Chip Industry Week In Review - Intel's expansion; Cadence AI super agent for PCB, advanced packaging; photonics fab wars; earlier Yongin fab; German funding; new CHIPS Act award; HBM standard; Quadric funding; AMS acquisition; earnings; Rapidus teams up. The post Chip Industry Week In Review appeared first on Semiconductor Engineering...
[News] TSMC After Earnings Call: Foreign Brokerages See EUV-Driven CapEx Surge and 2027 Price Hikes - At TSMC’s earnings call yesterday, the foundry giant surprised the market by raising both its 2026 CapEx and full-year revenue growth outlook, even as it warned that the 2nm ramp-up and overseas expansion would weigh on gross margins. Following the updated guidance, foreign brokerages released fre......
PCIe 7 Switch IP with Time Division Multiplexing: Powering the Next Generation of AI Connectivity - PCI Express (PCIe), PCIe switches, Time Division Multiplexing (TDM), Network Interface Cards (NICs), and SmartNICs are all well-established technologies that have formed the backbone of computing and networking systems for years. More recently, SuperNICs have emerged as the next generation of networking...
TSMC Q2 revenue up 34% YoY; plans another $100bn investment in Arizona - TSMC today announced Q2 revenue of $40.20 billion, which increased 33.7% YoY and increased 12.0% from Q1 for a profit of $22 billion which was up 77% YoY and up 23.4% YoY. Gross margin for the quarter was 67.7%, operating margin was 60.3%, and net profit margin was 55.6% The company announced it would...
Co-Packaged Optics for Multi-Die Designs - CPO reduces electrical loss, improves energy efficiency and reach, and enables bandwidth densities that are increasingly difficult to achieve with copper alone. The post Co-Packaged Optics for Multi-Die Designs appeared first on Semiconductor Engineering .
[News] CXMT IPO Could Raise Up to RMB 66.6B; How Founder Zhu Yiming Built China’s DRAM Challenger - China's leading memory maker CXMT is set to list on Shanghai's STAR Market, drawing widespread market attention. The company has set its IPO price at RMB 8.66 per share and is scheduled to begin its online and offline share subscription on July 16. The company plans to issue 6.688 billion shares, r......
Qualcomm’s 2026 Investor Day Has Hidden Goodies - Qualcomm's 2026 investor Day had a lot of goodies, and a lot of questionable claims. Read more ▶ The post Qualcomm’s 2026 Investor Day Has Hidden Goodies appeared first on Semiaccurate .
Electronic Design Industry Rides Chip Wave, APAC Leads Q1 2026 Growth - Chip design tools are cashing in: Q1 EDA revenue hit $5.7B as APAC surged 17.7% and hyperscalers went DIY. The post Electronic Design Industry Rides Chip Wave, APAC Leads Q1 2026 Growth appeared first on EE Times .
Blog Review: July 15 - PCIe ATS verification; physical AI; adopting AI EDA; custom AMBA Viz plugins; V2G; fab construction workforce. The post Blog Review: July 15 appeared first on Semiconductor Engineering .
AI ignites 'ignored sector' for Japan chipmaker Kioxia - Robotic transporters carrying silicon wafers whizz by on overhead rails at a new factory that Kioxia, one of Japan's most valuable companies, hopes can help it meet overwhelming AI-driven demand.
Murata: Should you buy? - The world's #1 capacitor maker just became famous. That's exactly the problem. How a Kyoto ceramics house became the toll booth of the AI build-out and what does it mean for the stock price.
WST targets AI optical boom as high-power CW laser shipments begin in 4Q26 - Buoyed by robust shipments of optical communications products, Taiwanese optical communications company WaveSplitter Technologies (WST) nearly doubled its first-quarter revenue in 2026. Chairman and President Sheau Chen said surging AI computing demand will continue to drive the transition from 400G to...
TSMC Boosts 2026 Expansion Budget, Adds $100B to U.S. Investment - TSMC is raising its 2026 capital budget to $64 billion and adding $100 billion to its U.S. investment for AI. The post TSMC Boosts 2026 Expansion Budget, Adds $100B to U.S. Investment appeared first on EE Times .
Tracker: Global Wearables MICROvendor Market Share Q1 2026 - A huge number of second-tier MICROVENDORS are playing a meaningful role in the global wearables space, flooding the market with new, niche, and segmented offerings. Global wearables shipments grew by an impressive 12% in Q1 2026, after growth in the prior five quarters was preceded by eight consecutive...
Deterministic single-electron trapping on solid neon using engineered dielectric surface geometry - …ultra-clean, inert environment suppresses conventional decoherence pathways associated with lattice disorder, charge traps, and nuclear-spin baths that limit coherence in semiconductor qubits. Yet, uncontrolled surface features such as bumps, valleys, and electrode-defined gaps can bind electrons unintentionally,...
WAVE-P: Hardware Acceleration for the APV Professional Video Codec - Professional video workflows demand a difficult combination of image quality, editing responsiveness, high throughput, and manageable silicon cost. Chips&Media’s WAVE-P addresses that combination as a dedicated hardware IP core for the Advanced Professional Video, or APV, codec. Designed for professional...
