Examination Of Thermal Issues Related to Hybrid Bonding of 3D-Stacked HBM - A new technical paper titled “Thermal Issues Related to Hybrid Bonding of 3D-Stacked High Bandwidth Memory: A Comprehensive Review” was published by researchers at Chungbuk National University. Abstract “High-Bandwidth Memory (HBM) enables the bandwidth required by modern AI and high-performance...
RANsemi launches baseband board to accelerate O-RAN development - RANsemi, the Bristol wireless baseband processor developer, RANsemi has launched a fully integrated baseband board (pictured) designed to simplify and accelerate the development of 5G/4G Open RAN Radio Units (O-RUs). The board, designated RNS805-RU-BB, supports Split 7.2 architectures and all 5G FR1 bands...
Students gather for global drone competition - Students from the UK, Estonia, China, Italy, Netherlands, and Portugal gathered in Lincolnshire, UK, for an annual autonomous drone challenge. A record 32 universities took part in the final fly-off…
Three Methods For Improving Planarization For Diverse Layouts In Advanced Nodes (Fraunhofer IPMS) - A new technical paper titled “Reduced Topography After Stop on Nitride (SON) STI CMP Through Improved Post-Bulk Planarity for Diverse Layouts in Advanced Nodes” was published by researchers at Fraunhofer IPMS. Abstract “Three methods for improving planarization in a ceria free, two step STI CMP...
Nvidia To Resume H20 Shipments To China - Nvidia had previously written off $5.5-billion worth of inventory of the H20, its China-specific SKU The post Nvidia To Resume H20 Shipments To China appeared first on EE Times .
Pulling at Threads With the Flipper Zero - Gone are the days when all smart devices were required an internet uplink. The WiFi-enabled IoT fad, while still upon us (no, my coffee scale doesn’t need to be on …read more
Build automatic transfer switch (ATS) with simple analog electronics - ATS is a piece of hardware that automatically shifts the electrical load from primary power supply to a backup or standby source. The post Build automatic transfer switch (ATS) with simple analog electronics appeared first on Planet Analog .
Urgent Check on Glass Fiber - As the production of GPUs for AI (Artificial Intelligence) servers explodes, concerns over the supply and demand of glass fiber, a key material for package substrates, are rising.
Nvidia’s CPU dreams hit another delay - The gift that is Nvidia's CPU soap opera just keeps on giving. Read more ▶ The post Nvidia’s CPU dreams hit another delay appeared first on Semiaccurate .
First electronic–photonic quantum chip created in commercial foundry - In a milestone for scalable quantum technologies, scientists from Boston University, UC Berkeley, and Northwestern University have reported the world's first electronic–photonic–quantum system on a chip, according to ...
Keysight sees AI chip boom driving verification market growth - Keysight Technologies expects AI and 6G networks to fuel structural growth in the semiconductor verification market that will outpace industry capital expenditure increases, according to a senior executive.
A Quick Look at Agentic/Generative AI in Software Engineering - Agentic methods are hot right now since single LLM models seem limited to point tool applications. Each such application is impressive but still a single step in the more complex chain of reasoning tasks we want to automate, where agentic methods should shine. I have been hearing that software engineering...
Yageo again extends Shibaura tender deadline ahead of crucial Taiwan talks - Yageo has extended the deadline for its tender offer to acquire Japan's Shibaura Electronics for a fifth time, citing ongoing regulatory review under Japan's Foreign Exchange and Foreign Trade Act. The Taiwan-based passive components giant now expects to complete the share acquisition by August 1, 2025,...
[Blog] Doubling the Possibilities: Lattice Expands Small FPGA Portfolio - Designing modern embedded systems often means working within tight constraints such as limited space, low power budgets, and increasing performance demands. Whether it's powering smarter factory automation, enhancing in-vehicle intelligence, or enabling low power AI at the edge, developers need flexible,...
Building Upward: PECVD’s Vital Role in Next-Gen 3D Memory Packaging Technologies - Plasma-enhanced chemical vapor deposition (PECVD) is one of the fundamental building blocks for manufacturing ICs. From building the transistor to metallization, the PECVD process has applications critical for microelectronics manufacturing. PECVD allows to create a desired reactive gas plasma to deposit...
New Report: Quantum Computing Market 2026-2046 - Quantum computing promises a revolution in computational capabilities. This accessible quantum computing market report evaluates key technologies, companies, drivers for growth and adoption barriers across this emerging industry. Multiple competing quantum computer technologies are assessed: superconducting,...
Data Center CPU Dominance Is Shifting To AMD And Arm - Opinion: AMD is close to surpassing Intel in x86, but Arm thinks it can take the lead over x86. The post Data Center CPU Dominance Is Shifting To AMD And Arm appeared first on Semiconductor Engineering .
Silicon IP Revenue Spikes - Increases coincide with growth in heterogeneous assemblies for AI and complex designs; China sales flounder. The post Silicon IP Revenue Spikes appeared first on Semiconductor Engineering .
Perforce at DAC, Unifying Software and Silicon Across the Ecosystem - As the new name reflects, chip and system design were a major focus at DAC. So was the role of AI to enable those activities. But getting an AI-enabled design flow to work effectively across chip, subsystem and system-level design presents many significant challenges. One important one is effectively...
From Circuits to Scale: Intel’s Path to Exascale - As the Aurora Supercomputer reaches its ceremonial opening, three of Intel's team members reflect on the unique scope and challenges of the project.
