Semi. Fabs and Clean Rooms 9½h ago: Recent posts focus on TSMC in early talks with Elon Musk's Terafab project for a potential joint venture to build U.S. chip capacity, with TSMC's yield expertise highlighted as critical. TSMC raising 2026 capex to $64B and advancing 2nm production in Taiwan. VIS (TSMC affiliate) evaluating a second Singapore fab. Broader commentary on cleanroom square footage and ASML EUV bottlenecks limiting fab speed.
SmallTV Hacking With Surprisingly Little Fuss - We’ve seen the GeekMagic SmallTV line of devices before — these cheap gadgets combine a microcontroller and a display in a little plastic case that can be used to show …read more
High-end packaging: a market set to nearly quintuple by 2031 - Advanced packaging has become the place where AI system performance is won or lost. High-end performance packaging revenue is forecast to grow to more than $51 billion in 2031, a 27% CAGR during 2025-2031, with package unit volume expanding at a 33% CAGR and wafer demand at 30%. The gap between those...
Open Cosmos aims for 192 satellites - Open Cosmos, observation satellite constructor, which recently raised €300 million, says the that 192 satellites will form the core of its ConnectedCosmos LEO constellation. The company aims to have 96 […] The post Open Cosmos aims for 192 satellites appeared first on Electronics Weekly .
Has the Memory Cycle Broken? Plus: Nvidia & Broadcom’s $40B+ Financing Playbook - In this episode of The Circuit, Ben Bajarin and Jay Goldberg unpack the shifting structural economics of the semiconductor and AI landscape. Following Micron’s latest earnings, they kick off with a deep-dive debate on whether the memory market has permanently raised its floor to $600B–$800B, or if...
Time frequency distributions of optical sources (I): directly modulated semiconductor lasers - We develop a time frequency framework for the dynamics of directly modulated semiconductor lasers in which the optical field obtained from the singlemode rate equations is represented by distributions of Cohen class. Closed form small signal solutions are derived for RC filtered square current pulses...
Reducing Contact Resistance Pushes 2D Transistors Toward Advanced CMOS (HUST, PolyU, UCSB, NUS) - Researchers at Huazhong University of Science and Technology, Hong Kong Polytechnic University, University of California, Santa Barbara, and National University of Singapore published a technical paper titled “Low contact resistance and high current density in ballistic p-type transistors based on oxygen-doped...
FuzeHub Blog: How Upstate New York is Reinventing Semiconductor Manufacturing - Photo courtesy of FuzeHub For decades, America’s semiconductor supply chain has depended heavily on overseas manufacturing. Now that’s changing thanks to a reshoring effort where New York State is playing a leading role. As Upstate New York becomes an epicenter of advanced microelectronics, the region...
Omnivision’s OAX7700 is ultralow-power vision AI processor with NPU - Omnivision’s OAX7700 asic is the company’s lowest-power AI companion processor for always-on vehicle security systems. It positions the device as an upgrade to existing exterior camera solutions such as surround-view […] The post Omnivision’s OAX7700 is ultralow-power vision AI processor with...
Oversized Cable Exits - Yamaichi Electronics is expanding its Y-Cir P T-Series with new Oversize Cable Exits. These allow for the use of larger cable diameters by utilising cable exits from the next larger […] The post Oversized Cable Exits appeared first on Electronics Weekly .
SK hynix shareholders move to block Solidigm Nasdaq listing over dilution fears - SK hynix shareholders move to block Solidigm Nasdaq listing over dilution fears Minority shareholders are pressing Korea Exchange to address potential dilution from a Nasdaq listing of SK hynix’s Solidigm subsidiary. 10/4/2026 - 10:54 PM News Team
AI-EDA Agents Can Prove Their Value - Before EDA becomes AI-native, focused agents have a window to prove measurable engineering value inside existing design flows.
Welcome Ron Piccolo, Ph.D. to Our Stakeholder Advisory Board - FSI Stakeholder Advisory Board Update – October 2026 We are thrilled to welcome Ron Piccolo, Ph.D. to The Florida Semiconductor Institute Stakeholder Advisory Board. Dr. Ron Piccolo brings extensive experience across technology, higher education, and workforce development. He currently serves as President...
