Semi. Fabs and Clean Rooms 64m ago: Recent discussions focus on India's push for semiconductor fabs including Tata-PSMC Dholera project targeting 28-110nm nodes, US groundbreakings by Micron in Syracuse and SK Hynix in Indiana, TSMC's additional Arizona investments, and supporting ecosystem developments like environmental catalysts for fab operations.
AI is Changing Infrastructure Planning. Here’s Why - Artificial Intelligence AI is Changing Infrastructure Planning. Here’s Why AI is reshaping infrastructure planning by shifting focus from standardized architectures to flexible, data-driven strategies that support evolving workloads, governance needs, and long-term data value.
EE Times Magazine – September 2026 - The September 2026 edition of EE Times Magazine examines how smarter buildings combine ambient energy harvesting, sensing, AI, and connected systems to improve safety while protecting privacy. The post EE Times Magazine – September 2026 appeared first on EE Times .
OpenAI Jalapeño: The Architectural Decisions Behind Its Inference Efficiency - OpenAI Jalapeño's benchmark results have attracted attention, and a closer look at the design choices provides important context for understanding the performance. This article presents TechInsights’ commentary on the decisions disclosed at Hot Chips.
Korea posts world's No. 2 current account surplus in first half, behind China - Korea posts world's No. 2 current account surplus in first half, behind China At $233.1 billion through July, Korea’s current account surplus reached nearly twice last year’s full-year total, propelled by semiconductor exports. 9/4/2026 - 03:48 AM News Team
Chip Industry Week In Review - India's $13.4B Semicon 2.0; SEMICON Taiwan; PCIe 6/7 test; MediaTek, NVLink Fusion deal; state of the industry report; AI for fabs; 2D Tunnel FET; 300mm Si photonics; InP expansion; $75M to recycle rare earths; GF PDKs for 22nm, 40nm; Gain-Cell RAM; MIPS edge AI developer platforms; in-memory photonic...
Low-Frequency Charge Noise in Bilayer Graphene Quantum Dots - Bilayer graphene (BLG) quantum dots (QDs) are a promising platform for semiconductor qubits. However, the low-frequency charge noise that may ultimately limit coherence has remained largely unexplored. Here, we systematically characterize charge noise in gate-defined BLG QDs using transport-based noise...
Get Out While You Can Silicon Valley VC Tells AI Founders - “Founders running successful AI companies should all take a cold, hard look at exiting in the next 12-18 months, which may be a value-maximizing moment for outcomes,” says Silicon […] The post Get Out While You Can Silicon Valley VC Tells AI Founders appeared first on Electronics Weekly .
Technical Case Study: MicroLED Yield Management with Plessey and yieldWerx - Plessey Semiconductors manufactures monolithic MicroLED displays for near-eye augmented-reality systems, where pixel pitch, brightness, uniformity, and defect density directly determine usable yield. Its process integrates device design, epitaxy, wafer fabrication, bonding, and production in one facility....
Unified Emulation and Prototyping: Pipedream or Reality? - Preamble Hardware-assisted verification (HAV) platforms, including hardware emulators and FPGA-based prototyping systems, are the two dominant methodologies for validating long workloads on complex System-on-Chip (SoC) designs before tape-out . HAV sits within a broader continuum of verification engines...
India’s Quantum Journey Goes Beyond the Qubit - IBM’s Amaravati deployment could accelerate India’s quantum ecosystem as startups develop processors, software, and supporting technologies. The post India’s Quantum Journey Goes Beyond the Qubit appeared first on EE Times .
Skeleton and Infineon hook up on SSTs - Infineon and supercapacitor specialist Skeleton Technologies have signed an MoU to collaborate on high-efficiency, resilient power solutions for modern datacentres. The rapid growth of AI, increasing power demand and the […] The post Skeleton and Infineon hook up on SSTs appeared first on Electronics...
Fraunhofer’s Precision Optics to Make Plant Health Visible from Space - How much light do plants emit, and what can this light emission tell us about the health of the plants? The new European Space Agency’s (ESA) mission FLEX, standing for “Fluorescence Explorer,” scheduled to launch in mid-September, will address this question. At the heart of the satellite will be...
Finger-friendly DPOT pushbuttons do ups, downs, and dittos - Simple labor-saving circuit remedy comprises just four added passive parts, saves hard-working fingers from unnecessary wear and tear. The post Finger-friendly DPOT pushbuttons do ups, downs, and dittos appeared first on EDN .