JS Foundry files for bankruptcy - Yesterday the Japanese foundry JS Foundry filed for bankruptcy with the Tokyo District Court. The filing followed the collapse of talks with other companies to co-operate on SiC technology. In 2023, JS Foundry’s first year of operation, it had revenues of $68 million, but last year revenues were $17.6...
Growing Challenge of Radar Interference in Autonomous Vehicles - The growing sensor number in cars is giving rise to an emerging challenge that has largely gone unnoticed: radar interference. The post Growing Challenge of Radar Interference in Autonomous Vehicles appeared first on EE Times .
Fortec Elektronik to buy professional monitor maker Nottrot - Fortec Elektronik is to buy Netherlands professional monitor company Nottrot for “the single-digit millions range”, said Fortec, which signed the purchase contract today. Nottrot makes monitors for maritime, military and industrial use. “With this step, Fortec is reinforcing its strategic market...
These Sharks Don’t Just Glow Blue – They Use Nanotech to Shift Color Underwater - Blue sharks shimmer with one of nature’s rarest colors, but their glow isn’t just for show — it’s built from microscopic crystals and pigments hidden in their skin. Scientists have discovered that the shark’s tooth-like skin scales house guanine platelets and melanin vesicles that work together...
Why debugging has become more challenging - Getting a modern electronic circuit to start up is often hampered by its complex design arrangement. The post Why debugging has become more challenging appeared first on Planet Analog .
Startup Funding: Q2 2025 - Investors were drawn to a wide range of innovative approaches in Q2 2025, backing startups developing superconducting logic, chips for an emerging number format, big data processors, and novel power semi architectures. At the same time, photonics continues to draw investment dollars due to its ability...
Beneq Secures Repeat Orders as ALD Gains Ground in MicroLED Display Market - Espoo, Finland, 14 July 2025 – Beneq, a global leader in Atomic Layer Deposition (ALD) technology, has announced significant momentum in the microLED display sector, marked by repeat orders from leading tech innovators. The development highlights the growing demand for advanced manufacturing tools capable...
Cognichip: Using AI To Speed Complex Chip Design - Closing the gap between increased complexity and accelerating software innovation. The post Cognichip: Using AI To Speed Complex Chip Design appeared first on Semiconductor Engineering .
Physics-Based ASICs (Normal Computing et al.) - A new technical paper titled “Solving the compute crisis with physics-based ASICs” was published by researchers at Normal Computing Corporation, ARIA, UC Santa Barbara, University of Pennsylvania, Santa Fe Institute, Cornell University. Advanced Research Projects Agency – Energy and Yale University....
Justem to develop hybrid bonding kit for HBM - Fab equipment maker Justem is planning to develop a hybrid bonding equipment for use in future high-bandwidth memory (HBM), TheElec has learned.The company has been selected to lead a 14 billion won project, with 7.5 billion won directly from the government, by the Ministry of Trade, Industry and En
The Chip Insider®– A Tribute to Barry Rapozo - An industry sales legend is gone: Barry Rapozo passed on June 22, 2025, at the age of 80. Barry's career spanned many of the semiconductor equipment industry's icons, including IMS, GCA, KLA, and TEL, where he was instrumental in their growth and, in some cases, lack of it after he left
Software Follow Up - Let's refine the thesis. Sorry guys, the net cope means I'm probably going to be right.
TSMC in crosshairs: tariffs, currency, and AI growth at stake - As TSMC prepares to deliver its earnings report on July 17, all eyes are on how the world's largest contract chipmaker will navigate what analysts are calling a "triple threat" — escalating tariff pressures, rising chip duties, and the surging New Taiwan dollar. Together, these factors present a...
Noctua NH-P1 Review: For those who demand silence - Noctua’s NH-P1 is a fanless CPU cooler that performs well. We’ve tested it with Intel’s i9-13900K, i7-14700K, AMD’s Ryzen 7 7700x, and Ryzen 9 9950X3D.
A chaos-modulated metasurface for physical-layer secure communications - With so many people using devices that can be connected to the internet, reliably securing wireless communications and protecting the data they are exchanging is of growing importance. While computer scientists have devised ...
Under Trump tariff pressure, ASML relies on TSMC while Intel and Samsung struggle - Dutch lithography equipment giant ASML announced it will release its second quarter 2025 earnings report at 2 pm Taiwan time on July 16, one day ahead of TSMC. A major concern for ASML executives is the potential repeat of the nightmare experienced in the first quarter of 2025 when TSMC delayed orders,...
Double SoC prototyping performance with S2C’s VP1902-based S8-100 - As AI, HPC, and networking applications demand ever-higher compute and bandwidth, SoC complexity continues to grow. Traditional 50M ASIC equivalent gate FPGA prototyping systems have become less effective for full-chip verification at scale. Addressing this challenge, S2C introduced the Prodigy S8-100...
Why ASIC Design Makes Sense for LLM-On-Device - An ASIC approach enables to achieve a hardware-efficient implementation of LLMs through custom design, resulting in lower power and cost. The post Why ASIC Design Makes Sense for LLM-On-Device appeared first on EE Times .
Episode 37.5: Peak Software w. MechaDylan - Episode 37.5: Peak Software w. MechaDylan Dylan is sick so this is not an official Transistor Radio episode. But MechaDylan does make an appearance.
Kioxia, YMTC jump ahead with wafer-bonded NAND in volume production - Kioxia and YMTC are pioneering the use of wafer bonding technologies— CMOS directly Bonded to Array (CBA) and Xtacking, respectively — for next-generation NAND flash memory production. This strategic shift moves the industry beyond the traditional race to increase memory cell layer counts,...
