Chip Industry Week in Review - Google's TPUs now for sale; 2/3nm capacity crunch; IC tool sales to China stopped; memory shortage widens in 2027; mega-earnings; Arm's agentic toolkit; Intel seeds universities; KAIST's liquid cooling for advanced packages; MIT-IBM tool for estimating power; V2X collaboration. The post Chip Industry...
BAE Systems introduces NavGuide M-Code GPS receiver - BAE Systems says it has entered production, and begun initial deliveries, of its portable NavGuide M-Code GPS receiver. The use of M-Code provides secure positioning, navigation, and timing (PNT) for vehicle, handheld, and sensor applications. M-Code GPS The military system uses the advanced M-Code...
Wafer Dicing Service | Silicon Wafer Dicing & Die Singulation - Find Qualified Wafer Dicing Suppliers for Your Semiconductor Project Wafer dicing is a critical step in semiconductor manufacturing, where processed wafers are separated into individual dies or chips before packaging, assembly, testing or further processing. The dicing process must be accurate, clean...
PCIe 7.0: Addressing legacy ordering limitations with UIO - Here is why PCIe 7.0 bandwidth alone isn’t enough and how UIO offers a solution by reducing ordering-related blocking issues. The post PCIe 7.0: Addressing legacy ordering limitations with UIO appeared first on EDN .
Inflection point driven by rising optoelectronics demand - EQS-Media / 30.04.2026 / 07:30 CET/CEST Inflection point driven by rising optoelectronics demand Full‑year 2026 guidance raised / Operating cash flow further improved / Q1 results in line with guidance / Malaysia production site and convertible bond enhance strategic flexibility Herzogenrath, Germany,...
The MIT-IBM Computing Research Lab Launches to Shape the Future of AI and Quantum Computing - IBM and the Massachusetts Institute of Technology today announced the launch of the MIT-IBM Computing Research Lab, advancing their long-standing collaboration to shape the next era of computing. The new lab expands its scope to include quantum computing, alongside foundational artificial intelligence...
Creating Agentic EDA Methodologies - Key takeaways Agentic methodologies need to be able to reason across multiple data formats and abstractions. It is not clear how much data from previous designs is useful in new designs. Standards may help, but the lack of them may only impact cost. The relationship between tools and methodologies is...
New 'Roadmap' highlights surface acoustic wave technologies - With the involvement of scientists from the Paul Drude Institute for Solid State Electronics in Berlin and the Universities of Augsburg and Münster, international researchers have presented a new roadmap for surface acoustic ...
New copper nanozyme shows powerful tumor suppression with high precision - Malignant tumor treatment remains a major challenge due to the limited precision and significant side effects. Copper-based single-atom nanozymes have shown promise for tumor microenvironment-responsive precision therapy, ...
Energy-Efficient Liquid Cooling for Advanced Semiconductor Packaging (KAIST) - A new technical paper, “Highly energy-efficient manifold microchannel for cooling electronics with a coefficient of performance over 100,000,” was published by researchers at KAIST. The study presents a CMOS-compatible manifold microchannel cooler that removes over 2,000 W/cm² using single-phase...
AI in Design Verification: Where It Works and Where It Doesn’t - AI streamlines verification by targeting repetitive tasks but can't replace expert signoff. The post AI in Design Verification: Where It Works and Where It Doesn’t appeared first on EE Times .
Transceivers boost in-vehicle audio bandwidth - ADI’s ADAA245x series of A2B 2.0 Automotive Audio Bus transceivers delivers 4x higher bus bandwidth than A2B 1.0 devices. The post Transceivers boost in-vehicle audio bandwidth appeared first on EDN .
Timing module enables vRAN synchronization - Microchip’s MD-990-0011-B M.2 plug-in timing module delivers precise synchronization for data center servers and 5G vRAN. The post Timing module enables vRAN synchronization appeared first on EDN .
SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026 - Corporation. "Overall, silicon wafer demand has improved, but the recovery is not uniform. Many device companies have noted improvements in the industrial semiconductor segment, and this is creating a more broad-based recovery as wafer inventory is absorbed. Weaker smartphone and PC shipments in the first...
Programmable artificial RNA condensates in mammalian cells - Modular RNA nanostar motifs spontaneously assemble into programmable synthetic condensates in the nucleus and cytoplasm, with RNA design controlling localization, sequence-specific target recruitment and orthogonal assembly.
BluGlass Quarter Report – March 2026 - The BluGlass Board and Management are pleased to provide the following update and Appendix 4C Quarterly Report for the three…
Cleaner Construction, Eco-EVs, and The Importance of Electrification - The electrification of transport has been a huge revolution in recent years, with the number of electric vehicles on the road increasing, alongside ramped up regulations for carbon emission reductions. This article covers electric construction vehicles, micro EVs, and drones
Latest issue of Semiconductor Today now available - For coverage of all the key business and technology developments in compound semiconductors and advanced silicon materials and devices over the last month
MIT Laser Breakthrough Lets Scientists Watch Drugs Enter the Brain in Real Time - MIT researchers found that chaotic laser light can transform into a precise, stable beam. This breakthrough enables much faster, high-resolution imaging of how drugs move into the brain. Researchers at MIT have identified an unexpected effect in optical physics that could lead to a new kind of bioimaging...
