Advanced packaging focuses on CoWoS, 3D IC, and FOPLP at SEMICON Taiwan 2024 - A major focus of SEMICON Taiwan 2024 that concluded last week was advanced packaging, with CoWoS, 3D IC, and FOPLP being the leading technologies. CoWoS has caught more attention than the others from the equipment and materials vendors seeking to become part of the supply chain.
What is really going on with Intel’s 18a process? - Intel is in deep trouble, the 18a process is broken, and it is all down hill from here, right? Read more ▶ The post What is really going on with Intel’s 18a process? appeared first on SemiAccurate .
Hot Chips 2024: AI Hype Booms, But Can Nvidia’s Challengers Succeed? - You don’t know you’re at a peak until you start to descend, and Hot Chips 2024 is proof that AI hype is still climbing among semiconductor vendors. Juggernaut Nvidia, startups, hyperscalers, and major companies presented their AI accelerators (GPUs and neural-processing units—NPUs) and touched on...
WPC introduces Ki for the cordless kitchen - At this week’s IFA 2024 the WPC (Wireless Power Consortium) announced the next wireless power transfer standard, Ki (pronounced kee). At the consumer electronics show in Berlin, the consortium’s booth had demonstrations of prototype kitchen appliances powered wirelessly via Ki. The standard will wireless...
Hart becomes QPT motor drive and business advisor - Cambridge GaN power drive start-up QPT has recruited an advisor to its board: electric motor and business specialist Simon Hart, who “holds C-level roles at several technology companies”, according to QPT, and is entrepreneur in residence at the University of Nottingham. “Nothing excites me more...
Taiwanese Firms Form Silicon Photonics Alliance - Taipei, Sept. 3 – A coalition of over 30 leading companies, including Taiwan Semiconductor Manufacturing Co. (TSMC), announced the formation of the Silicon Photonics Industry Alliance (SiPhIA) at a launch event held during SEMICON Taiwan. The newly formed alliance, according to Hsu, will play a crucial...
NAND Flash Shipments Growth Slows in 2Q24, Revenue Up 14% Driven by AI SSD Demand, Says TrendForce - TrendForce reports that NAND Flash prices continued to rise in 2Q24 as server inventory adjustments neared completion and AI spurred demand for high-capacity storage products. However, high inventory levels among PC and smartphone buyers led to a 1% QoQ decline in NAND Flash bit shipments. Despite this,...
From Agile to Radical: systems engineering - Systems engineers need to focus on optimizing total lifetime value, maximizing the amount of functionality that can be updated post-deployment and applying the principles of architectonics.
Business will find a way - This is an overview of the Semiconductor tools market, embargoes, and other fun stuff. The embargoes trying to prevent China from getting access to leading-edge AI seem to have the opposite effect. This calls for even more draconian embargoes that still seem to have the opposite effect.
Taking Data Center Serviceability To The Next Level - How hyperscalers can successfully bring structural System Level Test to the data center. The post Taking Data Center Serviceability To The Next Level appeared first on Semiconductor Engineering .
Intel Core Ultra 7 265K CPU Tested In AIDA64, Good L1 & L3 Cache Performance But Slower L2 - Intel Core Ultra 7 265K CPU shows great improvements over predecessors in L1 & L3 cache speed but fails to impress with L2 cache. AIDA64 benchmark shows mixed results for Intel Core Ultra 7 265K In Memory & Cache Latency tests, probably due to early ES nature We have already seen several benchmarks of...
XPG Unveils LANCER NEON DDR5 Memory Modules, Up To 8,000 MT/s & Gorgeous Design - XPG has unveiled its newest "LANCER NEON" DDR5 memory modules, featuring top-notch performance and an elegant design. XPG's Latest DDR5 Memory Brings On Beauty & Performance In One Package, Offering A Great Option For Consumers [Press Release]: The world's leading brand for memory modules and flash memory...
RF front-end module targeted at wireless IoT devices - A Finish fabless firm teams up with a French ASIC service provider to produce an ultra-compact RF front-end module. The post RF front-end module targeted at wireless IoT devices appeared first on Planet Analog .
NVIDIA Boosts Llama 3.1 By 1.9x With Decoding Algorithm “Medusa” - NVIDIA's HGX H200 AI accelerators get a big boost in Llama 3.1 inferencing, with NVIDIA exclusive decoding algorithm "Medusa." NVIDIA Continues To Progress In The Realm Of Software Ecosystem, As It Achieves Further Performance Through Medusa [Press Release]: As large language models (LLMs) continue to...
Photonic sensing startup Senergetics seeks out corrosive piping - Startup Senergetics has developed a sensor system that can spot corrosion of industrial piping as it starts to happen, even if the pipes are buried under a thick layer of insulation. The potential for cost savings as well as CO2 emission reduction is huge.
Segger launches design service - Segger in Germany has launched a design service to help companies develop next-generation embedded products or reengineer existing ones tailored…
Ceva NPU Core Targets TinyML Workloads - Ceva’s NeuPro-Nano licensable neural processing unit (NPU) targets processors that run TinyML workloads, offering up to 200 billion operations per second (GOPS) for power-constrained edge IoT devices.
Expanding Possibilities with Ultra-Compact VCSEL* Photoreflectors - *Although VCSEL (Vertical Cavity Surface Emitting Laser) is conventionally used for communication, it is increasingly being adopted in recent years as a light source for optical blocks in sensing systems. Widely used as sensors in a...
Microsoft Sculpt Keyboard Lives Again with RP2040 - Hackaday readers are likely the kind of folks that have a favorite keyboard, so you can probably imagine how devastating it would be to find out that the board you’ve …read more
Intel denies reports of changes to Penang expansion plan - Reports suggest that Intel's expansion plan in Penang, Malaysia, has been "partially delayed," sparking public curiosity about its potential connection to Intel's global layoff plan. However, Intel has since refuted these claims, asserting that there will be no changes to the expansion plan and denying...
Chip Industry Technical Paper Roundup: Sept. 9 - ECTC metrology report; microfludic cooling; Fano resonance in Si Photonics; enhancing transport properties of polymers; cooling power electronics; LLMs with scalable chiplets; large-scale sub-5-m vertical transistors. The post Chip Industry Technical Paper Roundup: Sept. 9 appeared first on Semiconductor...
Samsung, TSMC team up on HBM4 DRAM - Samsung and TSMC are teaming up to produce a bufferless high bandwidth memory (HBM) DRAM, according to The Korea Economic…
