MARKETS DASHBOARD—Beta testing this now. There are a lot of bugs to iron out, so if you see this note, please don't rely on the accuracy of this data. -lithos
Weebit Nano ReRAM Reaches Commercial Tape-Out Milestone - Weebit Nano has achieved a critical milestone in the commercialization of Resistive Random Access Memory (ReRAM) technology with the successful tape-out of two customer products integrating its embedded non-volatile memory IP. One of the products has already returned first silicon and demonstrated functional...
Lighter X-ray aprons could spare health care workers from chronic pain - A light, flexible polymer material developed at the University of Waterloo could replace the lead in heavy X-ray aprons, providing the same protection from harmful radiation while reducing their weight by almost 90%.
Ultrathin diamond layer boosts performance of high-power electronics - The silicon that forms the foundation of most computer chips has fundamental limits to how much power it can manage, which constrains the speed and energy-efficiency of wireless communication systems. A promising solution ...
From reactive to predictive: AI in industrial operations - AI in industrial operations isn’t a feature being added to the existing industrial software stack; it’s a structural change in how industrial assets are operated, maintained and improved.
Riding the Robotic Wave into the Future with IDTechEx - Robots take on a multitude of forms, each with technologies that make them best suited to their own specific environments, either working independently or in the company of humans. This article covers cobots, service robots, humanoids, drones, and in-vehicle AI assistants.
China launches prefabricated power hub to speed data centers, cut costs - China has launched what state media described as the world's first prefabricated computing-power hub, a modular power system designed to shorten data-center construction times and reduce land and infrastructure costs as demand for computing capacity rises.
Nidec debuts highest capacity in-rack cooling prototype - At Interop Tokyo 2026, Nidec will introduce a prototype in-rack CDU (coolant distribution unit) with a cooling capacity of up to 300kW. The CDU is designed to manage the thermal load in data centres. It can be installed inside server racks and detects and notifies operators of any thermal anomalies using...
CEO Kai Seikku: Rising demand and evolving supply dynamics in the wafer market - The silicon wafer market has gained momentum in early 2026, with strong demand in 300 mm and a recovery extending into the 200 mm segment. Worldwide silicon wafer shipments increased by 13% in Q1 compared to the previous year, according to SEMI Silicon Manufacturers Group. Okmetic is also seeing strengthening...
Nvidia-Microsoft AI PC alliance raises fears of South Korea being sidelined in next AI era - Nvidia and Microsoft have teamed up to launch RTX Spark, an AI PC superchip that could reshape personal computer architecture and intensify competition for AI leadership, according to South Korean media, including Edaily . The partnership is also raising concerns in South Korea about its role in the next...
Radiosondes: Disposable guardians of the sky - Radiosondes, precision tool for science and playground for exploration, continue to inspire both professionals and hobbyists. The post Radiosondes: Disposable guardians of the sky appeared first on EDN .
Brewer Science will be exhibiting and presenting at SEMICON Taiwan 2026. - Brewer Science will be exhibiting and presenting at SEMICON Taiwan 2026. SEMICON Taiwan September 2 – 4, 2026 Taipei, Taiwan Please visit Brewer Science at Booth I2316. Presentations Navigating the Patterning Landscape in the Era of AI-Driven Semiconductor Manufacturing Presented by Dr. Douglas Guerrero,...
Not smart, but solar: Analyzing another thermo-plus-hygrometer - Connectivity invariably comes with a price, literally and/or figuratively. Simple’s sometimes best, and ambient-light power’s also nice. The post Not smart, but solar: Analyzing another thermo-plus-hygrometer appeared first on EDN .
Chip Industry Technical Paper Roundup: June 8 - IGZO FeFET AI memories; zero-knowledge proof acceleration; Rowhammer in monolithic 3D eDRAM; monolayer TMD nanoribbon transistors; graph attention virtual metrology; selective-area III-V MBE; open-source DNN accelerators; ultra-low-power AI-MCUs for transformers. The post Chip Industry Technical Paper...
Embedded World Video: AMD on FPGA Innovation and AI at the Edge - We recently caught up with AMD’s Director of FPGA Solutions, Manuel Uhm, as part of our promotional coverage for Embedded World 2026. He discusses how FPGAs are enabling efficient AI at the edge through real-time processing, flexible architectures, and optimised DSP workloads. And the conversation also...
Pi Pico Puts Bluetooth Keyboards on the I2C Bus - If you’ve ever worked with I2C, you know its one of those things that makes working with modern microcontrollers such a pleasure. With a few wires and not many more …read more