India Adds Pieces to Strengthen Its Electronics Supply Chain Puzzle - India races to own more of its electronics value chain, from OSATs to PCBs, but imported materials still hold the leash. The post India Adds Pieces to Strengthen Its Electronics Supply Chain Puzzle appeared first on EE Times .
Micron Announces Participation in Investor Event - BOISE, Idaho, July 15, 2026 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU) announced today that company executives will participate at the KeyBanc Capital Markets Technology Leadership Forum in Deer Valley, Utah, on Monday, August 10, at 8:00 a.m.
Arteris at DAC 2026 Connecting Innovation for Silicon Success - The semiconductor industry has entered a new era as AI workloads, chiplets, heterogeneous computing, software-defined vehicles, and intelligent edge devices are transforming how chips are designed.
Spain Semiconductor Industry Convenes to Forge Domestic Alliances - AESEMI holds the first semiconductor MatchMaking day in Spain to forge new alliances and consolidate the ecosystem. The post Spain Semiconductor Industry Convenes to Forge Domestic Alliances appeared first on EE Times .
A ferroelectric-fluid motor may challenge magnetic-motor designs - It took 100 years to come to fruition, but this recently created fluid enables non-magnetic electrostatic-based motors. The post A ferroelectric-fluid motor may challenge magnetic-motor designs appeared first on EDN .
TSMC CoWoS versus Intel EMIB Semiconductor Packaging - There has been talk at the latest conferences about TSMC customers taking wafers to Intel for packaging. The question is why? Is it competitive pricing? Capacity? Supply chain diversity? CC Wei was asked about this during the last investor call and his perfect response was:
Component Price Landscape Q2 2026 - The Q2 2026 update to TechInsights’ semiconductor market forecast calls for topline semiconductor sales to skyrocket by 98% in 2026, another substantial increase from the 67% revenue growth projected in the Q1 version. Driving this growth are the ongoing AI boom, with datacenter demand for key products...
Aurora Group expands enterprise AI services with 12 workplace use cases - On July 15, Aurora Group expanded its enterprise AI push, unveiling 12 use cases through Aurora Cloud and GPI for companies looking to match AI tools with specific business problems. The rollout was organized around three themes - smart operations, smart security and sustainable governance - and was designed...
Scientists Overcome a Major Electrical Bottleneck in Next-Generation Semiconductors - One of the largest obstacles limiting the next generation of computer chips may finally have a solution. The shrinking of computer chips has exposed a stubborn problem: even when a semiconductor can carry electricity efficiently, getting that electricity into the material can waste power and slow the...
Micron Strengthens Automotive Ecosystem Supply Through Strategic Customer Agreements - Collaboration helps support the growing memory and storage demands of connected, smart vehicles BOISE, Idaho, July 16, 2026 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU) has completed Strategic Customer Agreements (SCAs) with key Tier 1 suppliers and ecosystem partners supporting the
AI Changes the Conversation: The Network-on-Chip Strikes Back - I bet you woke up this morning saying something like, “I wonder what the latest and greatest interconnect technologies are for System-on-Chip (SoC) devices and multi-die system (MDS) solutions.” Well, this is your lucky day because I’m about to reveal all. You’ve doubtless heard the popular saying,...
TYLsemi De-Risks Chiplets With New Business Model - Startup TYLsemi wants to address the gap between ASIC houses and design services, taking on the risk of developing large chiplet-based chips for AI infrastructure customers. The post TYLsemi De-Risks Chiplets With New Business Model appeared first on EE Times .
The Next Trillion-Dollar Chip Company - It might be simpler than you think. Etched, Fractile, MatX, Positron, Rebellions, SambaNova, Tensordyne, Tenstorrent, and more.
Microchip offers free MPLAB compilers, AI tools - MPLAB XC Pro Compilers and the MPLAB Machine Learning Development Suite from Microchip are now available at no cost The post Microchip offers free MPLAB compilers, AI tools appeared first on EDN .
Perforce Enabling Innovation Without Introducing Risk at DAC 2026 - Perforce delivers a DevOps Tech Stack for teams building and running high-stakes software systems and revenue-critical applications, where failure is not an option. As a trusted partner helping organizations govern software delivery for AI, Perforce solutions enforce guardrails across code quality, infrastructure,...
India approves $13 billion semiconductor plan - India approved a new semiconductor program Wednesday, offering more than $13 billion in financial assistance to accelerate local chip production as it seeks to become a global electronics powerhouse.
After Magdeburg, Intel Builds on Ireland’s Existing Strength - Leixlip cannot replace Magdeburg, but it shows the value of expanding where fabs, demand, and ecosystems already exist. The post After Magdeburg, Intel Builds on Ireland’s Existing Strength appeared first on EE Times .
The Big Five-Oh-Oh! - My first column on EEJournal, The Artificial Intelligence Apocalypse (Part 1) , was posted on September 19, 2019. That’s almost seven years ago as I pen these words. Things are moving so fast these days that I find it hard to wrap my brain around how much the technology landscape …
