atomic-scale GAA metrology; ReRAM-based neuromorphic online learning; GenAI SW-to-HW design; fusion-aware accelerator mapping; laser fault injection...

 Europe’s drive for digital sovereignty accelerates  - Digital sovereignty is becoming a key issue for both hardware and software. This drive to source more of the hardware…

 Cadence's Acquisition of Hexagon D&E: A Game-Changer for Multiphysics Innovation  - Having spent six rewarding years at Hexagon Design and Engineering (D&E), followed…

 The Materials Engineering Behind Silicon Photonics: Enabling the Next Leap in AI Computing  - Light-based interconnects dramatically improve AI computing speed, energy efficiency. Lam’s precision etch and dep tech make photonics manufacturable at scale.

 喜报 !新存科技荣获2024上海市浦东新区“明珠杯”创业大赛一等奖  - 2025 2 25 ,由上海市浦东新区人才工作局、浦东创投集团联合主办的2024浦东新区“明珠杯”创业大赛圆满落幕。新存科技凭借“大容量可规模量产三维新型存储芯片”的研发成果,荣获“明珠杯”创业大赛一等奖!

 [Blog] Inside Modern Industrial Robotics: Motor Control, Sensors, and Security  - The Industrial sector is in a moment of real transformation. While automated solutions like Industrial robotics have long been sources of speculation and hype, conversations are beginning to shift towards what’s realistically deployable in today’s factories and service environments. In a recent webinar...

 Apple’s iPhone 17 Series 5G mmWave Antenna Module Revealed to be Powered by Soitec FD-SOI Substrates  - Recent independent teardown and technical analyses have confirmed that the 5G mmWave antenna module powering Apple’s latest iPhone 17 lineup relies on advanced SOITEC based Fully Depleted Silicon-On-Insulator (FD-SOI) substrate technology. The discovery highlights a significant architectural shift in...

 CEO Interview with Echo Yang of CSCERAMIC  - Echo Yang is the CEO of CSCERAMIC, a China-based manufacturer specializing in advanced ceramic materials and precision ceramic components for industrial and laboratory applications. With a background spanning international trade, manufacturing coordination, and engineering-driven supply chain development,...

 A defunct Amazon Echo: Where did its acumen go?  - A multi-day weather-induced, utility electricity cutoff left this engineer’s residence unscathed…with one geriatric speaker exception. The post A defunct Amazon Echo: Where did its acumen go? appeared first on EDN .

 半導體風雲/輝達率先押寶A16製程晶片 台積電領軍供應鏈  - 輝達(NVIDIA) GTC 2026大會預定3 15 在美國加州聖荷西登場,這場盛會堪稱全球AI發展風向球。全球投資圈和半導體供應鏈,聚焦輝達在GTC上將發表推升AI發展的全新技術和產品。輝達執行長黃仁勳 前接受韓媒採訪時暗示將在GTC大會展示「從未見過」的技術進步,韓媒預測,輝達將發表的是革命性AI晶片Feynman,這款將是搭載全球首款1.6奈米製程的產品,最需要的是台積電的晶片......

 Renesas names new India president to accelerate growth amid fierce engineering talent competition  - Renesas has named two senior executives to lead its businesses in India and China, moves the company says are intended to accelerate growth in those markets.

 Single atoms of indium on hafnia enable superior CO 2 -based methanol synthesis  - Monoclinic HfO 2 stabilizes hydroxylated indium atoms that drive efficient CO 2 hydrogenation to methanol, offering a general strategy for coupling single-atom catalysis with reducible metal oxides and wide-bandgap dielectric supports.

 AI-assisted US strikes in Iran to intensify China drive for tech self-reliance: analysts  - AI’s militarisation adds momentum to China’s drive for domestic chips and infrastructure, analysts say

 Accelerating Chiplet Innovation with a New Partner Ecosystem  - The semiconductor industry is currently undergoing a massive shift. As we push the…

 Nvidia's Groq Plot Thickens  - Jonathan Ross 'Builds Fast'

 One vendor doesn't mind high RAM prices: VMware  - Memory tiering and pooled memory are having a moment because they offer the chance to use less RAM

 This week’s outside five sigma (#88)  - Cryogenic millimeter-wave silicon photonic crystal PCB fabrication

 Tool And Methodology Changes Coming In Fab And Package Automation  - How new equipment and methodologies are improving reliability, yield, and time-to-market for multi-die assemblies. The post Tool And Methodology Changes Coming In Fab And Package Automation appeared first on Semiconductor Engineering .

 [News] Asia’s Chipmakers Reportedly Eye $136B Spend in 2026, Up 25% YoY, Spanning Foundry and Memory  - Fueled by soaring demand for AI chips, memory, and logic processors, Asia’s top chipmakers are ramping up their 2026 capital spending. Nikkei and TrendForce report that leading semiconductor firms across South Korea, Taiwan, Japan, and China plan to invest over $136 billion this year, a 25% increa......