Commentary: China builds three-pronged memory strategy around CXMT, YMTC, XMC - China's memory industry is shifting from a single-champion model towards a three-pronged structure. ChangXin Memory Technologies (CXMT) is building its position in DRAM, Yangtze Memory Technologies (YMTC) in 3D NAND, while Wuhan Xinxin Semiconductor Manufacturing (XMC) is concentrating its next phase...
Semiconductor Analytics – September 2, 2026 - Semiconductor sales decreased on a weekly basis but were up on a yearly basis the week ending August 28, 2026. The 13-week MA for NAND IC increased YoY last week. This is a data analytics platform that gives weekly sales for the semiconductor market. This analysis covers total semiconductors and ICs;...
Podcast EP364: The Broad Impact of Advanced Mask Solutions, Today and Tomorrow with Dr. Germain Fenger - Daniel is joined by Dr. Germain Fenger, Senior Director of Product Management at Synopsys where he leads advanced mask solutions and computational lithography technologies. With a background spanning semiconductor manufacturing, lithography research, engineering, and product leadership, Germain has held...
iSpace leading ESA’s first lunar polar ice exploration rover mission - iSpace-Europe and the European Space Agency (ESA) have officially agreed the MAGPIE mission, Europe’s first lunar polar ice exploration rover. MAGPIE stands for the “Mission for Advanced Geophysics and Polar […] The post iSpace leading ESA’s first lunar polar ice exploration rover mission appeared...
Sivers Semiconductors Puts $30M Toward European Expansion - Sivers Semiconductors has invested $30 million to significantly expand its indium phosphide (InP) manufacturing facility in Glasgow, Scotland as the company prepares for anticipated customer production ramps driven by growing AI datacenter and...
Commentary: Apple shifts to smart vehicle software layer as Ternus era arrives - When Apple abandoned Project Titan, automotive supply chain insiders predicted the tech giant wouldn't bow out of the smart vehicle market entirely; it would simply approach the market from a different angle. Judging by its recent collaboration with Ford Motor, Apple is pivoting toward software-layer...
When the Package Becomes an Electrical Design Variable - AI power integrity now lives inside the package, not just the PCB. Treat chip, package, and board as one PDN. The post When the Package Becomes an Electrical Design Variable appeared first on EE Times .
Shinsegae chairman attends U.S. AI, semiconductor Foundry School launch - Shinsegae chairman attends U.S. AI, semiconductor Foundry School launch Shinsegae chairman Chung Yong-jin attended the State Department’s Foundry School launch as the group expands its Korea-U.S. data center partnership. 9/3/2026 - 11:36 PM KIM MIN-YOUNG
First Principle Analysis of the Magnetism and Electronic Structure of Fe2XSi (X=Ti, V) - …titanium (Ti) and vanadium (V), are investigated using computational methods. Volume optimization reveals that the ground state of Fe2TiSi is a nonmagnetic narrow-band gap semiconductor , and that of Fe2VSi is a ferrimagnetic metal. The negative formation energies of both materials confirm the stability...
[News] Micron Reportedly to Add 60K HBM Wafers/M, Reaching 100K by Year-End to Narrow Gap With Rivals - As Samsung races to ramp HBM4 and narrow the gap with SK hynix, Micron is also turning to HBM as a new growth engine beyond surging conventional DRAM prices. According to ETNews, the U.S. memory giant is stepping up its HBM expansion, with capacity expected to increase by as much as 60K wafers/month......
Korea’s local governments lose sight of fiscal reality as debt piles up - Korea’s local governments lose sight of fiscal reality as debt piles up Rising deficits, costly facilities and expanding subsidies are straining local governments as their own tax revenue falls behind spending. 9/3/2026 - 03:48 AM News Team
What’s in the September Issue? - Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the September issue and pick up an issue in print at SEMICON West! The post What’s in the September Issue? appeared first on Semiconductor Digest .
Where will RISC-V be in 20 Years? Poll Results - All the way back in August 2023, in the midst of a series of posts on the RISC-V architecture, I ran a reader poll on the future of the architecture, with the following introduction:
The president's escape act - The president's escape act A columnist argues that President Lee Jae Myung's survival instincts now threaten judicial independence and public standards. 9/2/2026 - 11:01 AM Opinion Desk
DAC 2026: A Discussion of Who Owns the Intelligence Behind Tomorrow’s Chips and How to Make it Better - The industry is moving from simple documentation chatbots to agentic workflows capable of performing complex, multi-step tasks like design creation, verification, and library characterization. These agents are intended to enhance engineering productivity by roughly 50%. A panel of industry experts met...