Athos Scraps Multi-Vendor Roadmap, Plans Chiplet Tape-Out - The startup has ditched multi-vendor chiplets for a powerful in-house design, promising safety, scalability, and aggressive pricing. The post Athos Scraps Multi-Vendor Roadmap, Plans Chiplet Tape-Out appeared first on EE Times .
Harvard Breakthrough Brings Powerful UV Light Sources Onto a Chip - Scientists have achieved a major step toward chip-scale ultraviolet light by converting red light into powerful UV within a tiny photonic device. Ultraviolet light, beyond what comes naturally from the sun, plays a central role in modern technology, including sterilization, biological imaging, and chip...
The Sustainability Report for 2025 has been published - At Okmetic, sustainability is part of how we run our business—well beyond what regulations require. It guides our day-to-day decisions related to our people, the environment and conducting business ethically. We work continuously to strengthen our role as a responsible employer and a trusted partner...
[News] MediaTek Reportedly Doubles 2026 AI ASIC Revenue Target to $2B, Aims 10–15% Market Share - Custom silicon from hyperscalers continues to gain traction, with MediaTek emerging as a key beneficiary of the accelerating shift. According to Liberty Times, citing CEO Rick Tsai, the company now expects its AI ASIC revenue contribution to double from earlier projections, rising from USD 1 billion......
Amkor advances data center CPU mass production amid manageable supply and cost risks - Amkor, the world's second-largest OSAT provider, recently held its earnings call where CEO Kevin Engel highlighted strong demand for AI and high-performance computing (HPC) chips driving robust orders for advanced packaging technologies like high-density fan-out (HDFO) and flip-chip. The company's HDFO...
Micron Announces Participation in Investor Event - BOISE, Idaho, April 29, 2026 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU) announced today that company executives will participate at the J.P. Morgan Global Technology, Media and Communications Conference in Boston, Massachusetts on Wednesday, May 20, at 6:40 a.m. Mountain time.
From Apprenticeship to Advancement: Quazi Ummehany’s Continued Growth at NY Creates - By the National Institute for Industry and Career Advancement (NIICA) and NY Creates Breaking into a high-tech field like semiconductor manufacturing often requires experience that can be difficult to get without already being in the industry. When Quazi Ummehany began her Registered Apprenticeship (RA),...
Rohm shrinks NFC charging for wearables - Rohm’s ML7670/ML7671 wireless chipset provides NFC charging for compact wearables such as smart rings and fitness trackers. The post Rohm shrinks NFC charging for wearables appeared first on EDN .
Dr. Cliff Hou and the TSMC N2 Process Technology - Before assuming his current position, Dr. Hou held several key leadership roles. He served as Vice President of Design and Technology Platform from 2011 to 2018, and later as Vice President of Technology Development starting in August 2018. Earlier in his career, from 1997 to 2007, he established TSMC’s...
Littelfuse expands range of high-voltage TVS diodes for automotive - Littelfuse is expanding its TP Series portfolio with devices specifically for automotive high-voltage power electronics applications. Specifically, it has added the TPSMC, TPSMD, and TP5.0SMDJ high-voltage transient voltage suppression (TVS) diode series. Example applications include battery disconnect...
SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026 - Corporation. "Overall, silicon wafer demand has improved, but the recovery is not uniform. Many device companies have noted improvements in the industrial semiconductor segment, and this is creating a more broad-based recovery as wafer inventory is absorbed. Weaker smartphone and PC shipments in the first...
Low-power image sensors for battery-powered compact devices - ST’s latest image sensors for always-on vision for compact devices operating on batteries or harvested energy – VD55G4 (monochrome) and VD65G4 (RGB colour) – part of the ST BrightSense portfolio – are available. The sensors combine a detect-and-wake architecture with a global-shutter optical format...
Digital isolators with integrated power - Skyworks has brought out the Si86Px family of digital isolators with integrated power, a compact solution that combines high‑performance digital isolation with an integrated isolated dc‑dc converter and matched miniature transformer. Designed for industrial and automotive electronics, the Si86Px simplifies...
Scientists Print Artificial Neurons That Can Talk to the Brain - Printed artificial neurons can now send lifelike signals that activate real brain cells. This breakthrough could transform both brain implants and energy-efficient AI. Engineers at Northwestern University have developed printed artificial neurons that go beyond simple imitation and can directly engage...
Celebrating Women’s History Month and HSC 65th in March - As March comes to a close, Hemlock Semiconductor reflects on a month of community impact, growth and celebration. In honor of Women’s History Month and International Women’s Day, we highlighted the incredible contributions of women across our company, showcasing the talent, leadership and innovation...