 EV battery testing market set for $9.22 billion surge by 2032  - The global electric vehicle (EV) battery testing and diagnostic services market is entering a new growth phase,…

 Nvidia-backed photonics startup Ayar Labs fills its wallet to mass-produce CPO chiplets  - Company aims to stitch tens of thousands of GPUs together for more efficient training and inference

 横須賀市、KDDI、TOPPANエッジ、横須賀市デジタル行政サービスの共同実証に合意  - ~オンライン手続きにおける不正利用や災害時コミュニケーションなどの課題を解決~

 WEBINAR: Two-Part Series on RF Power Amplifier Design  - At lower frequencies with simpler modulation, RF power amplifier (PA) designers could safely concentrate on a few primary metrics – like gain and bandwidth – and rely on relaxed margins to ensure proper operation in a range of conditions. Today’s advanced RF PA design is a different story. mmWave...

 Medtronic CFO Thierry Piéton to speak at upcoming investor conferences  - Medtronic plc (NYSE:MDT), a global leader in healthcare technology, today announced that Thierry Piéton, Medtronic executive vice president and chief financial officer, will participate in...

 Nvidia and Lumentum form $2bn AI optics partnership  - NVIDIA has struck a multiyear strategic partnership with Lumentum Holdings to accelerate the development of advanced optics…

 [News] SK hynix Reportedly Explores New HBM4 Packaging, Boosting Performance via Tight DRAM Gaps  - In the race for next-generation HBM, packaging has emerged as a new focal point. According to ZDNet, industry sources say SK hynix is advancing a packaging overhaul aimed at enhancing stability and performance, with the technology currently under validation. If successfully commercialized, it could ......

 Rohm outsources back-end processes to India's Suchi Semicon  - Rohm and Suchi Semicon have announced a strategic manufacturing partnership intended to strengthen semiconductor production capacity in India and support both domestic and international markets. The collaboration pairs Rohm's expertise in device technology and its global semiconductor presence with Suchi...

 Arm's Cortex X925: Reaching Desktop Performance ...  - A big, high performance core from Arm ...

 Huawei brings its flatpack AI datacenters, packed full of Chinese chips, to the world  - Claims it can build and deploy them fast, whether they run at speed is another matter

 Why Hardware Security Matters for Europe’s Digital Identity Revolution  - Secure digital identity across Europe: how the EUDIW initiative and NXP’s hardware-based Secure Elements protect user data and privacy.

 US considers capping Nvidia H200 sales at 75,000 per Chinese customer  - Shares of Nvidia slipped in late trading on the news, falling almost 1 per cent to a low of US$181

 Rohm licenses TSMC GaN process technology  - Rohm is licensing TSMC’s GaN process technology and installing it at its Hamamatsu fab. Rohm has been running a GaN process at Hamamatsu for four years, initially with a 150V process and, since 2023, with a 650V process. Rohm intends to have the TSMC process up and running in 2027. In 2024 Rohm and...

 Lumentum and the Laser Bottleneck  - Lumentum is winning and still can't keep up. Coherent is closing in. Earnings, sell-side sentiment, and the tensions to track.

 AMD's Ryzen 7 9850X3D: A Review  - A Consumer CPU for Gamers

 Latest issue of Semiconductor Today now available  - For coverage of all the key business and technology developments in compound semiconductors and advanced silicon materials and devices over the last month

 Silicon Labs Expands Hyderabad Facility in Ceremony Attended by U.S. Consul General  - Approximately 50% footprint increase strengthens global wireless R&D and highlights U.S.-India innovation ties HYDERABAD, India and AUSTIN, Texas, March 2, 2026 /PRNewswire/ -- Silicon Labs...

 Synopsys Initiates $250 Million Accelerated Share Repurchase Agreement  - Synopsys, Inc. (Nasdaq: SNPS) today announced that it has entered into an accelerated share repurchase agreement (ASR) with The Bank of Nova Scotia to repurchase an aggregate of $250 million of...

 Huawei holds global debut for AI computing clusters in challenge to Nvidia  - US-sanctioned Huawei Technologies brings ‘world’s most powerful’ AI compute systems to an international audience at MWC Barcelona 2026

 GTC 2026 Preview | Implications of Nvidia's SRAM-Decode Hardware on the Inference Market  - The case for dedicated decode hardware and what it means for AMD, HBM, and the SRAM startup market.

 Stretching a bit  - Using a single GPIO port on a microcontroller to control N bits of arbitrary parallel binary outputs, e.g., a multi-digital display. The post Stretching a bit appeared first on EDN .

 Micron sampling 256GB LPDRAM module  - Micron is sampling a 256GB LPDRAM module — 256GB SOCAMM2 – based on a 32Gb LPDDR5X die. “Micron’s 256GB SOCAMM2 offering enables the most power-efficient CPU-attached memory solution for both AI and HPC. Today’s announcement highlights Micron’s technology and packaging advancements to deliver...