CXL-Connected MRAM Address AI Storage Latency - Everspin’s demo shows how a 4-GB pool of persistent MRAM can serve as a new tier of storage between DRAM and NAND flash. The post CXL-Connected MRAM Address AI Storage Latency appeared first on EE Times .
Chungcheongbuk Governor Sets 100 Trillion Won GRDP Goal by 2030 - In the economic and industrial sector, the government will create a 200 billion Korean won Chungbuk Startup Fund, promote the Osong K-Biosquare, establish an advanced semiconductor post-processing hub
Podcast EP371: How Vinci is Revolutionizing Hardware Design with John Bruggeman - Daniel is joined by John Bruggeman, Chief Marketing Officer at Vinci, where he leads the company’s market narrative and strategic positioning. His work focuses on translating complex technical advances into clear category definition, industry relevance, and market adoption.
Advancing The CFET-Based Device Roadmap: Novel Integration Modules And Standard Cell Configurations - Part 2: Towards scalable sCFET standard cell architectures: split-gate devices, a 5T+1 CFET SRAM bit cell, and improved back-end-of-line routability. The post Advancing The CFET-Based Device Roadmap: Novel Integration Modules And Standard Cell Configurations appeared first on Semiconductor Engineering...
Magnachip Expands Gen6 Super-Junction MOSFET Line with 15 Devices - Magnachip Semiconductor Corporation today announced the expansion of its power semiconductor portfolio with 15 new sixth-generation (Gen6) E6 super-junction (SJ) MOSFETs for consumer and computing power applications. The post Magnachip Expands Gen6 Super-Junction MOSFET Line with 15 Devices appeared first...
Siemens CTO update on Calibre at DAC 2026 - At DAC 2026 I had the opportunity to speak with Juan Rey, CTO Siemens EDA about the Calibre product used for IC physical verification, circuit verification, 3D IC and DFM optimization. Juan has been involved with Calibre since 2001, served on the Board of Directors of Silicon Integration Initiative (SI2),...
Lee administration hides behind public deliberation - Lee administration hides behind public deliberation Public deliberation is stalling urgent decisions on nuclear power and semiconductor labor rules. 10/5/2026 - 11:01 AM Opinion Desk
An Apple-plus-Google adapter that’s AI in name only (sigh) - Is there actually any AI in the “AI Box”? Doubtful. But it’s durable, along with platform-nimble. And the attractive price is indisputable. The post An Apple-plus-Google adapter that’s AI in name only (sigh) appeared first on EDN .
Mixed Reality System Improves Point-of-Care Ultrasound Imaging for Trauma - Ultrasound is used in emergency care to quickly assess the extent of internal injuries. One of the most common applications for ultrasound is the focused assessment with sonography for trauma (FAST) examination, which helps clinicians identify signs of internal bleeding and the effects of thoracic injury....
The Agentic AI Super Cycle - AI is the biggest revolution of our lives, and it will grow exponentially into the 2030s. The post The Agentic AI Super Cycle appeared first on Semiconductor Engineering .
연간 설비투자 '2배' 늘리는 마이크론…삼성·SK 압박 - 미국 메모리 업체 마이크론이 내년에 전년비 2배에 가까운 설비투자를 계획하고 있다. 삼성전자·SK하이닉스 등에 준하는 가파른 증가세다. 인공지능(AI)용 고부가 메모리 수요가 ...
You betcha: Startups believe autos need more sensor modalities - Autotech Council Startup Review at Sensors Converge 2026 brought out thinking that future autos can benefit by better and different sensors. And the startups backed up that thinking with tech.
Teradyne Integrates Burn-In and System-Level Test for High-Power AI Chips - Chipmakers can lower cost of test, factory floor space, and time to market for high-power AI, automotive, and other high-reliability devices. The post Teradyne Integrates Burn-In and System-Level Test for High-Power AI Chips appeared first on Semiconductor Digest .