Commentary: Honor's robot win highlights thermal edge in robotics - The Beijing Humanoid Robot Half Marathon has concluded, but its outcome has ignited a wider industry debate. Rather than a leading robotics specialist, smartphone maker Honor emerged as the unexpected winner — raising questions over whether the company's success reflects genuine technological strength...
Dr. Y.J. Mii on TSMC Technology Leadership in 2026 - Dr. Y.J. Mii joined TSMC in 1994 as a manager at Fab 3 before moving into the company’s research and development organization in 2001. He was appointed Vice President of R&D in 2011 and later advanced to Senior Vice President in November 2016.
Amazon highlights US$50 billion chip potential and advances LEO satellite plans - On April 29, Amazon told investors on its first-quarter 2026 earnings call that AWS continued to accelerate, while the company doubled down on its custom chip business and pushed forward with plans for the Amazon low-Earth-orbit (LEO) satellite service, including the planned acquisition of Globalstar....
TSMC sells its Arm shares - TSMC has sold the last of its shares in Arm. The final sale of 1.1 million shares at $208 each netted $231 million. TSMC sold 850,000 Arm shares in 2024 at $119.47 each, raising about $102 million. At Arm’s public offering in 2023, TSMC agreed to invest up to $100 million in Arm shares. Various AI-related...
[News] World’s First AI Silicon Photonics Chip Listed Company Officially Goes Public - On April 28, Lightelligence—often described as the world’s first publicly listed AI silicon photonics chip listed company—debuted on the Hong Kong Stock Exchange. The company issued 13,795,215 shares at HKD 183.2 each, raising HKD 2.53 billion. Net proceeds came to HKD 2.38 billion after li...
Lattice Wins BIG 2026 AI Excellence Award - Lattice Semiconductor, the low power programmable leader, today announced it was named a 2026 AI Excellence Award winner by Business Intelligence Group.
Global Hydrocephalus Market is projected to reach USD 10.17 Billion by 2030 - Life Sciences, Consumer Goods, Materials & Chemicals, Construction & Manufacturing, Food & Beverages, Energy & Power, Semiconductor & Electronics, Automotive & Transportation, ICT & Media, Aerospace & Defense, and BFSI.We are in professional corporate relations
MCUs pair high flash capacity with security - The GD32F5HC series of 32-bit general-purpose MCUs from GigaDevice features a 200-MHz Arm Cortex-M33 core with DSP and FPU capabilities. The post MCUs pair high flash capacity with security appeared first on EDN .
Rectifiers combine low profile and high current - Vishay has released 16 single and dual FRED PT ultrafast rectifiers in low-profile DFN6546A packages with wettable flanks. The post Rectifiers combine low profile and high current appeared first on EDN .
Enabling Next-Generation AI Through Advanced Packaging and 3D Fabric Integration - The rapid rise of artificial intelligence is fundamentally reshaping computing architectures. As AI models scale toward trillions of parameters, traditional approaches to performance improvement are no longer sufficient. Instead, the industry is entering a new era where system-level innovation, advanced...
TSMC SoIC roadmap targets 2029 chip stacking - TSMC is pushing its 3D chip-stacking roadmap towards finer interconnect pitches and tighter integration as advanced packaging becomes a larger…
Levitated nano-ferromagnet confirms a 160-year-old physical prediction - Ferromagnets, such as iron, cobalt, and nickel, are materials with a strong, spontaneous, and permanent magnetic field. Over 150 years ago, the physicist and mathematician James Clerk Maxwell speculated that under specific ...
ΔVbe + DMM = Celsius, Kelvin, Fahrenheit, and Rankine thermometer - Combining an accurate temperature sensor with a standard digital multimeter can make an inexpensive, accurate, and useful thermometer. The post ΔVbe + DMM = Celsius, Kelvin, Fahrenheit, and Rankine thermometer appeared first on EDN .
BYD Blade Gen 2 - Improved Packing and Cell-to-Pack Ratio - As improvements to cell-level energy density have become slower to realize, automotive OEMs are increasingly turning to pack design as an avenue to increase vehicle range. This includes cell-to-pack and cell-to-body technologies, which require design changes at the cell level. BYD's recent Blade Gen 2...
Commentary: China's chip-model strategy pressures Nvidia's AI economics - The global AI industry is shifting into an inference cost war in 2026, with DeepSeek V4 accelerating changes across China's semiconductor supply chain. By positioning Huawei's Ascend chips as viable alternatives to Nvidia GPUs, DeepSeek reframes competition beyond software versus hardware. The shift cuts...
Wipeout Clone Runs Native on ESP32-S3 - Psygnosis’s 1995 game Wipeout is remembered for two things: being one of the greatest games of all time, and taking advantage of the then-new PlayStation’s capacity for 3D graphics. The ESP32-S3 …read more