Ask the headhunter - Recently, the department at a large chip company where I’ve worked for several years was closed, leaving me to look for another job.
Mercedes Spinout Athos Closes Its Doors - The startup was unable to secure the financing required to continue commercialising its chiplet-based technology The post Mercedes Spinout Athos Closes Its Doors appeared first on EE Times .
MRAMs accelerate adoption in aerospace and defense designs - Teledyne HiRel adds magnetoresistive RAMs (MRAMs) to its non-volatile memory portfolio for aerospace and defense applications. The post MRAMs accelerate adoption in aerospace and defense designs appeared first on EDN .
Technical Report: Navitas NV6428 Bi-Directional GaNFast Power IC Process Flow Full - The Navitas NV6428 is a bi-directional, 4-quadrant gallium nitride (GaN) power switch based on GaNFast™ technology, implemented using a common-drain configuration of two GaN high-electron-mobility transistors (HEMTs). This bi-directional switch (BDS) is rated for a 650 V continuous (800 V transient)...
Open Cosmos becomes approved provider for UK sovereign comms - Open Cosmos, the Harwell, Oxfordshire-based company, has been selected as an approved supplier – via the UK’s Government Commercial Agency (GCA) – to provide satellite connectivity through its low Earth […] The post Open Cosmos becomes approved provider for UK sovereign comms appeared first on...
Data density: The constraint reshaping wireless for edge AI - The limiting factor for edge AI is not simply bandwidth, but wireless network’s ability to sustain multiple high-throughput data streams in a confined space. The post Data density: The constraint reshaping wireless for edge AI appeared first on EDN .
Hitachi expands HMAX for physical AI - Hitachi has expanded its HMAX portfolio with new data center, cybersecurity and data-management offerings aimed at accelerating the use…
AeroVironment Secures $465M Army Contract - AeroVironement (AV), a developer of autonomous and counter drone systems, has been awarded a contract valued at $464.8 million by the U.S. Army Portfolio Acquisition Executive for Fires (PAE Fires) program office for the Enduring-High Energy Laser (E-HEL) program. The award represents the first production...
Narrative: Smartphone App Processors Q2 2026 - The global smartphone applications processor (AP) market declined 13% year-on-year in unit growth during Q2 2026, with a corresponding 13% year-on-year revenue decline. The smartphone market will increasingly be defined by the success of flagship devices and the adoption of generative AI and the latest...
New Twist on the Einstein Problem Reveals Unexpected Physics - Optical structures based on the Smith hat produced unusual light patterns that reflected their lack of mirror symmetry and changed with light direction and polarization. The Smith hat first drew global attention in 2023 because a single tile could cover an entire surface without ever creating a repeating...
Humanoid Compute, Security More Complex Than AVs - Robots and autonomous vehicles are both edge devices, but a humanoid has wheels as well as fingers. Close interaction with humans raises the stakes. The post Humanoid Compute, Security More Complex Than AVs appeared first on Semiconductor Engineering .
Why press-fit technology continues to expand - As press-fit is deployed across more applications, PCB interconnects must handle increasing levels of integration, power density and connector density, writes Michael Meckl. Figure 1: Cross-sectional comparison of soldered and […] The post Why press-fit technology continues to expand appeared first...
The president's escape act (KOR) - The president's escape act (KOR) A columnist argues that President Lee Jae Myung's survival instincts now threaten judicial independence and public standards. 9/2/2026 - 08:54 PM Opinion Desk
Containing AI Agents With a Will of Their Own - Meta recently open-sourced a capable, large-scale agent model — 30 billion parameters, a rough measure of the model’s size and complexity. It’s free, downloadable, and runs, per Meta’s own benchmarks, on a MacBook Pro with an M4 Max or M5 Max chip and 32GB of memory. Their rationale is that powerful...
Robotics computer doubles edge AI performance - NVIDIA’s Jetson Orin Nano 2 system-on-module delivers nearly twice the inference performance of its predecessor, the Jetson Orin Nano Super. The post Robotics computer doubles edge AI performance appeared first on EDN .
What a Die-level Analysis Reveals About Apple's M5 Pro GPU Design - When Apple announced the processor, much of the discussion focused on how the two dies were connected and the role of TSMC's SoIC-X face-to-face (F2F) hybrid bonding technology. The next question is how Apple laid out the GPU die, which we examined in our latest Digital Floorplan Quick Look (DFQ).