Beyond the Die: Verifying the Connected Chip - One of the standout presentations at the 2026 TSMC OIP Forum highlighted a collaboration between Siemens EDA, Marvell, and TSMC. I always appreciate EDA presentations that bring together customer and foundry perspectives, and this one did not disappoint. We follow 3D IC technology closely and have published...
2026-2027 CMR CVD ALD Hi K and Metal Precursors - This Critical Materials Report delivers a cohesive view of the 2026-2027 semiconductor CVD / ALD Hi K and metal precursor materials market, combining demand forecasts, supply dynamics, competitive positioning, and pricing trends. It describes the value chain through profiling key players while identifying...
Microchip, Navitas 800V DC-to-6V DC reference design for AI datacentres - Microchip Technology and Navitas Semiconductor have partnered to collaborate on an 800V DC-to-6V DC reference design for AI datacentre rack power applications. It combines Microchip’s digital power control and security […] The post Microchip, Navitas 800V DC-to-6V DC reference design for AI datacentres...
Reducing I/O requirements for optical detection - Although this project may be a bit esoteric, the concepts shown to reduce I/O requirements can also be applied to other systems. The post Reducing I/O requirements for optical detection appeared first on EDN .
Industry minister says Alaska LNG has 'strategic value' as global energy routes shift - Industry minister says Alaska LNG has 'strategic value' as global energy routes shift The latest position follows a tense week after U.S. Donald Trump announced seemingly unilaterally that Seoul will invest at least $50 billion. 10/6/2026 - 06:21 AM News Team
[News] Seagate, Toshiba Reportedly Vie for TDK’s HDD Head Unit, a Key Independent Supply Source - As Toshiba moves to double HDD capacity by fiscal 2027 to capture booming AI data-center demand, it could be making another push to secure its supply chain. According to Bloomberg, the Japanese storage giant is battling Seagate for TDK’s magnetic-head business, a critical component for ramping HDD......
Continuity testing in semiconductor ATE: Fundamentals and test methods - Continuity testing is the first test performed in any semiconductor test flow, verifying that a device under test (DUT) is properly connected to automatic test equipment (ATE). The post Continuity testing in semiconductor ATE: Fundamentals and test methods appeared first on EDN .
Meta, Microsoft reportedly cut internal Claude use as AI costs rise - Meta and Microsoft are reducing employees' internal reliance on Anthropic's Claude as they push proprietary AI tools and seek greater control over rapidly rising AI costs, according to The Information . The shift comes even as both companies continue to use Anthropic models in products and cloud services....
Field-free dual superconducting diode via photon-assisted interference - Non-reciprocal transport underpins key functionalities in signal processing and logic; however, conventional semiconductor diodes exhibit reduced performance at sub-Kelvin temperatures. As cryogenic electronics continue to scale, there is increasing demand for diode operation compatible with low-temperature...
Key Cloud and Digital Services Revenue to Exceed $5 Trillion in 2031 - AI-driven demand is pushing cloud and digital services beyond previous growth expectations. TechInsights forecasts the worldwide market will exceed $5 trillion in annual revenue by 2031, led by continued growth across cloud computing, SaaS, social media, and search.
GPT-Synopsys Combines IC Design EDA with Agentic AI - Synopsys joins OpenAI for a leap of faith in AI-native IC design by augmenting frontier models with EDA tools. The post GPT-Synopsys Combines IC Design EDA with Agentic AI appeared first on EE Times .
[News] China-Based CS Microelectronics Develops 90W Addressable VCSEL Chip - CS Microelectronics, a subsidiary of Vital Technology Group , recently announced the successful development of a high-power 2D addressable VCSEL (Vertical-Cavity Surface-Emitting Laser) chip. Designed for high-end LiDAR and industrial sensing applications, the newly developed product departs from...
2026 AI Agent Breaches - It has been a busy year for sure. In 2026, artificial intelligence agents conducting cybersecurity tests crossed into real computer systems. The incidents had different causes and impacts. Some agents exploited flaws to escape isolation; others had unintended internet access and mistook real organizations...