 MWC 2026 - Extreme Zoom Smartphones and Privacy-first AI Glasses  - The MediaTek Dimensity 9500 is redefining what smartphone cameras and NPUs can do at MWC 2026.

 AI Networking Arms Race Heats Up: 800G Today, 1.6T Tomorrow  - Original Article By SemiVision Research [Reading time: 20 mins]

 United Semiconductors reserves payload space with Starlab to advance commercial-scale in-space semiconductor manufacturing  - Microgravity crystal growth production on Starlab space station to help strengthen US semiconductor supply chains and next-generation technology development.

 Scientists Uncover “Mouse Bite” Defects Inside Computer Chips  - A stunning new imaging breakthrough lets scientists see — and fix — the atomic flaws hiding inside tomorrow’s computer chips. Researchers at Cornell University have achieved something chipmakers have long wanted. Using advanced high-resolution 3D imaging, they have directly observed atomic-scale...

 [Blog] Inside Modern Industrial Robotics: Motor Control, Sensors, and Security  - The Industrial sector is in a moment of real transformation. While automated solutions like Industrial robotics have long been sources of speculation and hype, conversations are beginning to shift towards what’s realistically deployable in today’s factories and service environments. In a recent webinar...

 Custom design PWM filters easily  - An approach to design custom PWM filters using a visual basic application spreadsheet automatically launch a simulation to confirm results. The post Custom design PWM filters easily appeared first on EDN .

 The Chip Insider®–Vision is not engineering. Lessons from Gary Dickerson, Ajit Manocha, and Pat Gelsinger.  - Explore how visionary leadership shapes the semiconductor landscape, from expansive AI-era forecasts to trillion‑dollar industry horizons—and the tactical missteps that show why vision must inspire, not overwhelm.

 Toray powder delivers smooth, strong 3D printed parts  - Toray Industries is sampling Toraypearl polyamide (PA) 12, a truly spherical PA12 powder widely compatible with powder bed fusion (PBF)-type 3D printers. Leveraging Toray’s proprietary polymer particle engineering technology, the new material enables both surface smoothness and impact strength in 3D-printed...

 Qualcomm's 6G push signals broader shifts in AI and wireless priorities for devices and industry  - At MWC 2026, Qualcomm outlined a strategy to pair advanced AI processing with next-generation wireless technologies, presenting new chips and systems intended to influence wearables, Wi‑Fi infrastructure, industrial automation, and early 6G experimentation. The company also formally launched its...

 Analyzing Non-Conductive Material with Low-Vacuum SEM Imaging  - Challenges of non-conductive sample imaging Electron microsc... by Dr. Kate Vanderburgh / 03.03.2026

 Credo CEO Interview: The Most Important Thing From Earnings  - Last time I was bullish on Credo, the stock doubled in four months. I'm bullish again.

 AI Server Storage Demand Surges; Top Five NAND Flash Suppliers Post 23.8% QoQ Revenue Growth in 4Q25, Says TrendForce  - The global NAND Flash industry continued to benefit from AI infrastructure build-outs in 4Q25, according to TrendForce’s latest research. All in all, the combined revenue of the top five NAND flash suppliers sharply rose 23.8% QoQ to US$21.17 billion.

 Extending Formal Verification to Sequential Circuits (U. of Bremen)  - Researchers from University of Bremen have released “Linear Formal Verification of Sequential Circuits using Weighted-AIGs”. Abstract “Ensuring the functional correctness of a digital system is achievable through formal verification. Despite the increased complexity of modern systems, formal verification...

 Performance Unlocked: Introducing the Ampere Performance Toolkit (APT)  - The APT helps: establish a consistent, predictable benchmarking approach, eliminate system-level bottlenecks, analyze application bottlenecks, and perform microarchitectural analysis.

 Singapore eyes barge-based hydrogen power for datacenters  - Saves real estate by putting the power on the water

 Innovus 在线培训上线中文字幕与逐字稿,这份快速上手指南请收好  - 为帮助中文用户更顺畅地学习Innovus 相关流程,Innovus Block Implementation with Stylus Common UI 在线课程已上线中文字幕…

 Accelerate Your IP Selection With Smart Solido Library Profiler  - Key workflow phases and challenges during IP selection. The post Accelerate Your IP Selection With Smart Solido Library Profiler appeared first on Semiconductor Engineering .

 China now holds more cards ahead of Xi-Trump meeting  - US Supreme Court reversal of Trump’s tariffs leaves China with lower tariffs and US deals with allies in doubt

 A Half-Century Odyssey in Semiconductors: Kinam Kim's Samsung Journey of Innovation and Insight  - Original Article By SemiVision Research [Reading time: 20 mins]

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